Abstract: A container cap according to the present invention includes a lower cap combined with a container and comprising an opening communicating with an inside of the container; and an upper cap combined with the lower cap to cover the opening. Further, the upper cap includes a cover covering the opening; a rim provided around the cover and partly connected to the cover; a connection part connecting the rim and the cover; and a handle connected to the rim and having a round shape, which curves outwards from a center of the cover, viewed on a plane.

Abstract: A semiconductor apparatus may include a transmission control signal generation unit, a fuse signal transmission unit, a reception control signal generation unit and a fuse signal reception unit. The transmission control signal generation unit receives a clock signal and generates a plurality of divided clock signals based on the clock signal to output transmission control signals from the plurality of divided clock signals. The fuse signal transmission unit transmits fuse information in synchronization with the transmission control signals. The reception control signal generation unit receives the clock signal and generates the plurality of divided clock signals, and generates reception control signals based on the plurality of divided clock signals. The fuse signal reception unit receives the fuse information in synchronization with the reception control signals.

Abstract: Disclosed is a method of improving a sound quality, including: receiving a transmission signal of a first user equipment; removing noise in the transmission signal using noise information of the first user equipment side; performing speech reinforcement with respect to the noise removed transmission signal using noise information of a second user equipment side; and transmitting the speech reinforced transmission signal to the second user equipment.

Abstract: An apparatus and method for processing a digital image are provided, including a decoder that decodes a high-resolution image and outputs the decoded high-resolution image, a resizer that resizes a thumbnail image to a size to be displayed on a display, and a controller that outputs the resized thumbnail image on the display, then replaces the thumbnail image with the decoded high-resolution image.

Abstract: Disclosed is a multi-core processor, and more particularly, a method of optimizing performance of a multi-core processor having a hierarchical structure and a multi-core processor system for performing the method. To this end, the method of optimizing performance of a hierarchical multi-core processor including a plurality of kernel cores, each kernel core including a plurality of cores sharing a memory, the method includes calculating a correlation between a plurality of threads by a thread correlation managing module within a main processor; grouping the plurality of threads into two or more threads according to information on the calculated correlation by the main processor; and allocating each of the grouped threads within an equal group to each core within an equal kernel core of the hierarchical multi-core processor by a scheduler of the main processor.

Abstract: A repair circuit of a semiconductor apparatus includes a transmission control unit configured to generate first through nth (n is an integer equal to or greater than 2) control signals in response to a repair information signal, and enable all mth through nth control signals when the repair information signal indicating an mth (m is an integer equal to or greater than 1 and equal to or less than n) TSV is inputted; transmission units configured to allocate transmission paths for first through nth signals to first through nth TSVs and a repair TSV in response to the first through nth control signals; and receiving units configured to receive the signals transmitted from the first through nth TSVs and the repair TSV in response to the first through nth control signals.

Abstract: A lens unit composed of different materials includes a base and a lens. A part of a camera module of a different material from the lens is used as the base. The lens of optical resin is directly replicated on the base such that the lens is integrally formed on the base. A camera module is provided with the lens unit. The lens/lenses is/are formed on the single base/multiple bases to form the lens unit/units, using a die whose surface contacting the base slopes in relation to its central axis to allow the base to self-align.

Abstract: A wafer-scale array of optical packages and a method for fabricating the same. The wafer-scale array of optical packages includes at least one wafer-scale array of lens structures, including a wafer-scale array of first barrel structures and a wafer-scale array of lenses directly formed on the wafer-scale array of first barrel structures such that the wafer-scale array of lenses is integrally combined with the wafer-scale array of first barrel structures, the wafer-scale array of first barrel structures being made of a material different from a material of the lens of the wafer-scale array of lenses; and at least one wafer-scale array of second barrel structures stacked on and combined with the at least one wafer-scale array of lens structures.

Abstract: A semiconductor apparatus may include a transmission control signal generation unit, a fuse signal transmission unit, a reception control signal generation unit and a fuse signal reception unit. The transmission control signal generation unit receives a clock signal and generates a plurality of divided clock signals based on the clock signal to output transmission control signals from the plurality of divided clock signals. The fuse signal transmission unit transmits fuse information in synchronization with the transmission control signals. The reception control signal generation unit receives the clock signal and generates the plurality of divided clock signals, and generates reception control signals based on the plurality of divided clock signals. The fuse signal reception unit receives the fuse information in synchronization with the reception control signals.

Abstract: A semiconductor apparatus includes a signal transmission block and signal reception blocks. The signal transmission block is disposed in a first chip and configured to transmit fuse information in synchronization with transmission control signals. The signal reception blocks are respectively disposed in the first chip and a second chip and configured to receive the fuse information in synchronization with reception control signals.

Abstract: Disclosed is a method of improving a sound quality, including: receiving a transmission signal of a first user equipment; removing noise in the transmission signal using noise information of the first user equipment side; performing speech reinforcement with respect to the noise removed transmission signal using noise information of a second user equipment side; and transmitting the speech reinforced transmission signal to the second user equipment.

Abstract: Provided is a 3D stacked semiconductor integrated circuit including a plurality of chips coupled through a plurality of TSVs. A first chip among the plurality of chips is configured to detect and repair a defective TSV among the plurality of TSVs, and transmit repair information to remaining chips other than the first chip, and the remaining chips other than the first chip are configured to repair the defective TSV in response to the repair information.

Abstract: A semiconductor integrated circuit includes a plurality of slave chips each including a core area including a memory cell array, a global data line configured to transfer input/output data of the corresponding core area, and a first peripheral circuit area configured to interface the corresponding core area and the corresponding global data line, a plurality of data transfer through-chip vias vertically formed through the plurality of slave chips, respectively, and coupled to the respective global data lines of the slave chips, and a master chip including a second peripheral circuit area configured to provide an input/output interface between the data transfer through-chip vias and an external controller.

Abstract: A method of extracting information parts, and a recorded medium recording the method, for retrieving image sequence data are disclosed. According to an embodiment of the present invention, image frames included in an image sequence are converted to frames, in a quantity of n, including only the object that is separated from a background, and the corresponding shape descriptors, in a quantity of n, are extracted. The shape descriptors, in a quantity of n, are aligned according to a temporal order, to generate a shape sequence, which is frequency-converted along the time axis to obtain conversion coefficients having frequency information. Using coefficients in a low frequency area among the obtained conversion coefficients, a shape sequence descriptor is extracted. With this invention, video data expressing the motion of an object can be captured as an image sequence, and the similarity between video data can be distinguished by extracting information parts from each image sequence.

Abstract: A method for extracting a probability model value from a probability model table and a method and apparatus for decoding a symbol value using the same are provided. The method for extracting a probability model value from a probability model table includes: segmenting and reducing a probability model table including a plurality of probability model values; disposing indexes on the basis of the segmented and reduced probability model table; and searching the probability model table for a probability model value by using the disposed indexes.

Abstract: A repair circuit of a semiconductor apparatus includes a transmission control unit configured to generate first through nth (n is an integer equal to or greater than 2) control signals in response to a repair information signal, and enable all mth through nth control signals when the repair information signal indicating an mth (m is an integer equal to or greater than 1 and equal to or less than n) TSV is inputted; transmission units configured to allocate transmission paths for first through nth signals to first through nth TSVs and a repair TSV in response to the first through nth control signals; and receiving units configured to receive the signals transmitted from the first through nth TSVs and the repair TSV in response to the first through nth control signals.

Abstract: A circuit for testing a semiconductor apparatus includes a test voltage applying unit configured to apply a test voltage to a first end of a through-silicon via (TSV) in response to a test mode signal and a detecting unit configured to be connected to a second end of the TSV and detect a current outputted from the second end of the TSV.

Abstract: A lens unit composed of different materials includes a base and a lens. A part of a camera module of a different material from the lens is used as the base. The lens of optical resin is directly replicated on the base such that the lens is integrally formed on the base. A camera module is provided with the lens unit. The lens/lenses is/are formed on the single base/multiple bases to form the lens unit/units, using a die whose surface contacting the base slopes in relation to its central axis to allow the base to self-align.

Abstract: An internal voltage generating circuit capable of controlling a swing width of a detection signal in a semiconductor memory apparatus is provided. The internal voltage generating circuit of a semiconductor memory apparatus includes an internal voltage level detecting unit configured to compare an internal voltage with a target voltage and then generate a detection signal, and an internal voltage level control unit configured to control the internal voltage based on a voltage level of the detection signal, wherein the internal voltage level detecting unit is configured to control a swing width of the detection signal based on a voltage difference between the internal voltage and the target voltage.