Abstract: A heat sink with heat pipes includes a base (10). The base includes a bottom surface contacting a heat-generating component (40), an upper surface opposite to the bottom surface, and a plurality of grooves (14) defined on the upper surface of the base. The heat sink further includes two heat pipes (32, 36) received in the grooves, each heat pipe comprising an evaporating section (322, 362) and a condensing section (324, 364) respectively, wherein the evaporating sections of the heat pipes are closely arranged on a portion of the base, and wherein the condensing sections of the heat pipes spread out from said portion of the base by extending in the grooves to other parts of the base so that heat absorbed by the base from the heat-generating component can be evenly spread to the whole base.

Abstract: A heat sink assembly includes a heat sink (10), a fan cover (20) mounted on the heat sink and a fan (30) carried by the fan cover. The heat sink comprises a base (12) and a plurality of spaced heat dissipation fins (140) extending from the base. The spaced heat dissipation fins define a plurality of channels (16) extending through front and rear ends of the heat sink. A cavity (40) is formed between the front end of the heat sink and the fan cover. The front end of the heat sink is configured with an arced front edge or an inclined front edge.

Abstract: A heat dissipation device includes a first heat sink (10), a second heat sink (20), a pair of heat pipes (30) connecting the first heat sink and the second heat sink and a fan assembly (40) located between the first heat sink and the second heat sink. The first heat sink comprises a base (12), a cover (14) and a plurality of heat dissipating fins (16) sandwiched between the base and the cover. The second heat sink comprises a plurality of cooling fins (22). Each heat pipe comprises three portions, respectively orderly sandwiched between the base and the heat dissipating fins, sandwiched between the cover and the heat dissipating fins and thermally extending in the cooling fins.

Abstract: A heat dissipation device includes a first heat sink (10), a second heat sink (20) and four heat pipes (30) thermally connecting the first heat sink and second heat sink. The first heat sink comprises a plurality of first heat dissipation fins (14) and the second heat sink comprises a plurality of second heat dissipation fins (24). Each heat pipe comprises an evaporating portion (32) and a condensing portion (34). The evaporating portions of two heat pipes thermally engage in a base of the first heat sink and the condensing portions thereof connect the first and second heat dissipation fins. The evaporating portions of the other two heat pipes thermally engage in a base of the second heat sink and the condensing portions thereof connect the second and first heat dissipation fins.

Abstract: A heat sink for dissipating heat from an electronic device includes a base for contacting the electronic device. A U-shaped heat pipe is fixed to the base and includes an evaporating portion contacting the base and two condensing portion extending from opposite ends of the evaporating portion and through a plurality of first fins stacked together parallel to each other. A plurality of second fins extends from the base towards the first fins and supports the first fins. A reinforcement is fixed on the base and joins with some of the first fins, thereby enhancing integrity of the first fins.