Abstract: An apparatus and method for providing big data information based on a subscriber's behavior.

Abstract: Provided is a method of reusing a mobile device resource in a mobile cloud. According to an embodiment, the method may be a method for using a mobile device resource of a mobile device resource provider in the mobile cloud, the method including requesting use of at least one of the mobile device resources from the mobile device resource provider, wherein the mobile device resource includes content stored by the mobile device resource provider, a function provided to the mobile device resource provider, and an application installed to the mobile device resource provider; and receiving the requested mobile device resource of the mobile device resource provider, wherein, when use of the content is requested, the requested content may be received through download or streaming, and, when use of the function or the application is requested, a result of executing the function or the application may be received.

Abstract: A system and method for providing a device profile using a device identifier are disclosed. The system for providing a device profile using a device identifier includes: a mobile terminal that provides a device identifier having information regarding a hierarchical structure of a server and a model name; a plurality of servers that analyze the device identifier to recognize the lowermost server when the device identifier is queried, acquire a device profile corresponding to the device identifier through the lowermost server, and provide the acquired device profile; and an application server that connects to one of the plurality of servers, queries the device identifier, and is provided with a device profile corresponding to the device identifier. Device description of various mobile terminals can be more effectively managed and used in a mobile environment.

Abstract: A method for providing workflow stages and integrated workflow stage visualization includes displaying a detailed view of a workflow, including a plurality of customizable stages, in the workflow user interface, wherein at least a first workflow stage of the plurality workflow stages is configured to contain a plurality of customizable workflow components, displaying the plurality of workflow components in the detailed view, receiving a selection of a stage view within the workflow user interface; displaying the stage view of the workflow, wherein the stage view includes the plurality of customizable stages but excludes the workflow components; and sending the workflow to the shared application platform.

Abstract: In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

Abstract: In a method for providing a media service, the media service providing system retrieves an index file corresponding to a requested broadcast service after receiving a request for the broadcast service from the terminal. The media service providing system provides the retrieved index file to the terminal. Here, the index file includes a plurality of internet identifiers of a plurality of the media files corresponding to the broadcast service.

Abstract: The present invention relates to a reference gesture registering method, a mobile terminal (100) driving method, and a mobile terminal (100) thereof. In the present invention, when a user uses a keypad or a touch screen to request to recognize a gesture or register a gesture of a user, a mobile terminal (100) analyzes a user gesture image input through a camera (120) attached to the mobile terminal (100) to extract gesture data, and executes an application function mapped to the extracted gesture data or registers the extracted gesture data as reference gesture data that serves as a gesture identification reference.

Abstract: A mobile terminal for using a mobile cloud service and an operation method of the mobile terminal are disclosed. The mobile terminal accessible to a mobile cloud server, including: a mobile cloud terminal platform accessing the mobile cloud server to acquire a cloud application, and providing a mobile cloud service by using the acquired cloud application; a local terminal platform executing a local application installed in the mobile terminal; and an operating system (OS) selectively driving one of the mobile cloud terminal platforms and the local platform according to a user set environment.

Abstract: In a certified link authentication system, a terminal parses a web page and extracts markup information for a certified link. In addition, the terminal transmits the extracted markup information to a certified link authentication server. The certified link authentication server authenticates the certified link from the markup information of the certified link transmitted from the terminal, and transmits an authentication result to the terminal. The terminal marks the authenticated certified link with a certified mark, renders the web page, and displays it to the user.

Abstract: Provided is a mobile terminal device including a mobile cloud platform. The mobile cloud platform includes a mobile cloud platform layer, a mobile cloud application layer, and a mobile cloud service layer. The mobile cloud platform layer virtualizes resources provided from the mobile terminal device. The mobile cloud application layer provides a service requested by a user to the user through a virtual mobile terminal user interface. The mobile cloud service layer provides the requested service constantly regardless of a change of mobile terminal environment. The mobile terminal device forms a mobile cloud together with other mobile terminal devices. Each of the mobile terminal devices includes a mobile cloud platform.

Abstract: A system and method for providing a device profile using a device identifier are disclosed. The system for providing a device profile using a device identifier includes: a mobile terminal that provides a device identifier having information regarding a hierarchical structure of a server and a model name; a plurality of servers that analyze the device identifier to recognize the lowermost server when the device identifier is queried, acquire a device profile corresponding to the device identifier through the lowermost server, and provide the acquired device profile; and an application server that connects to one of the plurality of servers, queries the device identifier, and is provided with a device profile corresponding to the device identifier. Device description of various mobile terminals can be more effectively managed and used in a mobile environment.

Abstract: In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

Abstract: In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

Abstract: An image pickup device and a manufacturing method thereof. A digital signal processing (DSP) chip is attached on a first surface of a substrate. A CMOS image sensor (CIS) chip is attached on an active surface of the DSP chip. The DSP chip and the CIS chip may be electrically connected to the substrate by wire bonding. A housing kit having a lens configured to transmit an image to the DSP chip may be mounted on the substrate. An inner space between the housing kit and the substrate is not molded, thereby simplifying a manufacturing process and providing a thinner and/or lighter image pickup device.

Abstract: Provided is a method and apparatus for providing web services by which the performance of web services is improved and exchanges of a large quantity of messages are effectively supported. The method includes: preparing the preference information, which pre-describes information required by a web services provider, to provide web services requested by a web services requestor, and the web services provider interacting with the preference information to minimize the number of messages exchanged between the web services requestor and the web services provider.

Abstract: A dual-mode mobile terminal is disclosed in which a switching between the modes is performed. The dual-mode mobile terminal of the present invention is implemented with a single CPU, two or more dual-port randon access memories (DPRAMs) and two or more MODEMs along with interface units (IUs) that prevents the occurrence of interference between parts for respective modes when the CPU and the MODEMs communicate with each other via the DPRAMs in a mobile communication terminal that use a single central processing unit and a plurality of modem chips. The IUs perform control operations so that part of signals to be applied to each of the MODEMs is/are applied only when an activation signal for the MODEM is enabled. The IUs may be implemented with logic gates, and the part of signals include an interrupt signal allowing each MODEM to be released from a sleep state.

Abstract: In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

Abstract: An image pickup device and a manufacturing method thereof. A digital signal processing (DSP) chip is attached on a first surface of a substrate. A CMOS image sensor (CIS) chip is attached on an active surface of the DSP chip. The DSP chip and the CIS chip may be electrically connected to the substrate by wire bonding. A housing kit having a lens configured to transmit an image to the DSP chip may be mounted on the substrate. An inner space between the housing kit and the substrate is not molded, thereby simplifying a manufacturing process and providing a thinner and/or lighter image pickup device.

Abstract: A wafer level chip package has a redistrubution substrate, at least one lower semiconductor chip stacked on the redisctribution substrate, and an uppermost semiconductor chip. The redistribution substrate has a redistribution layer and substrate pads connected to the redistribution layer. The lower semiconductor chip is stacked on the redistribution layer and may have through holes for partially exposing the redistribution layer, the through holes corresponding to the substrate pads, and having conductive filling material filling the through holes. The uppermost semiconductor chip may have the same elements as the lower semiconductor chip, and may be flip chip bonded to the through holes. The package may further have a filling layer for filling areas between chips, a metal lid for coating most of the external surfaces, and external connection terminals formed on and electrically connected to the exposed redistribution layer from the first dielectric layer of the redistribution substrate.

Abstract: A wafer level chip package has a redistrubution substrate, at least one lower semiconductor chip stacked on the redisctribution substrate, and an uppermost semiconductor chip. The redistribution substrate has a redistribution layer and substrate pads connected to the redistribution layer. The lower semiconductor chip is stacked on the redistribution layer and may have through holes for partially exposing the redistribution layer, the through holes corresponding to the substrate pads, and having conductive filling material filling the through holes. The uppermost semiconductor chip may have the same elements as the lower semiconductor chip, and may be flip chip bonded to the through holes. The package may further have a filling layer for filling areas between chips, a metal lid for coating most of the external surfaces, and external connection terminals formed on and electrically connected to the exposed redistribution layer from the first dielectric layer of the redistribution substrate.