Abstract: A heat dissipation device includes a base including a base plate made of a first heat conductive material and a substrate made of a second heat conductive material having a heat conductivity lower than that of the first heat conductive material. The substrate comprises a frame with a window receiving the base plate therein and an engaging plate spanning over the window. A fin set includes a plurality of fins parallel with and spaced from each other, and is mounted on the base. A heat pipe has an evaporating section sandwiched between the base plate and the engaging plate, and two condensing sections extending through the fin set and thermally connecting therewith. The evaporating section has a substantially V-shaped configuration.

Abstract: A fastener, for assembling a fan to a bracket, includes a shaft, and an expanding head extending from an end of the shaft. The shaft has a bulge formed at an opposite end thereof. A handle extends from the bulge of the shaft. The handle is used for facilitating an operator to manipulate the fastener to secure the fan and the bracket together. By pulling the handle of the fastener, the shaft of the fastener extends through the fan and the bracket to reach a position where the head and the bulge of the shaft of the fastener tightly sandwich the fan and the bracket therebetween.

Abstract: A heat sink with heat pipes includes a base (10). The base includes a bottom surface contacting a heat-generating component (40), an upper surface opposite to the bottom surface, and a plurality of grooves (14) defined on the upper surface of the base. The heat sink further includes two heat pipes (32, 36) received in the grooves, each heat pipe comprising an evaporating section (322, 362) and a condensing section (324, 364) respectively, wherein the evaporating sections of the heat pipes are closely arranged on a portion of the base, and wherein the condensing sections of the heat pipes spread out from said portion of the base by extending in the grooves to other parts of the base so that heat absorbed by the base from the heat-generating component can be evenly spread to the whole base.

Abstract: A heat sink includes a base (10) and heat pipes (20). The base includes a bottom surface contacting with a heat-generating electronic component (100), an upper surface defining grooves (12) receiving the heat pipes therein. Evaporating sections (22) of the heat pipes are located near a first end portion (10a) and condensing sections (24) of the heat pipes are located near a second end portion (10b) of the base. A first fin assembly (30) is mounted on the upper surface and a second fin assembly (40) is mounted on the bottom surface of the base near the second end portion thereof. A fan (200) is located near the second end portion of the base.

Abstract: A heat sink assembly includes a heat sink (10), a fan cover (20) mounted on the heat sink and a fan (30) carried by the fan cover. The heat sink comprises a base (12) and a plurality of spaced heat dissipation fins (140) extending from the base. The spaced heat dissipation fins define a plurality of channels (16) extending through front and rear ends of the heat sink. A cavity (40) is formed between the front end of the heat sink and the fan cover. The front end of the heat sink is configured with an arced front edge or an inclined front edge.

Abstract: A heat dissipation device comprises a heat spreader for contacting an electronic device for absorbing heat therefrom. A plurality of fins is formed on the heat spreader. A first heat sink is separated from the heat spreader and comprises a first base substantially perpendicular to the heat spreader and a plurality of first fins formed on the first base. A second heat sink comprises a second base connecting with the first base and a plurality of second fins formed on the second base. Two heat pipes connect the heat spreader with the first base and the second base via opposite sides of the heat dissipation device. The heat pipes are partly sandwiched between the first base and the second base and transfers heat from the heat spreader to both of the first and the second heat sink.

Abstract: A heat dissipation device includes a heat sink defining a pair of cutouts at two opposite sides thereof. The heat sink includes two pads fixed in the cutouts, respectively. Each pad defines a slot therein. A retention module supports the heat sink thereon, and extends a pair of clamping arms in the cutouts of the heat sink. Each clamping arm defines a slit. A clip includes two abutting portions rotatablely connecting with the pads and the clamping arms, and two pressing portions slidably received in the slots of the pads and the slits of the clamping arms. When the clip is moved to a locked position, the pressing portions of the clip press the pads downwardly a distance relative to the clamping arms so that the heat sink can have an intimate contact with an electronic device.

Abstract: A heat dissipation device includes a base including a base plate made of a first heat conductive material and a substrate made of a second heat conductive material having a heat conductivity lower than that of the first heat conductive material. The substrate comprises a frame with a window receiving the base plate therein and an engaging plate spanning over the window. A fin set includes a plurality of fins parallel with and spaced from each other, and is mounted on the base. A heat pipe has an evaporating section sandwiched between the base plate and the engaging plate, and two condensing sections extending through the fin set and thermally connecting therewith. The evaporating section has a substantially V-shaped configuration.

Abstract: A heat dissipation device includes a heat sink defining a pair of cutouts at two opposite sides thereof. The heat sink includes two pads fixed in the cutouts, respectively. Each pad defines a slot therein. A retention module supports the heat sink thereon, and extends a pair of clamping arms in the cutouts of the heat sink. Each clamping arm defines a slit. A clip includes two abutting portions rotatablely connecting with the pads and the clamping arms, and two pressing portions slidably received in the slots of the pads and the slits of the clamping arms. When the clip is moved to a locked position, the pressing portions of the clip press the pads downwardly a distance relative to the clamping arms so that the heat sink can have an intimate contact with an electronic device.

Abstract: A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality of air passages. The first and second fins are so arranged that thinner air passages and denser fin distribution in the middle along the extension direction of the air passages and wider air passages and lower fin distribution density at two ends are provided.

Abstract: A heat sink for dissipating heat from an electronic device includes a base for contacting the electronic device. A U-shaped heat pipe is fixed to the base and includes an evaporating portion contacting the base and two condensing portion extending from opposite ends of the evaporating portion and through a plurality of first fins stacked together parallel to each other. A plurality of second fins extends from the base towards the first fins and supports the first fins. A reinforcement is fixed on the base and joins with some of the first fins, thereby enhancing integrity of the first fins.

Abstract: A method for manufacturing a phase change type heat sink, includes following steps: (1) offering a workpiece as parent material and fixing it; (2) performing a cutting operation on an surface of the workpiece to form a cover integrated with a group of fins; (3) offering a tank with a cavity inside thereof and a quantity of working fluid contained in the cavity; (4) welding the cover and the tank together to seal the cavity to thereby achieve the phase change type heat sink.

Abstract: A heat dissipation device includes a first heat sink (10), a second heat sink (20) and four heat pipes (30) thermally connecting the first heat sink and second heat sink. The first heat sink comprises a plurality of first heat dissipation fins (14) and the second heat sink comprises a plurality of second heat dissipation fins (24). Each heat pipe comprises an evaporating portion (32) and a condensing portion (34). The evaporating portions of two heat pipes thermally engage in a base of the first heat sink and the condensing portions thereof connect the first and second heat dissipation fins. The evaporating portions of the other two heat pipes thermally engage in a base of the second heat sink and the condensing portions thereof connect the second and first heat dissipation fins.

Abstract: A fastener, for assembling a fan to a bracket, includes a shaft, and an expanding head extending from an end of the shaft. The shaft has a bulge formed at an opposite end thereof. A handle extends from the bulge of the shaft. The handle is used for facilitating an operator to manipulate the fastener to secure the fan and the bracket together. By pulling the handle of the fastener, the shaft of the fastener extends through the fan and the bracket to reach a position where the head and the bulge of the shaft of the fastener tightly sandwich the fan and the bracket therebetween.

Abstract: A heat sink includes a heat pipe having a hollow body with an airtight chamber defined therein, and a quantity of working fluid contained in the chamber. The heat sink further includes a plurality of fins integrally formed with the heat pipe and extending outwards from an outer surface of the body. A skiving is performed to a metal pipe to obtain the hollow body and the fins integrally extending from the hollow body. Accordingly, there is no interface heat resistance between the fins and the hollow body.

Abstract: A heat dissipation device for an electronic unit includes a heat sink (10), a pair of first heat pipes (20) and a pair of second heat pipes (30). The heat sink includes a base (12) for contacting with the electronic unit (42), a plate (14) spaced from the base, and a plurality of fins (16) arranged between the base and the plate. The first heat pipes are attached to the heat sink and include evaporating portions (22) sandwiched between the base and a bottom portion (162) of the fins for absorbing heat from the base, and condensing portions (24) thermally sandwiched between a top portion (164) of the fins and the plate. The second heat pipes are attached to the heat sink and sandwiched between the base and the bottom portion of the fins.

Abstract: A heat dissipation device includes a first heat sink (10), a second heat sink (20), a pair of heat pipes (30) connecting the first heat sink and the second heat sink and a fan assembly (40) located between the first heat sink and the second heat sink. The first heat sink comprises a base (12), a cover (14) and a plurality of heat dissipating fins (16) sandwiched between the base and the cover. The second heat sink comprises a plurality of cooling fins (22). Each heat pipe comprises three portions, respectively orderly sandwiched between the base and the heat dissipating fins, sandwiched between the cover and the heat dissipating fins and thermally extending in the cooling fins.

Abstract: A heat dissipation device for an electronic unit includes a heat sink (10), a pair of first heat pipes (20) and a pair of second heat pipes (30). The heat sink includes a base (12) for contacting with the electronic unit (42), a plate (14) spaced from the base, and a plurality of fins (16) arranged between the base and the plate. The first heat pipes are attached to the heat sink and include evaporating portions (22) sandwiched between the base and a bottom portion (162) of the fins for absorbing heat from the base, and condensing portions (24) thermally sandwiched between a top portion (164) of the fins and the plate. The second heat pipes are attached to the heat sink and sandwiched between the base and the bottom portion of the fins.

Abstract: A heat sink includes a base (10) and heat pipes (20). The base includes a bottom surface contacting with a heat-generating electronic component (100), an upper surface defining grooves (12) receiving the heat pipes therein. Evaporating sections (22) of the heat pipes are located near a first end portion (10a) and condensing sections (24) of the heat pipes are located near a second end portion (10b) of the base. A first fin assembly (30) is mounted on the upper surface and a second fin assembly (40) is mounted on the bottom surface of the base near the second end portion thereof. A fan (200) is located near the second end portion of the base.

Abstract: A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality of air passages. The first and second fins are so arranged that thinner air passages and denser fin distribution in the middle along the extension direction of the air passages and wider air passages and lower fin distribution density at two ends are provided.