Patents by Inventor Min Jung Cho
Min Jung Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220157522Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers and external electrodes disposed on the body and connected to the internal electrodes. The one of the internal electrodes includes Ni, Ba, Ti, O, and Tb, and a content of Tb relative to a sum of contents of Ni, Ba, Ti, O, and Tb is 0.45 to 3.0 wt %.Type: ApplicationFiled: July 19, 2021Publication date: May 19, 2022Inventors: Min Jung CHO, Byung Kun KIM, Yu Hong OH, Chang Hak CHOI
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Publication number: 20220139616Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, external electrodes disposed on external surfaces of the body and connected to the internal electrodes, and an insulating layer covering a surface of the body. One of the external electrodes includes a metal layer connected to the insulating layer, and the insulating layer includes an oxide of a metal component of the metal layer.Type: ApplicationFiled: May 14, 2021Publication date: May 5, 2022Inventors: Yun Sung KANG, Min Jung CHO, Yun Hee KIM
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Patent number: 11322302Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween, and an external electrode disposed on the body and connected to the internal electrodes . An end portion of at least one of the internal electrodes in a longitudinal direction of the body is thicker than a central portion of the internal electrode, and a ratio t2/t1 of a thickness t2 of the end portion to a thickness t1 of the central portion satisfies 1.1?t2/t1?1.5.Type: GrantFiled: May 5, 2020Date of Patent: May 3, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Suji Kang, Yuhong Oh, Byung Kun Kim, Yun Hee Kim, Min Jung Cho
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Patent number: 11130721Abstract: The present invention relates to a method for recovering light olefins, which can achieve an increase in propylene production and a reduction in the basic unit of a process by feeding steam into five serially connected dehydrogenation reactors, and can diversify the product of a propane dehydrogenation reaction process from a propylene single product into propylene and ethylene by separately collecting ethane and ethylene, i.e., by-products of the propylene production process, and converting the ethane into ethylene, thereby improving the economic efficiency of the process and selectivity.Type: GrantFiled: July 18, 2017Date of Patent: September 28, 2021Assignee: Hyosung Chemical CorporationInventors: Bu Young Jo, Won Il Kim, Jae Han Cho, Jae Young Woo, Hee Chul Yeom, Dan Bi Chung, Min Jung Cho
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Publication number: 20210166875Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween, and an external electrode disposed on the body and connected to the internal electrodes . An end portion of at least one of the internal electrodes in a longitudinal direction of the body is thicker than a central portion of the internal electrode, and a ratio t2/t1 of a thickness t2 of the end portion to a thickness t1 of the central portion satisfies 1.1?t2/t1?1.5.Type: ApplicationFiled: May 5, 2020Publication date: June 3, 2021Inventors: Suji KANG, Yuhong OH, Byung Kun KIM, Yun Hee KIM, Min Jung CHO
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Publication number: 20210130263Abstract: The present invention relates to a method for recovering light olefins, which can achieve an increase in propylene production and a reduction in the basic unit of a process by feeding steam into five serially connected dehydrogenation reactors, and can diversify the product of a propane dehydrogenation reaction process from a propylene single product into propylene and ethylene by separately collecting ethane and ethylene, i.e., by-products of the propylene production process, and converting the ethane into ethylene, thereby improving the economic efficiency of the process and selectivity.Type: ApplicationFiled: July 18, 2017Publication date: May 6, 2021Inventors: Bu Young JO, Won Il KIM, Jae Han CHO, Jae Young WOO, Hee Chul YEOM, Dan Bi CHUNG, Min Jung CHO
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Publication number: 20210035741Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately stacked therein in a stacking direction; and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes 94.0 to 99.6 wt % of Ni and 0.4 to 6.0 wt % of Cu.Type: ApplicationFiled: June 16, 2020Publication date: February 4, 2021Inventors: Min Jung Cho, Byung Kun Kim, Su Ji Kang, Yu Hong Oh
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Patent number: 8881381Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.Type: GrantFiled: December 4, 2009Date of Patent: November 11, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Mi Sun Hwang, Myung Sam Kang, Ok Tae Kim, Seon Ha Kang, Gil Yong Shin, Kil Yong Yun, Min Jung Cho
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Publication number: 20140090245Abstract: In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.Type: ApplicationFiled: December 6, 2013Publication date: April 3, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Sun HWANG, Myung Sam KANG, Ok Tae KIM, Seon Ha Kang, Gil Yong SHIN, Kil Yong YUN, Min Jung CHO
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Publication number: 20120298412Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The method of manufacturing a printed circuit board includes: preparing a base substrate having first circuit layers formed on one surface or both surfaces thereof; forming a plating resist having openings for a first via layer on the base substrate; forming first via layers in the openings for a first via layer; forming insulating layers having outer metal layers on the base substrate having the first via layers formed thereon; forming openings for a second via layer over the first via layer on the insulating layers and the outer metal layers; and completing multi-layer vias by forming second via layers in the openings.Type: ApplicationFiled: August 5, 2011Publication date: November 29, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Don Mun, Min Jung Cho, Sun Uk Hwang
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Publication number: 20110067233Abstract: A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity.Type: ApplicationFiled: December 29, 2009Publication date: March 24, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seon Ha Kang, Myung Sam Kang, Mi Sun Hwang, Kil Yong Yun, Min Jung Cho, Gil Yong Shin, Ok Tae Kim
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Publication number: 20110061906Abstract: A printed circuit board (PCB) and a fabrication method thereof are disclosed. The PCB includes: a dual-layered circuit pattern formed with a desired pattern on at least one of upper and lower surfaces of an insulation base member (i.e., an insulation substrate) and having metal layers each having a different thermal expansion coefficient; and an insulating layer formed on the insulation base member to cover the circuit pattern. Because the PCB includes an anti-warping unit, a processing rate and productivity can be improved.Type: ApplicationFiled: December 18, 2009Publication date: March 17, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Min Jung Cho, Mi Sun Hwang, Jae Joon Lee, Myung Sam Kang
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Publication number: 20110061912Abstract: Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.Type: ApplicationFiled: December 29, 2009Publication date: March 17, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myung Sam Kang, Mi Sun Hwang, Ok Tae Kim, Seon Ha Kang, Gil Yong Shin, Kil Yong Yun, Min Jung Cho
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Publication number: 20110061231Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.Type: ApplicationFiled: December 4, 2009Publication date: March 17, 2011Inventors: Mi Sun HWANG, Myung Sam KANG, Ok Tae KIM, Seon Ha KANG, Gil Yong SHIN, Kil Yong YUN, Min Jung CHO
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Publication number: 20100314755Abstract: Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided.Type: ApplicationFiled: July 29, 2009Publication date: December 16, 2010Inventors: Myung Sam KANG, Mi Sun Hwang, Ok Tae Kim, Seon Ha Kang, Gil Yong Shin, Kil Yong Yun, Min Jung Cho