Abstract: A method for fabricating a MOS transistor having an offset resistance in a channel region controlled by a gate voltage and structure thereof is disclosed. A gate electrode is divided into three adjacent regions of respectively a second conductivity type, first conductivity type and second conductivity type connected laterally to one another on a channel region. A gate control voltage is applied to a central region of the first conductivity type, and a predetermined voltage between maximum and minimum values of the gate control voltage is applied to left and right adjacent regions of the second conductivity type. If a gate turn-on voltage is applied to the central region the gate turn-on voltage is forward biased to the adjacent left and right regions and is therefore also applied to the forwardly biased left and right regions. The effective length of the gate electrode then becomes the total length of the central region and the left and right adjacent regions.

Abstract: A method of forming an insulated gate semiconductor device includes the steps of patterning an insulated gate electrode on a face of a substrate containing a first conductivity type region and forming a trench at the face using the gate electrode as a mask. Second conductivity type dopants are then deposited onto the bottom and sidewalls of the trench and diffused into the substrate to form a relatively lightly doped first body region. The gate electrode is then used again as a mask during a step of implanting a relatively high dose of second conductivity type dopants at the bottom of the trench. These implanted dopants are then partially diffused laterally and downwardly away from the bottom and sidewalls of the trench. The gate electrode is then used again to deposit first conductivity type dopants onto the sidewalls (and bottom) of the trench.

Abstract: A field effect transistor includes laterally spaced apart source and drain regions in a substrate, laterally spaced apart undoped regions in the substrate between the laterally spaced apart source and drain regions, a doped channel region in the substrate between the laterally spaced apart undoped regions, and a gate insulating layer on the substrate. A main gate is on the gate insulating layer opposite the channel, and first and second sub gates are on the gate insulating layer, a respective one of which is opposite a respective one of the spaced apart undoped regions. The first and second sub gates are laterally spaced apart from and electrically insulated from the main gate.

Abstract: Methods of forming thin-film transistors include the steps of forming an amorphous silicon (a-Si) layer of predetermined conductivity type on a face of an electrically insulating substrate and then forming a first insulating layer on the amorphous silicon layer. The first insulating layer and amorphous silicon layer are then patterned to define spaced amorphous source and drain regions having exposed sidewalls. An amorphous silicon channel region is then deposited in the space between the source and drain regions and in contact with the sidewalls thereof. An annealing step is then performed to convert the amorphous source, drain and channel regions to polycrystalline silicon, prior to the step of forming an insulated gate electrode on the channel region.

Abstract: To accomplish the objects of the present invention, among others, the present invention provides a thin-film transistor that has a channel region operatively having an offset region only during turn-off. Source and drain regions self-aligned with different ends of the channel region. A gate region is formed on a gate insulating layer disposed over the channel region and has a main gate accepting a gate voltage, a subgate which comes into ohmic contact with the source region, and a junction gate for forming a rectifying junction between the main gate and subgate.

Abstract: A hybrid schottky injection field effect transistor is provided. A first diffusion region of a second conductivity type and a second diffusion region of a first conductivity type are separately formed at a main surface of a silicon layer. A third diffusion region of a first conductivity type is formed within the first diffusion region. An insulating layer covers part of the second diffusion region and the third diffusion region. A gate electrode is formed on the insulating layer and is situated over the first and third diffusion regions and the silicon layer. A cathode electrode is commonly connected to the third diffusion region and the first diffusion region. An anode electrode comprises a trench filled with electrode material and is formed in the silicon layer along side of the second diffusion area and a gate insulating layer.

Abstract: A field effect transistor includes laterally spaced apart source and drain regions in a substrate, laterally spaced apart undoped regions in the substrate between the laterally spaced apart source and drain regions, a doped channel region in the substrate between the laterally spaced apart undoped regions, and a gate insulating layer on the substrate. A main gate is on the gate insulating layer opposite the channel, and first and second sub gates are on the gate insulating layer, a respective one of which is opposite a respective one of the spaced apart undoped regions. The first and second sub gates are laterally spaced apart from and electrically insulated from the main gate.

Abstract: A shorted anode lateral insulated gate bipolar transistor includes a semiconductor layer of a first conductivity type, a first current electrode, a second current electrode, a first insulation layer, a first gate electrode, a second gate electrode, a first high concentration impurity region of a second conductivity type, a low concentration impurity region of the second conductivity type, a first high concentration impurity region of the first conductivity type, a second high concentration impurity region of the second conductivity type, a third high concentration impurity region of the second conductivity type, and a second high concentration impurity region of the first conductivity type.

Abstract: The present invention relates to a method of manufacturing an insulated-gate transistor including a very thin P.sup.- layer as a channel under a gate terminal. The device and method differs from conventional devices and techniques in that the P.sup.- regions are formed by double diffusion. Secondly, the present invention includes channel regions by forming the N.sup.+ regions in the middle of the shallow P.sup.- layer causing the resistance of the JFET regions to be reduced. High-speed operation of the device can be obtained by reducing the input and reverse capacitances which thereby reduces the time delay when power is supplied. The forward voltage drop is reduced by reducing the resistance of the first conductive semiconductor region which is determined by the distance between the second conductive type semiconductor region in its forward turn-on state.

Abstract: A method for fabricating a MOS transistor having an offset resistance in a channel region controlled by a gate voltage and structure thereof is disclosed. A gate electrode is divided into three adjacent regions of respectively a second conductivity type, first conductivity type and second conductivity type connected laterally to one another on a channel region. A gate control voltage is applied to a central region of the first conductivity type, and a predetermined voltage between maximum and minimum values of the gate control voltage is applied to left and right adjacent regions of the second conductivity type. If a gate turn-on voltage is applied to the central region the gate turn-on voltage is forward biased to the adjacent left and right regions and is therefore also applied to the forwardly biased left and right regions. The effective length of the gate electrode then becomes the total length of the central region and the left and right adjacent regions.