Patents by Inventor Min-Hsun Hsieh

Min-Hsun Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200313051
    Abstract: The disclosure discloses an optoelectronic element comprising: an optoelectronic unit comprising a first metal layer, a second metal layer, and an outermost lateral surface; an insulating layer having a first portion overlapping the optoelectronic unit and extending beyond the lateral surface, and a second portion separated from the first portion in a cross-sectional view; and a first conductive layer formed on the insulating layer.
    Type: Application
    Filed: June 12, 2020
    Publication date: October 1, 2020
    Inventors: Cheng-Nan HAN, Tsung-Xian LEE, Min-Hsun HSIEH, Hung-Hsuan CHEN, Hsin-Mao LIU, Hsing-Chao CHEN, Ching-San TAO, Chih-Peng NI, Tzer- Perng CHEN, Jen-Chau WU
  • Publication number: 20200295225
    Abstract: A method of processing light-emitting elements includes: transferring a plurality of light-emitting elements from original wafers or next-stage carriers, based on a predetermined pattern. The predetermined pattern arranges two adjacent LED groups in a first direction on the original wafer or carriers to be placed on two non-adjacent positions in the first direction on the next-stage carriers. The light-emitting elements on the original wafer have a horizontal wafer pitch and a vertical wafer pitch. The light-emitting elements on each of the next-stage carriers have a first horizontal pitch and a first vertical pitch. The first horizontal pitch is greater than the horizontal wafer pitch, or the first vertical pitch is greater than the vertical wafer pitch. Besides, a light-emitting element device using the aforementioned method is also provided.
    Type: Application
    Filed: March 13, 2020
    Publication date: September 17, 2020
    Applicant: EPISTAR CORPORATION
    Inventors: Min-Hsun HSIEH, Chang-Lin LEE
  • Publication number: 20200274041
    Abstract: This invention discloses a light emitting semiconductor device including a light-emitting structure and an external optical element. The optical element couples to the light-emitting structure circumferentially. In addition, the refractive index of the external optical element is greater than or about the same as that of a transparent substrate of the light-emitting structure, or in-between that of the transparent substrate and the encapsulant material.
    Type: Application
    Filed: March 2, 2020
    Publication date: August 27, 2020
    Inventor: Min-Hsun HSIEH
  • Patent number: 10756067
    Abstract: The present application discloses a light-emitting device including a first support structure having a first surface, a plurality of light-emitting elements arranged on the first surface, and a first adhesive layer arranged on the first support structure. Each light-emitting element has a side wall, a bottom surface, a first electrode pad, and a second electrode pad arranged on the bottom surface. The first adhesive layer surrounds the side wall and does not directly contact the bottom surface. The first support structure includes a plurality of through holes located on positions corresponding to the first electrode pad and the second electrode pad.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: August 25, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Jui-Hsien Chang, Been-Yu Liaw, Cheng-Nan Han, Min-Hsun Hsieh
  • Publication number: 20200266177
    Abstract: A light-emitting device includes a light-emitting element having a first-type semiconductor layer, a second-type semiconductor layer, an active stack between the first-type semiconductor layer and the second-type semiconductor layer, a bottom surface, and a top surface. A first electrode is disposed on the bottom surface and electrically connected to the first-type semiconductor layer. A second electrode is disposed on the bottom surface and electrically connected to the second-type semiconductor layer. A supporting structure is disposed on the top surface. The supporting structure has a thickness and a maximum width. A ratio of the maximum width to the thickness is of 2˜150.
    Type: Application
    Filed: May 4, 2020
    Publication date: August 20, 2020
    Inventors: Min-Hsun HSIEH, Hsin-Mao LIU, Ying-Yang SU
  • Publication number: 20200259054
    Abstract: The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 13, 2020
    Inventors: Min-Hsun HSIEH, Jai-Tai KUO, Wei-Kang CHENG
  • Publication number: 20200243737
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Application
    Filed: January 22, 2020
    Publication date: July 30, 2020
    Applicant: EPISTAR CORPORATION
    Inventors: Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
  • Publication number: 20200243478
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Application
    Filed: August 27, 2019
    Publication date: July 30, 2020
    Applicant: EPISTAR CORPORATION
    Inventors: Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
  • Patent number: 10720414
    Abstract: A light bulb includes a base, a filament coupled to the base and a cover covering the filament. The filament includes a transparent structure, optoelectronic units arranged on the transparent structure in sequence, each including a side surface, a first and second bonding pad formed on a top side of one of the optoelectronic units, a third and fourth bonding pad formed on a top side of another optoelectronic unit, conductive elements, one of the conductive elements including a bottom surface directly connecting the first and third bonding pads without covering the side surfaces of the one and the another of the optoelectronic units, and a top surface opposite to the bottom surface, the transparent structure continuously covering the optoelectronic units and the conductive elements without directly contacting the top surfaces of the conductive elements, first and seconds terminal electrically connected to the optoelectronic units.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: July 21, 2020
    Assignee: EPISTAR CORPORATION
    Inventor: Min Hsun Hsieh
  • Publication number: 20200227591
    Abstract: The present disclosure provides a light-emitting apparatus comprising a board having a plurality of first metal contacts and a plurality of second metal contacts on a top surface; a plurality of LEDs being bonded to the board, the each of the LEDs comprising a first cladding layer on the substrate, an active layer on the first cladding layer, a second cladding layer on the active layer, an upper surface on the second cladding layer, a first metal layer, and a second metal layer, wherein the first metal layer and the second metal layer are between the active layer and the board; an opaque layer between the adjacent LEDs and comprising a polymer mixed with a plurality of inorganic particles; and an encapsulating layer on the upper surfaces and opposite to the board, wherein the encapsulating layer does not cover a side wall of the active layer; and an underfill material between the board and the plurality of LEDs, wherein the underfill material surrounds each of the first metal layer and the second metal layer.
    Type: Application
    Filed: March 24, 2020
    Publication date: July 16, 2020
    Inventors: Min-Hsun HSIEH, Tzer-Perng CHEN, Jen-Chau WU, Yuh-Ren SHIEH, Chuan-Cheng TU
  • Publication number: 20200227371
    Abstract: A light-emitting module includes a common carrier; a plurality of semiconductor devices formed on the common carrier, and each of the plurality of semiconductor devices including three semiconductor dies; a carrier including a connecting surface; a third bonding pad and a fourth bonding pad formed on the connecting surface; and a connecting layer. One of the three semiconductor dies includes a stacking structure; a first bonding pad; and a second bonding pad with a shortest distance less than 150 microns between the first bonding pad. The connecting layer includes a first conductive part including a first conductive material having a first shape; and a blocking part covering the first conductive part and including a second conductive material having a second shape with a diameter in a cross-sectional view. The first shape has a height greater than the diameter.
    Type: Application
    Filed: March 31, 2020
    Publication date: July 16, 2020
    Inventors: Shih-An LIAO, Shau-Yi CHEN, Ming-Chi HSU, Chun-Hung LIU, Min-Hsun HSIEH
  • Patent number: 10714666
    Abstract: A light-emitting device includes a light body having an internal electrode layer, and a conductive layer. The conductive layer has a first portion formed on the internal electrode layer and overlapping the light body in a first direction, and a second portion overlapping the light body in a second direction. The first direction is perpendicular to the second direction.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: July 14, 2020
    Assignee: Epistar Corporation
    Inventors: Lung-Kuan Lai, Ching-Tai Cheng, Yih-Hua Renn, Min-Hsun Hsieh, Chun-Hung Liu, Shih-An Liao, Ming-Chi Hsu, Yu Chen Liao
  • Publication number: 20200220061
    Abstract: A light-emitting device includes a heat-dissipating structure having a first part and a second part separated from the first part; a light-emitting unit including a light-emitting element with a first pad formed on the first part; and a first transparent enclosing the light-emitting element and having a sidewall; and an adhesive material covering a portion of the sidewall.
    Type: Application
    Filed: March 16, 2020
    Publication date: July 9, 2020
    Inventors: Min-Hsun HSIEH, Biing-Jye LEE, Yih-Hua RENN, Jai-Tai KUO
  • Publication number: 20200197719
    Abstract: A light-emitting module includes a housing, a flexible film, and a protection portion. The housing includes a plurality of light-emitting units arranged in a matrix configuration and at least a switch electrically connected to at least one of the plurality of light-emitting units. The flexible film is detachably coupled to the housing. The protection portion covers the plurality of light-emitting units.
    Type: Application
    Filed: February 27, 2020
    Publication date: June 25, 2020
    Inventors: Min-Hsun HSIEH, Jai-Tai KUO, Chang-Hseih WU, Tzu-Hsiang WANG, Chi-Chih PU
  • Patent number: 10686106
    Abstract: The disclosure discloses an optoelectronic element comprising: an optoelectronic unit comprising a first metal layer, a second metal layer, and an outermost lateral surface; an insulating layer having a first portion overlapping the optoelectronic unit and extending beyond the lateral surface, and a second portion separated from the first portion in a cross-sectional view; and a first conductive layer formed on the insulating layer.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: June 16, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Cheng-Nan Han, Tsung-Xian Lee, Min-Hsun Hsieh, Hung-Hsuan Chen, Hsin-Mao Liu, Hsing-Chao Chen, Ching-San Tao, Chih-Peng Ni, Tzer-Perng Chen, Jen-Chau Wu
  • Publication number: 20200185362
    Abstract: A light bulb includes a base, a filament coupled to the base and a cover covering the filament. The filament includes a transparent structure, optoelectronic units arranged on the transparent structure in sequence, each including a side surface, a first and second bonding pad formed on a top side of one of the optoelectronic units, a third and fourth bonding pad formed on a top side of another optoelectronic unit, conductive elements, one of the conductive elements including a bottom surface directly connecting the first and third bonding pads without covering the side surfaces of the one and the another of the optoelectronic units, and a top surface opposite to the bottom surface, the transparent structure continuously covering the optoelectronic units and the conductive elements without directly contacting the top surfaces of the conductive elements, first and seconds terminal electrically connected to the optoelectronic units.
    Type: Application
    Filed: February 19, 2020
    Publication date: June 11, 2020
    Inventor: Min Hsun HSIEH
  • Patent number: 10680140
    Abstract: A light-emitting device comprises a transparent substrate, an LED die on the transparent substrate, a second substrate on the LED die, and two electrode pins located between the transparent substrate and the second substrate. The LED die comprises a first surface, a second surface opposite to the first surface, and two electrodes located on the first surface, wherein the LED die is enclosed by the transparent substrate and the second substrate, and the two electrodes of the LED die respectively connect to the two electrode pins without a wire bonding process. Each of the two electrode pins comprises a first end and a second end opposite to the first end, and the first end is sandwiched by the LED die and the second substrate, and the second end extends out of the transparent substrate and the second substrate; wherein the first surface comprises a side and the two electrode pins extend in parallel from the side of the LED die toward a same direction away from the side.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: June 9, 2020
    Assignee: EPISTAR CORPORATION
    Inventor: Min-Hsun Hsieh
  • Publication number: 20200144077
    Abstract: An applying method includes the following steps. Firstly, a conductive adhesive including a plurality of conductive particles and an insulating binder is provided. Then, a carrier plate is provided. Then, a patterned adhesive is formed on the carrier plate by the conductive adhesive, wherein the patterned adhesive includes a first transferring portion. Then, a manufacturing device including a needle is provided. Then, the needle of the manufacturing device is moved to contact the first transferring portion. Then, the transferring portion is transferred to a board by the manufacturing device.
    Type: Application
    Filed: November 7, 2018
    Publication date: May 7, 2020
    Inventor: Min-Hsun HSIEH
  • Patent number: 10643980
    Abstract: A light-emitting device includes a light-emitting element, a supporting structure, a first wavelength conversion structure, and a light-absorbing layer. The light-emitting element includes a plurality of active stacks separated from each other, a first-type semiconductor layer continuously arranged on the plurality of active stacks, and a plurality of second-type semiconductor layers under the plurality of active stacks. The supporting structure is disposed on the light-emitting element and includes a first opening. The first wavelength conversion structure disposed in the first opening. The light-absorbing layer disposed on the top surface of the supporting structure.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: May 5, 2020
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Hsin-Mao Liu, Ying-Yang Su
  • Patent number: D894851
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: September 1, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Tzu-Hsiang Wang, Chi-Chih Pu, Ya-Wen Lin