Abstract: The present invention relates to a liquid crystal (LC) medium comprising a terphenyl compound and at least two polymerisable compounds, to a process for its preparation, to its use for optical, electro-optical and electronic purposes, in particular in LC displays, especially in an LC display of the polymer sustained alignment (PSA) type, and to an LC display, especially a PSA display, comprising it.

Abstract: The present invention relates to a liquid crystal (LC) medium comprising a terphenyl compound and at least two polymerizable compounds, to a process for its preparation, to its use for optical, electro-optical and electronic purposes, in particular in LC displays, especially in an LC display of the polymer sustained alignment (PSA) type, and to an LC display, especially a PSA display, comprising it.

Abstract: An image sensor package may include: a package substrate including a chip attachment area on an upper surface thereof, a pad area having a plurality of pads around the chip attachment area, and a holder attachment area at an outside of the pad area, wherein an upper surface of the holder attachment area is at a lower level than an upper surface of the pad area; an image sensor chip mounted on the chip attachment area of the package substrate; a transparent member above the package substrate and configured to cover the image sensor chip; and a holder on the holder attachment area of the package substrate and configured to fix the transparent member.

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: A stack package includes a lower package including a lower package substrate and a lower semiconductor chip disposed on the lower package substrate, an upper package including an upper package substrate and an upper semiconductor chip disposed on the upper package substrate, a fastening element formed between a top surface of the lower semiconductor chip and a bottom surface of the upper package substrate, and a halogen-free inter-package connector connecting the lower package substrate to the upper package substrate.

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: An image sensor package may include: a package substrate including a chip attachment area on an upper surface thereof, a pad area having a plurality of pads around the chip attachment area, and a holder attachment area at an outside of the pad area, wherein an upper surface of the holder attachment area is at a lower level than an upper surface of the pad area; an image sensor chip mounted on the chip attachment area of the package substrate; a transparent member above the package substrate and configured to cover the image sensor chip; and a holder on the holder attachment area of the package substrate and configured to fix the transparent member.

Abstract: A stack package includes a lower package including a lower package substrate and a lower semiconductor chip disposed on the lower package substrate, an upper package including an upper package substrate and an upper semiconductor chip disposed on the upper package substrate, a fastening element formed between a top surface of the lower semiconductor chip and a bottom surface of the upper package substrate, and a halogen-free inter-package connector connecting the lower package substrate to the upper package substrate.

Abstract: A package-on-package assembly includes first and second packages and an adhesion member positioned between the first and second packages and adhering the first and second packages to one another. The first package may include a first substrate having a first surface and a second surface facing each other and including a land pad formed on the first surface, a first semiconductor chip formed on the first surface, and a first encapsulant member encapsulating the first surface and the first semiconductor chip and including a through-via spaced apart from the first semiconductor chip and exposing the land pad and a trench formed between the first semiconductor chip and the through-via, and wherein at least a portion of the trench is filled with adhesion member material.

Abstract: A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.

Abstract: A method and an apparatus for controlling output of a calendar in an electronic device are provided. The method includes displaying an electronic calendar, detecting a gesture on the displayed electronic calendar, updating the displayed electronic calendar to a calendar which has a difference by a predetermined period according to a period of the displayed electronic calendar when the detected gesture corresponds to a predetermined gesture, and displaying the updated calendar, wherein the predetermined period corresponds to a period which is longer than that of the displayed electronic calendar.

Abstract: A method and an apparatus for copy-and-paste of a GUI object are provided. The method includes sensing a multi-touch gesture event and copying at least one GUI object. The multi-touch gesture event includes either a multi-tap and hold gesture event or a multi-tap gesture event. An electronic device for copy and paste of a GUI object comprises a touch screen, at least one or more processors, a memory, and at least one or more modules, each of the one or more modules being stored in the memory and being configured to be executed by the one or more processors, wherein the at least one or more modules is configured to sense a multi-touch gesture event on the touch screen and to copy at least one GUI object.

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.

Abstract: A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.

Abstract: A display for a refrigerator, which can uniformly form a diffusing area, is provided. The display includes a process unit receiving a variety of operation signals for operating the refrigerator, a front cover provided in front of the process unit and including a pushing portion displaying an input location of a user and a light transmission portion transmitting light, and a diffusion sheet provided in rear of the front cover and uniformly diffusing the light.

Abstract: A stack package includes a lower package including a lower package substrate and a lower semiconductor chip disposed on the lower package substrate, an upper package including an upper package substrate and an upper semiconductor chip disposed on the upper package substrate, a fastening element formed between a top surface of the lower semiconductor chip and a bottom surface of the upper package substrate, and a halogen-free inter-package connector connecting the lower package substrate to the upper package substrate.

Abstract: A display for a refrigerator, which can uniformly form a diffusing area, is provided. The display includes a process unit receiving a variety of operation signals for operating the refrigerator, a front cover provided in front of the process unit and including a pushing portion displaying an input location of a user and a light transmission portion transmitting light, and a diffusion sheet provided in rear of the front cover and uniformly diffusing the light.

Abstract: A method and apparatus to segment a motion area in real-time to detect motion in a surveillance camera system are provided. The method includes updating a background image by using a previous input image from among an input image sequence, generating a difference image between a current image of the image sequence and the background image, generating a second function to minimize a first function including regularized energy in the motion area of the difference image and regularized energy in an area without motion of the difference image and segmenting the motion area based on the second function. Therefore, while noise is removed, the motion area is segmented accurately and rapidly even in a low illumination environment so as to detect a moving object.