Patents by Inventor Min-Hsun Hsieh

Min-Hsun Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11870022
    Abstract: A package includes a substrate, a first light-emitting unit, a second light-emitting unit, a light-transmitting layer, and a light-absorbing layer. The substrate has a first surface and an upper conductive layer on the first surface. The first light-emitting unit and the second light-emitting unit are disposed on the upper conductive layer. The first light-emitting unit has a first light-emitting surface and a first side wall. The second light-emitting unit has a second light-emitting surface and a second side wall. The light-transmitting layer is disposed on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit. The light-absorbing layer is disposed between the substrate and the light-transmitting layer, covers the upper conductive layer, the first side wall, and the second side wall, and exposes the first light-emitting surface and the second light-emitting surface.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: January 9, 2024
    Assignees: EPISTAR CORPORATION, YENRICH TECHNOLOGY CORPORATION
    Inventors: Shau-Yi Chen, Tzu-Yuan Lin, Wei-Chiang Hu, Pei-Hsuan Lan, Min-Hsun Hsieh
  • Publication number: 20230420484
    Abstract: A light-emitting module including a first optoelectronic unit having a first electrode pad and a second electrode pad, a second optoelectronic unit having a third electrode pad and a fourth electrode pad, a first supporting structure enclosing the first optoelectronic unit and the second optoelectronic unit, a first pin overlapping and confronted with both of the first electrode pad and the third electrode pad, a second pin overlapping the second electrode pad and the first supporting structure, and a third pin overlapping the fourth electrode pad and physically separated from the second pin.
    Type: Application
    Filed: September 12, 2023
    Publication date: December 28, 2023
    Inventors: Min Hsun HSIEH, Hsin-Mao LIU
  • Publication number: 20230395562
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Application
    Filed: August 15, 2023
    Publication date: December 7, 2023
    Applicant: EPISTAR CORPORATION
    Inventors: Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
  • Patent number: 11817433
    Abstract: An embodiment of present invention discloses a light-emitting device which includes a first light-emitting area, a second light-emitting area, and a third light-emitting area. The first light-emitting area emits a red light and includes a first light-emitting unit. The second light-emitting area emits a blue light and includes a second light-emitting unit. The third light-emitting area emits a green light and includes a third light-emitting unit. The first light-emitting area is larger than the second light-emitting area and larger than the third light-emitting area. Each of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit has a width of less than 100 ?m and a length of less than 100 ?m.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: November 14, 2023
    Assignee: EPISTAR CORPORATION
    Inventor: Min-Hsun Hsieh
  • Publication number: 20230335695
    Abstract: A light-emitting device includes a light-emitting element having a first-type semiconductor layer, a second-type semiconductor layer, an active stack between the first-type semiconductor layer and the second-type semiconductor layer, a bottom surface, and a top surface. A first electrode is disposed on the bottom surface and electrically connected to the first-type semiconductor layer. A second electrode is disposed on the bottom surface and electrically connected to the second-type semiconductor layer. A supporting structure is disposed on the top surface. The supporting structure has a thickness and a maximum width. A ratio of the maximum width to the thickness is of 2-150.
    Type: Application
    Filed: June 21, 2023
    Publication date: October 19, 2023
    Inventors: Min-Hsun HSIEH, Hsin-Mao LIU, Ying-Yang SU
  • Patent number: 11791370
    Abstract: This disclosure discloses a light-emitting display module display. The light-emitting display module comprises: a board; and a plurality of light-emitting diode modules arranged in an array configuration on the board; wherein one of the light-emitting diode modules comprises a plurality of encapsulated light-emitting units spaced apart from each other; and one of the encapsulated light-emitting units comprises a plurality of optoelectronic units, a first supporting, and a fence; and wherein the plurality of optoelectronic units are covered by the first supporting structure, and the fence surrounds the first supporting structure and the plurality of optoelectronic units.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: October 17, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Min Hsun Hsieh, Hsin-Mao Liu
  • Patent number: 11777052
    Abstract: A method of repairing a light emitting device, comprises: providing a light emitting device comprising a carrier board and a first light emitting unit; destroying the first light emitting unit and forming a removal surface on the light emitting device; planarizing the removal surface; providing a bonding structure on the removal surface; and fixing a second light emitting unit on the planarized removal surface through the bonding material.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: October 3, 2023
    Assignee: EPISTAR CORPORATION
    Inventor: Min-Hsun Hsieh
  • Publication number: 20230274962
    Abstract: A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring photoelectric characteristic values of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion chips comprise parts of the plurality of chips which photoelectric characteristic value falls within an unqualified range; removing the second portion chips from the first load-bearing structure; dividing the first portion chips into a plurality of blocks according to the photoelectric characteristic values, and each of the plurality of blocks comprising multiple chips of the first portion chips; and transferring the multiple chips of one of the plurality of blocks to a second load-bearing structure.
    Type: Application
    Filed: May 4, 2023
    Publication date: August 31, 2023
    Inventors: Min-Hsun HSIEH, De-Shan KUO, Chang-Lin LEE, Jhih-Yong YANG
  • Patent number: 11728310
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: August 15, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Shih-An Liao, Ying-Yang Su, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu
  • Patent number: 11710812
    Abstract: A light-emitting device includes a light-emitting element having a first-type semiconductor layer, a second-type semiconductor layer, an active stack between the first-type semiconductor layer and the second-type semiconductor layer, a bottom surface, and a top surface. A first electrode is disposed on the bottom surface and electrically connected to the first-type semiconductor layer. A second electrode is disposed on the bottom surface and electrically connected to the second-type semiconductor layer. A supporting structure is disposed on the top surface. The supporting structure has a thickness and a maximum width. A ratio of the maximum width to the thickness is of 2˜150.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: July 25, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Hsin-Mao Liu, Ying-Yang Su
  • Publication number: 20230231098
    Abstract: A light-emitting device includes a carrier, a light-emitting element and a connection structure. The carrier includes a first electrical conduction portion. The light-emitting element includes a first light-emitting layer capable of emitting first light and a first contact electrode formed under the light-emitting layer. The first contact electrode is corresponded to the first electrical conduction portion. The connection structure includes a first electrical connection portion and a protective portion surrounding the first contact electrode and the first electrical connection portion. The first electrical connection portion includes an upper portion, a lower portion and a neck portion arranged between the upper portion and the lower portion. An edge of the upper portion is protruded beyond the neck portion, and an edge of the lower portion is protruded beyond the upper portion.
    Type: Application
    Filed: February 27, 2023
    Publication date: July 20, 2023
    Inventors: Min-Hsun Hsieh, Shau-Yi Chen, Shao-You Deng
  • Publication number: 20230207540
    Abstract: A light-emitting device includes a circuit carrier board having a short side and a long side, a plurality of light-emitting units on the circuit carrier board for emitting three or more color lights, and a light-transmitting glue layer on the circuit carrier board and covering the plurality of light-emitting units. The short side is shorter than the long side. The plurality of light-emitting units include a first light-emitting unit. The first light-emitting unit has a light exit surface, a first sidewall, and a second sidewall. The first sidewall faces the short side and has a first included angle with the light exit surface, and the second sidewall faces the long side and has a second included angle with the light exit surface. The first included angle is between 85 to 95 degrees, and the second included angle is less than 85 degrees or greater than 105 degrees.
    Type: Application
    Filed: December 15, 2022
    Publication date: June 29, 2023
    Inventors: Min-Hsun HSIEH, Hsin-Mao LIU, Tzu-Hsiang WANG, Ya-Wen LIN, Chi-Chih PU, Hsiao-Pei CHIU, Ching-Tai CHENG, Chong-Yu WANG
  • Publication number: 20230207769
    Abstract: A light-emitting device includes a carrier, a light-emitting element and a connection structure. The carrier includes a first electrical conduction portion. The light-emitting element includes a first light-emitting layer capable of emitting first light and a first contact electrode formed under the light-emitting layer. The first contact electrode is corresponded to the first electrical conduction portion. The connection structure includes a first electrical connection portion and a protective portion surrounding the first contact electrode and the first electrical connection portion. The first electrical connection portion includes an upper portion, a lower portion and a neck portion arranged between the upper portion and the lower portion. An edge of the upper portion is protruded beyond the neck portion, and an edge of the lower portion is protruded beyond the upper portion.
    Type: Application
    Filed: February 27, 2023
    Publication date: June 29, 2023
    Inventors: Min-Hsun Hsieh, Shau-Yi Chen, Shao-You Deng
  • Publication number: 20230187597
    Abstract: This disclosure discloses a method of manufacturing a light-emitting device includes steps of providing a first substrate with a plurality of first light-emitting elements and adhesive units arranged thereon, providing a second substrate with a first group of second light-emitting elements and a second group of second light-emitting elements arranged thereon, and connecting the a second group of second light-emitting elements and the adhesive units. The first light-emitting elements and the first group of second light-emitting elements arc partially or wholly overlapped with each other during connecting the second group of second light-emitting elements and the adhesive units.
    Type: Application
    Filed: February 6, 2023
    Publication date: June 15, 2023
    Applicant: EPISTAR CORPORATION
    Inventor: Min-Hsun HSIEH
  • Patent number: 11658052
    Abstract: A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring a photoelectric characteristic value of each of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic value of each of the plurality of chips; providing a second load-bearing structure; weakening a first adhesion between the first portion chips and the first load-bearing structure or between the second portion chips and the first load-bearing structure; and transferring the first portion chips or the second portion chips to the second load-bearing structure.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: May 23, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, De-Shan Kuo, Chang-Lin Lee, Jhih-Yong Yang
  • Patent number: 11641010
    Abstract: A light-emitting device includes a carrier, a light-emitting element and a connection structure. The carrier includes a first electrical conduction portion. The light-emitting element includes a first light-emitting layer capable of emitting first light and a first contact electrode formed under the light-emitting layer. The first contact electrode is corresponded to the first electrical conduction portion. The connection structure includes a first electrical connection portion and a protective portion surrounding the first contact electrode and the first electrical connection portion. The first electrical connection portion includes an upper portion, a lower portion and a neck portion arranged between the upper portion and the lower portion. The lower portion has a width is wider than of the upper portion.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: May 2, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Shau-Yi Chen, Shao-You Deng
  • Publication number: 20230119631
    Abstract: A semiconductor device includes a semiconductor stack, a protective layer on the semiconductor stack, an electrode on the semiconductor stack and electrically connected to the semiconductor stack, and a conductive bump on the electrode. The thickness of the conductive bump is measured from the topmost point of the conductive bump to the uppermost surface of the protective layer. The ratio of the thickness of the conductive bump to the maximum width of the conductive bump is between 0.1 and 0.4.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 20, 2023
    Inventors: Min-Hsun HSIEH, Shih-An LIAO
  • Patent number: 11626295
    Abstract: An applying method includes the following steps. Firstly, a conductive adhesive including a plurality of conductive particles and an insulating binder is provided. Then, a carrier plate is provided. Then, a patterned adhesive is formed on the carrier plate by the conductive adhesive, wherein the patterned adhesive includes a first transferring portion. Then, a manufacturing device including a needle is provided. Then, the needle of the manufacturing device is moved to contact the first transferring portion. Then, the transferring portion is transferred to a board by the manufacturing device.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: April 11, 2023
    Assignee: EPISTAR CORPORATION
    Inventor: Min-Hsun Hsieh
  • Publication number: 20230105078
    Abstract: An LED arrangement method includes providing first LED sections and second LED sections commonly located on a substrate. The first LED sections and the second LED sections are transferred to a bin carrier to form an array of sections having columns and rows. Each of the first LED sections has first LED chips. The first LED chips, as a whole, belong to a first bin. Each of the second LED sections has second LED chips. The second LED chips, as a whole, belong to a second bin. Each of columns has one of the first LED sections and one of the second LED sections. Each of the rows has one of the first LED sections and one of the second LED sections.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 6, 2023
    Inventors: Min-Hsun HSIEH, Hsin-Mao LIU
  • Patent number: D993199
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: July 25, 2023
    Assignees: EPISTAR CORPORATION, YENRICH TECHNOLOGY CORPORATION
    Inventors: Min-Hsun Hsieh, Jen-Chieh Yu, Chun-Wei Chen, Chun-Hung Liu