Abstract: An embodiment includes a device including a first fin extending from a substrate. The device also includes a first gate stack over and along sidewalls of the first fin. The device also includes a first gate spacer disposed along a sidewall of the first gate stack. The device also includes and a first source/drain region in the first fin and adjacent the first gate spacer, the first source/drain region including a first carbon-containing buffer layer on the first fin. The device also includes and a first epitaxial structure on the first carbon-containing buffer layer.

Abstract: In some implementations, one or more semiconductor processing tools may form a via within a substrate of a semiconductor device. The one or more semiconductor processing tools may deposit a ruthenium-based liner within the via. The one or more semiconductor processing tools may deposit, after depositing the ruthenium-based liner, a copper plug within the via.

Abstract: A display substrate includes a first base, touch signal lines and touch units. The touch signal lines are disposed on a side of the first base, and lengths of at least two touch signal lines decrease in sequence. The touch units are disposed on a side of the touch signal lines away from the first base, and a touch unit is electrically connected to a touch signal line. Resistances of at least two touch units increase in sequence, and the at least two touch units in an increase order of the resistances in sequence are electrically connected to the at least two touch signal lines in a decrease order of the lengths in sequence, respectively. The touch units each include a touch electrode, and at least one of the at least two touch units further includes an auxiliary electrode stacked with and electrically connected to a touch electrode.

Abstract: A semiconductor processing tool performs passivation layer deposition and removal in situ. A transport mechanism included in the semiconductor processing tool transfers a semiconductor structure through different deposition chambers (e.g., without breaking or removing a vacuum environment). Accordingly, the semiconductor processing tool deposits a target layer that is thinner on, or even absent from, a metal layer, such that contact resistance is reduced between a conductive structure formed over the target layer and the metal layer. As a result, electrical performance of a device including the conductive structure is improved. Moreover, because the process is performed in situ (e.g., without breaking or removing the vacuum) in the semiconductor processing tool, production time and risk of impurities in the conductive structure are reduced. As a result, throughput is increased, and chances of spoiled wafers are decreased.

Abstract: In coarse memory training approaches, a multiple of a base timing interval is used to reduce the sampling time in a sweep sampling approach during memory training to determine the timing offset between a non-clock memory signal and a memory clock to ensure reliable memory operation at high frequencies. In a hierarchical memory training method, a coarse memory training step is employed to determine adjustable timing offsets where a memory captures the rising and falling edges of a non-clock memory signal and those adjustable timing offsets are used in a subsequent fine memory training step to refine the timing offsets where the memory captures the rising and falling edges of the non-clock memory signal. The hierarchical approach can determine timing offsets for non-clock memory signals with the accuracy of existing (non-coarse, non-hierarchical) memory training methods in less time than the existing methods.

Abstract: A floating heat pipe assembly includes a floating heat pipe and a clamp collar used with the floating heat pipe. The floating heat pipe has a flattened section that has a flattened pipe size smaller than a pipe size of any other section of the floating heat pipe, so that the floating heat pipe is adjustable at the thinner flattened section for other sections of the floating heat pipe located at two opposite ends of the flattened section to displace to two positions having a height difference between them. The clamp collar is fitted on around the flattened section and includes two symmetrically arranged elastic clamping sections that elastically clamp on two opposite outer sides of the flattened section to hold the same in place, so that the sections of the floating heat pipe located at different heights do not deform to cause reduced or failed capillary action efficiency.

Abstract: A heat pipe structure includes a main body. The main body has an internal airtight chamber. At least one capillary structure is disposed on a wall face of the airtight chamber. A working fluid is filled in the airtight chamber. The main body has at least one stress concentration section. A retaining reinforcement member is disposed on the capillary structure corresponding to the stress concentration section for reinforcing the capillary structure and securely retaining the capillary structure on the wall face. When the heat pipe is flexed, bent and deformed, the retaining reinforcement member serves to prevent the capillary structure disposed on the stress concentration section from cracking or damaging.

Abstract: Disclosed is a biomedical ? titanium alloy and a preparation method thereof. Its composition includes: Mo: 9.20-13.50%; Fe: 1.00-3.20%; Zr: 3.50-8.20%; Ta: 0-1.00%; the balance is Ti. The ? titanium alloy is suitable for the laser additive manufacturing technology, and the prepared parts have a dense equiaxed grain structure with ultra-low grain size and a small number of columnar grain structures, which produces a fine-grain strengthening effect, and greatly improve the hardness and tribocorrosion performance of the alloy material. Also provided is a method for preparing a non-toxic, low-elasticity, and tribocorrosion resistant biomedical ? titanium alloy material. A powder prepared from the above alloy components is subjected to a laser additive manufacturing technology to prepare a corresponding ? titanium alloy with high-hardness, good tribocorrosion resistance and extremely low cytotoxicity.

Abstract: The present disclosure provides a high-strength and high-plasticity casting high-entropy alloy (HEA), having a general formula of AlaCobCrcTidFeeNifCug, where 6.0<a?8.0, 18.0<b?23.0, 7.5?c<12.5, 2.0<d?8.5, 15.5<e?20.0, 28.0<f?37.0, 0.2<g?10.0, and a+b+c+d+e+f+g=100. The casting HEA can be prepared in one step and has excellent mechanical properties. The various metal raw materials are environmental-friendly and suitable for large-scale industrial production.

Abstract: A mechanism for adaptively performing in-band network telemetry (INT) by a network controller is disclosed. The mechanism includes receiving one or more congestion indicators from a collector. An adjusted sampling rate is generated. The adjusted sampling rate is a specified rate of insertion of instruction headers for INT and is generated based on the congestion indicators. The adjusted sampling rate is transmitted to a head node, which is configured to perform INT via instruction header insertion into user packets.

Abstract: A method includes: receiving a current data packet of a target service; adding detection indication information to the current data packet, to obtain a target data packet, where the detection indication information includes a target phase category corresponding to the current data packet, the target phase category is used to indicate a target phase in at least one key phase in which the current data packet is located in the target service, and the detection indication information is used to indicate to detect the current data packet; and transmitting the target data packet to a next hop node.

Abstract: A display panel and a method for fabricating the same, and a display device and a method for charging the same are provided. The display panel includes: an array substrate; an opposite substrate arranged opposite to the array substrate; a charging coil located between the array substrate and the opposite substrate, wherein the charging coil is configured to generate electrical energy through electromagnetic induction. In this way, a battery for charging the battery is integrated inside the display panel to thereby make the display panel thin and lightweight.

Abstract: Embodiments of the present disclosure provide a method, an electronic device, and a computer program product for data processing. The method described herein includes determining identification information for an operation, wherein the identification information includes at least one field indicating content of the operation and a field indicating a unique identification of the operation. The method further includes identifying, based on the identification information, log entries for the operation in log files for at least one microservice invoked by the operation. The method further includes determining a log for the operation, wherein the log includes the identified log entries. With the solution for data processing of the present application, it is possible to easily acquire logs for an operation using identification information that includes a field indicating the content of the operation, so as to facilitate targeted analysis of the operation based on the content of the operation.

Abstract: A device includes a fin extending from a substrate; a gate stack over and along sidewalls of the fin; a gate spacer along a sidewall of the gate stack; an epitaxial source/drain region in the fin and adjacent the gate spacer, the epitaxial source/drain region including a first epitaxial layer on the fin, the first epitaxial layer including silicon and arsenic; and a second epitaxial layer on the first epitaxial layer, the second epitaxial layer including silicon and phosphorus, the first epitaxial layer separating the second epitaxial layer from the fin; and a contact plug on the second epitaxial layer.

Abstract: A method for configuring performance measurement indication information and a related device. The method includes: a control node determines performance measurement indication information and sends a first advertisement packet in the communication network based on the BGP, where the first advertisement packet carries the performance measurement indication information, so that a plurality of forwarding nodes configure the performance measurement indication information on the plurality of forwarding nodes. In this way, when a data flow on which performance measurement is to be performed is transmitted between a plurality of different ASs, each forwarding node in the different ASs may obtain the performance measurement indication information from the first advertisement packet.

Abstract: A device includes a first fin and a second fin extending from a substrate, the first fin including a first recess and the second fin including a second recess, an isolation region surrounding the first fin and surrounding the second fin, a gate stack over the first fin and the second fin, and a source/drain region in the first recess and in the second recess, the source/drain region adjacent the gate stack, wherein the source/drain region includes a bottom surface extending from the first fin to the second fin, wherein a first portion of the bottom surface that is below a first height above the isolation region has a first slope, and wherein a second portion of the bottom surface that is above the first height has a second slope that is greater than the first slope.

Abstract: A semiconductor structure and a method of forming the same are provided. A method includes depositing a dielectric layer over a conductive feature. The dielectric layer is patterned to form an opening therein. The opening exposes a first portion of the conductive feature. A first barrier layer is deposited on a sidewall of the opening. The first portion of the conductive feature remains exposed at the end of depositing the first barrier layer.

Abstract: A vapor chamber water-filling section sealing structure. The vapor chamber water-filling section sealing structure includes a main body and a capillary structure. The main body has a first plate body and a second plate body, which are correspondingly mated with each other to together define an airtight chamber and a water-filling section. A flange is disposed along an outer periphery of the main body. The water-filling section has a water-filling notch and a water-filling passage. Two ends of the water-filling passage are respectively connected with the flange and the water-filling notch to communicate with the airtight chamber. A portion of the water-filling passage that is connected with the flange is pressed to have a height equal to the height of the flange or lower than the height of the flange. The capillary structure is disposed in the airtight chamber of the main body.

Abstract: The present invention relates to a constructing method on the intelligent networked manufacturing mode with human-cyber-physical collaboration and fusion for a non-ferrous metal industry. According to transformational requirements of a non-ferrous metal industry, production and manufacturing activities are guided by constructing an intelligent manufacturing system with human-cyber-physical collaboration and fusion, an ecosystem service platform, and a sustainable business model. The intelligent manufacturing system with human-cyber-physical collaboration and fusion includes a device autonomous control system and a remote management analysis and decision-making system based on a new generation of AI. The device autonomous control system has functions of perception, intelligent analysis and decision-making, and intelligent control. The remote management analysis and decision-making system has functions of ubiquitous perception, real-time analysis, independent decision-making, and learning improvement.

Abstract: The invention utilizes virtual screening strategy to seek for current market drugs as anti-schizophrenia therapy drug repurposing. Drug repurposing strategy finds new uses other than the original medical indications of existing drugs. Finding new indications for such drugs will benefit patients who are in needs for a potential new therapy sooner since known drugs are usually with acceptable safety and pharmacokinetic profiles. In this study, repurposing marketed drugs for DAAO inhibitor as new schizophrenia therapy was performed with virtual screening on marketed drugs and its metabolites. The identified and available drugs and compounds were further confirmed with in vitro DAAO enzymatic inhibitory assay.