Patents by Inventor Min Liu

Min Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11644912
    Abstract: An interface device includes an on-panel pad and a sensor controller. The interface device is used to perform an input to an electronic device in response to an operation by a user on a capacitive touch panel display of the electronic device. The on-panel pad causes sensor electrodes included in the touch panel display to generate a two-dimensional pattern of capacitance while the on-panel pad is on the touch panel display. When the two-dimensional pattern generated while the on-panel pad is on the touch panel display has been detected, the sensor controller generates or outputs data including operation information in response to a change in capacitance in a region that is associated with the two-dimensional pattern and that receives an operation of the on-panel pad, the operation information indicating an operation state of the on-panel pad.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: May 9, 2023
    Assignee: Wacom Co. Ltd.
    Inventors: Thilo Naoki Hornung, Jui Min Liu, Yoshio Nomura, Kazuhiro Miyoshi, Shigeyuki Sano
  • Publication number: 20230138748
    Abstract: A pre-flotation high efficiency slurry conditioning device for wide-particle-grade flotation, suitable for coal slime flotation.
    Type: Application
    Filed: November 27, 2020
    Publication date: May 4, 2023
    Inventors: Xiahui Gui, Yaowen Xing, Shihao Ding, Yijun Cao, Jiongtian Liu, Tao Che, Fancai Meng, Youfei Zhang, Mengdi Xu, Min Liu, Liyong Wei
  • Publication number: 20230132393
    Abstract: An air source heat pump system includes at least one heat pump sub-system and at least one water tank. Each heat pump sub-system includes a refrigerant circulation path and a water supply circulation path. The refrigeration circulation path includes a compressor, a first heat exchanger, a first throttling device, and an evaporator that are sequentially connected to one another. The water supply circulation path includes a first supply pipe, a second supply pipe, a return pipe, and a waterway control valve. The first supply pipe and the second supply pipe are each communicated with an end of the first heat exchanger through the waterway control valve, and the return pipe is communicated with another end of the first heat exchanger. The return pipe is communicated with a water inlet of a corresponding water tank, and the second supply pipe is communicated with a water outlet of the corresponding water tank.
    Type: Application
    Filed: December 27, 2021
    Publication date: April 27, 2023
    Applicant: QINGDAO HISENSE HITACHI AIR-CONDITIONING SYSTEMS CO., LTD.
    Inventors: Dongfang ZHAO, Yongkun GAO, Min LIU
  • Publication number: 20230121930
    Abstract: A vapor chamber with structure for enhancing two-phase flow boiling includes a main body formed of a first and a second plate member, which are correspondingly closed to each other to define an airtight chamber between them. The airtight chamber has a condensing side and an evaporating side and has a working fluid filled therein. The evaporating side is formed on its surface with a plurality of projected sections and a plurality of recessed sections and has a wick structure provided thereon. The projected sections extend through and project beyond the wick structure, and the recessed sections are located below the wick structure without being filled by the wick structure to thereby form spaces for receiving the working fluid. The provision of the projected and the recessed sections enables the vapor chamber to provide largely enhanced two-phase flow boiling effect in the airtight chamber.
    Type: Application
    Filed: October 14, 2021
    Publication date: April 20, 2023
    Inventors: Chunlin Mao, Xiao-Xiang Zhou, Xingxing Zhang, Han-Min Liu
  • Publication number: 20230094992
    Abstract: A method for generating a wireless signal fingerprint database includes: obtaining an initial atmospheric pressure value, in which the initial atmospheric pressure value is an atmospheric pressure value collected when a terminal enters indoors; obtaining periodically a current wireless signal fingerprint and a current atmospheric pressure value collected by the terminal; and determining a floor corresponding to the current wireless signal fingerprint based on the initial atmospheric pressure value and the current atmospheric pressure value, to obtain the wireless signal fingerprint database.
    Type: Application
    Filed: December 6, 2022
    Publication date: March 30, 2023
    Inventors: Chuanming ZHANG, Min LIU, Zhi WANG, Hailu JIA
  • Patent number: 11614999
    Abstract: An apparatus, method, and system for indexing backed up files is disclosed. The operations comprise: maintaining a File index and a Backup index, the File index comprising entries each associated with an individual file backed up, the Backup index comprising entries each associated with a particular backup; receiving a request to determine whether or not a first file is included in a first backup; determining whether or not the first file is included in the first backup based on the File index entry corresponding to the first file and the Backup index entry corresponding to the first backup; and returning a result of the determination of whether or not the first file is included in the first backup.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: March 28, 2023
    Assignee: EMC IP HOLDING COMPANY LLC
    Inventors: Ming Zhang, Lihui Su, James Morton, Min Liu, Weiyang Liu
  • Patent number: 11615860
    Abstract: A circuit includes an array of OTP cells, an array of NVM cells, an amplifier coupled to each of the array of OTP cells and the array of NVM cells, and a control circuit configured to generate one or more control signals. Responsive to the one or more control signals, the amplifier is configured to generate an output voltage based on a current received from the array of OTP cells in a first configuration, and generate the output voltage based on a voltage received from the array of NVM cells in a second configuration.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: March 28, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: Chih-Min Liu
  • Publication number: 20230070411
    Abstract: Examples described herein relate to a central processing unit (CPU) that includes at least two cores, at least two caching agents (CAs), and circuitry to monitor a workload mapped to a CA of the at least two CAs and adjust the workload allocated to the CA to allocation among the CA and at least one other CA of the at least two CAs based on the monitored workload.
    Type: Application
    Filed: November 15, 2022
    Publication date: March 9, 2023
    Inventors: Min LIU, Xiang LI, Shijie LIU, Yannan SUN, Lei ZHU
  • Publication number: 20230070011
    Abstract: The present disclosure provides an electronic device and method for wireless communication, and a computer-readable storage medium. The electronic device comprises: a processing circuit, configured to acquire a channel state information (CSI) resource configuration and a CSI report configuration from a base station, the CSI report configuration being associated with one or more CSI resource configurations, the CSI resource configuration comprising a resource configuration for a reference signal on one or more bandwidth parts (BWPs), and to send, on the basis of the CSI report configuration, to the base station a measurement result, obtained by measuring a reference signal specified in the associated CSI resource configuration, of a beam corresponding to the reference signal.
    Type: Application
    Filed: March 18, 2021
    Publication date: March 9, 2023
    Applicant: Sony Group Corporation
    Inventors: Min LIU, Chen SUN
  • Patent number: 11599154
    Abstract: A device includes an enclosure and logic. The enclosure includes a plurality of capacitive touch sensor arrays disposed at least on two of a top side, a bottom side, a left side, a right side, a front side, and a back side of the device. The enclosure also includes a first display on the front side of the device. The logic receives touch interaction information from the plurality of capacitive touch sensor arrays and initiates an action based at least in part on the touch interaction information.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 7, 2023
    Assignee: Intel Corporation
    Inventors: Min Liu, Lakshman Krishnamurthy, David L. Graumann, Jameson H. Williams, Miriam K. Selvaraj, Bryan R. Peebler, Wendy A. March, Brian K. Vogel, Wenbo Shen, Sihua Tian, Lijuan Xiao, Tao Wang, Xiaoyan Dang, Nithyananda S. Jeganathan, Sunil A. Kulkarni, Sherman Chan Wai Lee, Kaining Yuan
  • Patent number: 11599375
    Abstract: Methods and systems for generating virtual appliance products. The techniques include obtaining an operating system virtual disk file; creating a configuration file to include a first reference to the operating system virtual disk file and a second reference to a product-specific disk file; generating a virtual appliance file including the configuration file, the operating system virtual disk file, and the product-specific disk file; and distributing the virtual appliance file to a user.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: March 7, 2023
    Assignee: EMC IP HOLDING COMPANY LLC
    Inventors: Min Liu, James Morton, Ming Zhang, Lihui Su, Yubing Zhang
  • Patent number: 11600534
    Abstract: A semiconductor device includes a first device region and a second device region. The first device region includes a first source/drain region extending from a substrate and a first and a second pair of spacers. The first source/drain region extends between the first pair of spacers and the second pair of spacers. The first pair of spacers and the second pair of spacers have a first height. The second device region includes a second and a third source/drain region extending from the substrate and a third and a fourth pair of spacers. The third source/drain region is separate from the second source/drain region. The second source/drain region extends between the third pair of spacers. The third source/drain region extends between the fourth pair of spacers. The third pair of spacers and the fourth pair of spacers have a second height greater than the first height.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: March 7, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Min Liu, Hsueh-Chang Sung, Li-Li Su, Yee-Chia Yeo
  • Publication number: 20230068398
    Abstract: In some implementations, one or more semiconductor processing tools may form a via within a substrate of a semiconductor device. The one or more semiconductor processing tools may deposit a ruthenium-based liner within the via. The one or more semiconductor processing tools may deposit, after depositing the ruthenium-based liner, a copper plug within the via.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: Yao-Min LIU, Ming-Yuan GAO, Ming-Chou CHIANG, Shu-Cheng CHIN, Huei-Wen HSIEH, Kai-Shiang KUO, Yen-Chun LIN, Cheng-Hui WENG, Chun-Chieh LIN, Hung-Wen SU
  • Publication number: 20230065620
    Abstract: An embodiment includes a device including a first fin extending from a substrate. The device also includes a first gate stack over and along sidewalls of the first fin. The device also includes a first gate spacer disposed along a sidewall of the first gate stack. The device also includes and a first source/drain region in the first fin and adjacent the first gate spacer, the first source/drain region including a first carbon-containing buffer layer on the first fin. The device also includes and a first epitaxial structure on the first carbon-containing buffer layer.
    Type: Application
    Filed: August 26, 2021
    Publication date: March 2, 2023
    Inventors: Wei-Min Liu, Li-Li Su, Yee-Chia Yeo
  • Publication number: 20230042277
    Abstract: A semiconductor processing tool performs passivation layer deposition and removal in situ. A transport mechanism included in the semiconductor processing tool transfers a semiconductor structure through different deposition chambers (e.g., without breaking or removing a vacuum environment). Accordingly, the semiconductor processing tool deposits a target layer that is thinner on, or even absent from, a metal layer, such that contact resistance is reduced between a conductive structure formed over the target layer and the metal layer. As a result, electrical performance of a device including the conductive structure is improved. Moreover, because the process is performed in situ (e.g., without breaking or removing the vacuum) in the semiconductor processing tool, production time and risk of impurities in the conductive structure are reduced. As a result, throughput is increased, and chances of spoiled wafers are decreased.
    Type: Application
    Filed: March 7, 2022
    Publication date: February 9, 2023
    Inventors: Chia-Pang KUO, Yao-Min LIU, Shu-Cheng CHIN, Chih-Chien CHI, Cheng-Hui WENG
  • Publication number: 20230041797
    Abstract: A display substrate includes a first base, touch signal lines and touch units. The touch signal lines are disposed on a side of the first base, and lengths of at least two touch signal lines decrease in sequence. The touch units are disposed on a side of the touch signal lines away from the first base, and a touch unit is electrically connected to a touch signal line. Resistances of at least two touch units increase in sequence, and the at least two touch units in an increase order of the resistances in sequence are electrically connected to the at least two touch signal lines in a decrease order of the lengths in sequence, respectively. The touch units each include a touch electrode, and at least one of the at least two touch units further includes an auxiliary electrode stacked with and electrically connected to a touch electrode.
    Type: Application
    Filed: May 12, 2021
    Publication date: February 9, 2023
    Applicants: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yanwei REN, Min LIU
  • Publication number: 20230042495
    Abstract: In coarse memory training approaches, a multiple of a base timing interval is used to reduce the sampling time in a sweep sampling approach during memory training to determine the timing offset between a non-clock memory signal and a memory clock to ensure reliable memory operation at high frequencies. In a hierarchical memory training method, a coarse memory training step is employed to determine adjustable timing offsets where a memory captures the rising and falling edges of a non-clock memory signal and those adjustable timing offsets are used in a subsequent fine memory training step to refine the timing offsets where the memory captures the rising and falling edges of the non-clock memory signal. The hierarchical approach can determine timing offsets for non-clock memory signals with the accuracy of existing (non-coarse, non-hierarchical) memory training methods in less time than the existing methods.
    Type: Application
    Filed: October 17, 2022
    Publication date: February 9, 2023
    Applicants: Intel Corporation, Intel Corporation
    Inventors: Min Liu, Young Xiangguo Guo, Lei Zhu, Yannan Sun, Xiang Li
  • Publication number: 20230030019
    Abstract: A heat pipe structure includes a main body. The main body has an internal airtight chamber. At least one capillary structure is disposed on a wall face of the airtight chamber. A working fluid is filled in the airtight chamber. The main body has at least one stress concentration section. A retaining reinforcement member is disposed on the capillary structure corresponding to the stress concentration section for reinforcing the capillary structure and securely retaining the capillary structure on the wall face. When the heat pipe is flexed, bent and deformed, the retaining reinforcement member serves to prevent the capillary structure disposed on the stress concentration section from cracking or damaging.
    Type: Application
    Filed: July 27, 2021
    Publication date: February 2, 2023
    Inventor: Han-Min Liu
  • Publication number: 20230031618
    Abstract: A floating heat pipe assembly includes a floating heat pipe and a clamp collar used with the floating heat pipe. The floating heat pipe has a flattened section that has a flattened pipe size smaller than a pipe size of any other section of the floating heat pipe, so that the floating heat pipe is adjustable at the thinner flattened section for other sections of the floating heat pipe located at two opposite ends of the flattened section to displace to two positions having a height difference between them. The clamp collar is fitted on around the flattened section and includes two symmetrically arranged elastic clamping sections that elastically clamp on two opposite outer sides of the flattened section to hold the same in place, so that the sections of the floating heat pipe located at different heights do not deform to cause reduced or failed capillary action efficiency.
    Type: Application
    Filed: July 27, 2021
    Publication date: February 2, 2023
    Inventor: Han-Min Liu
  • Publication number: 20230023628
    Abstract: Disclosed is a biomedical ? titanium alloy and a preparation method thereof. Its composition includes: Mo: 9.20-13.50%; Fe: 1.00-3.20%; Zr: 3.50-8.20%; Ta: 0-1.00%; the balance is Ti. The ? titanium alloy is suitable for the laser additive manufacturing technology, and the prepared parts have a dense equiaxed grain structure with ultra-low grain size and a small number of columnar grain structures, which produces a fine-grain strengthening effect, and greatly improve the hardness and tribocorrosion performance of the alloy material. Also provided is a method for preparing a non-toxic, low-elasticity, and tribocorrosion resistant biomedical ? titanium alloy material. A powder prepared from the above alloy components is subjected to a laser additive manufacturing technology to prepare a corresponding ? titanium alloy with high-hardness, good tribocorrosion resistance and extremely low cytotoxicity.
    Type: Application
    Filed: July 26, 2022
    Publication date: January 26, 2023
    Inventors: Xingchen Yan, Cheng Chang, Qingkun Chu, Changguang Deng, Min Liu