Abstract: The present invention is directed to a semiconductor chip package that can effectively remove heat from a semiconductor chip, and a method of fabricating the package. In accordance with an embodiment of the invention, the package includes: a substrate having bonding pads; a semiconductor chip having conductive bumps on the front side thereof, the conductive bump contacting the bonding pads; a heat slug bonded to the backside of the semiconductor chip; and a solder film which makes the bonding between the heat slug and the backside of the semiconductor chip. The heat slug can be shaped such that a portion of the heat slug is attached to the substrate by an adhesive.

Abstract: Disclosed are polythiophene-based conductive polymer liquid compositions of high conductivity and transparency. The compositions comprise 16-32 weight % of an aqueous polythiophene-based conductive polymer solution, 52-80 weight % of an alcohol solvent, 1-12 weight % of an amide solvent, 0.01-0.4 weight % of a sulfonic acid group-containing monomer dopant, and optionally 2-8 weight % of an alkoxysilane. The compositions can be applied to transparent substrates to form coatings which have a surface resistance of 1 k&OHgr;/□ or less and a transmittance of 92% or higher. With the excellent conductivity and transparency, the compositions are useful as electromagnetic wave-shielding materials, finding numerous applications in cathode ray tube screens (TV sets and computer monitors) as well as CPP films, polyethyleneterephthalate films, polycarbonate panels, and acryl panels.

Abstract: Disclosed is a polymer composition for coatings with high refractivity, conductivity and transparency. The composition comprises 2-20 weight % of an aqueous polythiophene-based conductive polymer solution having a solid content of 1.2-1.5 weight %; 0.5-20 weight % of a highly refractive, inorganic sol solution having a solid content of 14-16 weight %; 50-97.4 weight % of an alcohol containing 1-3 carbon atoms; 0.1-10 weight % of an amide solvent; 0.005-0.1 weight % of a water- or an alcohol-soluble resin binder; and 0.005-0.05 weight % of a sulfonic acid group-containing monomer dopant. The composition can be applied to CRT external glass and other transparent substrates to allow thin films which have a refractive index of 1.6-2.0, a transmittance of 90-98% and a surface resistance of 1×103-1×108 &OHgr;/□.