Patents by Inventor Min TAO
Min TAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11917894Abstract: Provided are a method for preparing an organic electroluminescent device, an organic electroluminescent device and a display apparatus.Type: GrantFiled: March 4, 2019Date of Patent: February 27, 2024Assignee: GUANGZHOU NEW VISION OPTO-ELECTRONIC TECHNOLOGY CO., LTD.Inventors: Jianhua Zou, Miao Xu, Hong Tao, Lei Wang, Hongmeng Li, Wencong Liu, Hua Xu, Min Li, Junbiao Peng
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Publication number: 20240063199Abstract: Direct-bonded LED arrays and applications are provided. An example process fabricates a LED structure that includes coplanar electrical contacts for p-type and n-type semiconductors of the LED structure on a flat bonding interface surface of the LED structure. The coplanar electrical contacts of the flat bonding interface surface are direct-bonded to electrical contacts of a driver circuit for the LED structure. In a wafer-level process, micro-LED structures are fabricated on a first wafer, including coplanar electrical contacts for p-type and n-type semiconductors of the LED structures on the flat bonding interface surfaces of the wafer. At least the coplanar electrical contacts of the flat bonding interface are direct-bonded to electrical contacts of CMOS driver circuits on a second wafer.Type: ApplicationFiled: October 31, 2023Publication date: February 22, 2024Inventors: Min Tao, Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh
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Publication number: 20230317703Abstract: Direct-bonded LED arrays and applications are provided. An example process fabricates a LED structure that includes coplanar electrical contacts for p-type and n-type semiconductors of the LED structure on a flat bonding interface surface of the LED structure. The coplanar electrical contacts of the flat bonding interface surface are direct-bonded to electrical contacts of a driver circuit for the LED structure. In a wafer-level process, micro-LED structures are fabricated on a first wafer, including coplanar electrical contacts for p-type and n-type semiconductors of the LED structures on the flat bonding interface surfaces of the wafer. At least the coplanar electrical contacts of the flat bonding interface are direct-bonded to electrical contacts of CMOS driver circuits on a second wafer.Type: ApplicationFiled: June 6, 2023Publication date: October 5, 2023Inventors: Min Tao, Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh
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Patent number: 11715730Abstract: Direct-bonded LED arrays and applications are provided. An example process fabricates a LED structure that includes coplanar electrical contacts for p-type and n-type semiconductors of the LED structure on a flat bonding interface surface of the LED structure. The coplanar electrical contacts of the flat bonding interface surface are direct-bonded to electrical contacts of a driver circuit for the LED structure. In a wafer-level process, micro-LED structures are fabricated on a first wafer, including coplanar electrical contacts for p-type and n-type semiconductors of the LED structures on the flat bonding interface surfaces of the wafer. At least the coplanar electrical contacts of the flat bonding interface are direct-bonded to electrical contacts of CMOS driver circuits on a second wafer.Type: GrantFiled: May 21, 2021Date of Patent: August 1, 2023Assignee: ADEIA SEMICONDUCTOR TECHNOLOGIES LLCInventors: Min Tao, Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh
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Patent number: 11329034Abstract: Direct-bonded LED arrays and applications are provided. An example process fabricates a LED structure that includes coplanar electrical contacts for p-type and n-type semiconductors of the LED structure on a flat bonding interface surface of the LED structure. The coplanar electrical contacts of the flat bonding interface surface are direct-bonded to electrical contacts of a driver circuit for the LED structure. In a wafer-level process, micro-LED structures are fabricated on a first wafer, including coplanar electrical contacts for p-type and n-type semiconductors of the LED structures on the flat bonding interface surfaces of the wafer. At least the coplanar electrical contacts of the flat bonding interface are direct-bonded to electrical contacts of CMOS driver circuits on a second wafer.Type: GrantFiled: April 3, 2020Date of Patent: May 10, 2022Assignee: Invensas CorporationInventors: Min Tao, Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh
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Patent number: 11246230Abstract: Configurable smart object systems with methods of making modules and contactors are provided. Example systems implement machine learning based on neural networks that draw low power for use in smart phones, watches, drones, automobiles, and medical devices. Example assemblies can be configured from pluggable, interchangeable modules that have compatible ports for interconnecting and integrating functionally dissimilar sensor systems. An example method includes mounting an element of a configurable machine learning assembly on a substrate, creating at least one fold in the substrate, folding the substrate at the fold into a housing of a module of the configurable machine learning assembly, and adding a molding material to the housing to at least partially fill the module of the configurable machine learning assembly. The example module construction may also form contactors on folded edges of the module for making physical and electrical contact with other modules of the smart object machine learning assembly.Type: GrantFiled: September 26, 2018Date of Patent: February 8, 2022Assignee: Xcelsis CorporationInventors: Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara, Min Tao
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Patent number: 11239587Abstract: Configurable smart object systems with grid or frame-based connectors are provided. Example systems implement machine learning based on neural networks that draw low power for use in smart phones, watches, drones, automobiles, and medical devices, for example. Example assemblies can be configured from pluggable, interchangeable modules that have compatible ports with magnetic electrical contacts for interconnecting and integrating functionally dissimilar sensor systems. An example system has a clip attachable to a substrate for securing a smart object module to the substrate, and a housing of the clip with a geometry for aligning electrical contacts of the smart object module with electrical contacts of the substrate. The clip may have a compliant layer to provide spring, resilience, or pressure to securing the smart object module to the substrate. The clip may also integrate features of a secure digital (SD) port and a universal serial bus (USB) port.Type: GrantFiled: March 7, 2019Date of Patent: February 1, 2022Assignee: Xcelsis CorporationInventors: Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara, Min Tao
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Patent number: 11221513Abstract: An electronic device includes display layers such as liquid crystal display layers and a backlight unit that provides illumination for the display layers. The backlight unit includes light-emitting diodes that emit light into the edge of a light guide film. To minimize the inactive area of the display, the light-emitting diodes are tightly spaced to approximate a line light source instead of point light sources. Color and/or luminance compensation layers are incorporated at various locations within the backlight structures to ensure that the backlight provided to the display layers is homogenous. A thin-film transistor layer of the display is coupled to a printed circuit board by a flexible printed circuit. The flexible printed circuit has additional solder mask layers to improve robustness, encapsulation, and traces with a varying pitch.Type: GrantFiled: June 12, 2019Date of Patent: January 11, 2022Assignee: Apple Inc.Inventors: Supriya Goyal, Yuxi Zhao, Xinsheng Chu, Chan Hyuk Park, Min Tao, Wenyong Zhu
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Publication number: 20210288037Abstract: Direct-bonded LED arrays and applications are provided. An example process fabricates a LED structure that includes coplanar electrical contacts for p-type and n-type semiconductors of the LED structure on a flat bonding interface surface of the LED structure. The coplanar electrical contacts of the flat bonding interface surface are direct-bonded to electrical contacts of a driver circuit for the LED structure. In a wafer-level process, micro-LED structures are fabricated on a first wafer, including coplanar electrical contacts for p-type and n-type semiconductors of the LED structures on the flat bonding interface surfaces of the wafer. At least the coplanar electrical contacts of the flat bonding interface are direct-bonded to electrical contacts of CMOS driver circuits on a second wafer.Type: ApplicationFiled: May 21, 2021Publication date: September 16, 2021Inventors: Min Tao, Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh
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Publication number: 20210181511Abstract: Apparatus and method relating generally to electronics are disclosed. In one such an apparatus, a film assembly has an upper surface and a lower surface opposite the upper surface. A dielectric film of the film assembly has a structured profile along the upper surface or the lower surface for having alternating ridges and grooves in a corrugated section in an at rest state of the film assembly. Conductive traces of the film assembly conform to the upper surface or the lower surface in or on the dielectric film in the corrugated section.Type: ApplicationFiled: February 22, 2021Publication date: June 17, 2021Applicant: Invensas CorporationInventors: Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara, Min Tao
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Patent number: 10955671Abstract: Apparatus and method relating generally to electronics are disclosed. In one such an apparatus, a film assembly has an upper surface and a lower surface opposite the upper surface. A dielectric film of the film assembly has a structured profile along the upper surface or the lower surface for having alternating ridges and grooves in a corrugated section in an at rest state of the film assembly. Conductive traces of the film assembly conform to the upper surface or the lower surface in or on the dielectric film in the corrugated section.Type: GrantFiled: September 20, 2018Date of Patent: March 23, 2021Assignee: Invensas CorporationInventors: Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara, Min Tao
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Patent number: 10782485Abstract: Hardened fiber optic connectors having a mechanical splice assembly are disclosed. The mechanical splice assembly is attached to a first end of an optical waveguide such as an optical fiber of a fiber optic cable by way of a stub optical fiber, thereby connectorizing the hardened connector. In one embodiment, the hardened connector includes an inner housing having two shells for securing a tensile element of the cable and securing the mechanical splice assembly so that a ferrule assembly may translate. Further assembly of the hardened connector has the inner housing fitting into a shroud of the hardened connector. The shroud aides in mating the hardened connector with a complimentary device and the shroud may have any suitable configuration. The hardened connector may also include features for fiber buckling, sealing, cable strain relief or a pre-assembly for ease of installation.Type: GrantFiled: December 6, 2018Date of Patent: September 22, 2020Assignee: Corning Optical Communications LLCInventors: Michael de Jong, Wolf Peter Kluwe, Daniel Leyva, Jr., Min Tao
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Patent number: 10734759Abstract: Configurable smart object systems with magnetic contacts and magnetic assembly are provided. Example systems implement machine learning based on neural networks that draw low power for use in smart phones, watches, drones, automobiles, and medical devices, for example. Example assemblies can be configured from pluggable, interchangeable modules that have compatible ports with magnetic electrical contacts for interconnecting and integrating functionally dissimilar sensor systems. The magnetic electrical contacts physically couple the interfaces together or to a motherboard socket while providing an electrical coupling across the coupled magnetic contacts. The magnetic electrical contacts may arrayed in a reversible configuration so that a module or plug connection is reversible. A controller may dynamically assign power, ground, and data channels to the magnetic electrical contacts on the fly as the system is configured or reconfigured.Type: GrantFiled: March 7, 2019Date of Patent: August 4, 2020Assignee: Xcelsis CorporationInventors: Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara, Min Tao
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Publication number: 20200235085Abstract: Direct-bonded LED arrays and applications are provided. An example process fabricates a LED structure that includes coplanar electrical contacts for p-type and n-type semiconductors of the LED structure on a flat bonding interface surface of the LED structure. The coplanar electrical contacts of the flat bonding interface surface are direct-bonded to electrical contacts of a driver circuit for the LED structure. In a wafer-level process, micro-LED structures are fabricated on a first wafer, including coplanar electrical contacts for p-type and n-type semiconductors of the LED structures on the flat bonding interface surfaces of the wafer. At least the coplanar electrical contacts of the flat bonding interface are direct-bonded to electrical contacts of CMOS driver circuits on a second wafer.Type: ApplicationFiled: April 3, 2020Publication date: July 23, 2020Applicant: Invensas CorporationInventors: Min Tao, Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh
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Publication number: 20200133046Abstract: An electronic device may include display layers such as liquid crystal display layers and a backlight unit that provides illumination for the display layers. The backlight unit may include light-emitting diodes that emit light into the edge of a light guide film. To minimize the inactive area of the display, the light-emitting diodes may be tightly spaced to approximate a line light source instead of point light sources. Color and/or luminance compensation layers may be incorporated at various locations within the backlight structures to ensure that the backlight provided to the display layers is homogenous. A thin-film transistor layer of the display may be coupled to a printed circuit board by a flexible printed circuit. The flexible printed circuit may have additional solder mask layers to improve robustness, may include encapsulation, and may have traces with a varying pitch.Type: ApplicationFiled: June 12, 2019Publication date: April 30, 2020Inventors: Supriya Goyal, Yuxi Zhao, Xinsheng Chu, Chan Hyuk Park, Min Tao, Wenyong Zhu
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Patent number: 10629577Abstract: Direct-bonded LED arrays and applications are provided. An example process fabricates a LED structure that includes coplanar electrical contacts for p-type and n-type semiconductors of the LED structure on a flat bonding interface surface of the LED structure. The coplanar electrical contacts of the flat bonding interface surface are direct-bonded to electrical contacts of a driver circuit for the LED structure. In a wafer-level process, micro-LED structures are fabricated on a first wafer, including coplanar electrical contacts for p-type and n-type semiconductors of the LED structures on the flat bonding interface surfaces of the wafer. At least the coplanar electrical contacts of the flat bonding interface are direct-bonded to electrical contacts of CMOS driver circuits on a second wafer.Type: GrantFiled: March 13, 2018Date of Patent: April 21, 2020Assignee: Invensas CorporationInventors: Min Tao, Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh
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Publication number: 20190280421Abstract: Configurable smart object systems with grid or frame-based connectors are provided. Example systems implement machine learning based on neural networks that draw low power for use in smart phones, watches, drones, automobiles, and medical devices, for example. Example assemblies can be configured from pluggable, interchangeable modules that have compatible ports with magnetic electrical contacts for interconnecting and integrating functionally dissimilar sensor systems. An example system has a grid of frames attachable to a motherboard, panel, appliance, or machine, capable of securing and connecting multiple modules of the smart object system to the motherboard, panel, appliance, or machine. Each frame has at least a magnet or at least a clip for physically securing the single module within each frame. Each frame also has at least an electrical contact for electrically connecting each single module to the motherboard, panel, appliance, or machine through each respective frame.Type: ApplicationFiled: March 7, 2019Publication date: September 12, 2019Applicant: Xcelsis CorporationInventors: Belgacem HABA, Ilyas MOHAMMED, Gabriel Z. GUEVARA, Min TAO
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Publication number: 20190280408Abstract: Configurable smart object systems with grid or frame-based connectors are provided. Example systems implement machine learning based on neural networks that draw low power for use in smart phones, watches, drones, automobiles, and medical devices, for example. Example assemblies can be configured from pluggable, interchangeable modules that have compatible ports with magnetic electrical contacts for interconnecting and integrating functionally dissimilar sensor systems. An example system has a clip attachable to a substrate for securing a smart object module to the substrate, and a housing of the clip with a geometry for aligning electrical contacts of the smart object module with electrical contacts of the substrate. The clip may have a compliant layer to provide spring, resilience, or pressure to securing the smart object module to the substrate. The clip may also integrate features of a secure digital (SD) port and a universal serial bus (USB) port.Type: ApplicationFiled: March 7, 2019Publication date: September 12, 2019Applicant: Xcelsis CorporationInventors: Belgacem HABA, Ilyas MOHAMMED, Gabriel Z. GUEVARA, Min TAO
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Publication number: 20190280428Abstract: Configurable smart object systems with magnetic contacts and magnetic assembly are provided. Example systems implement machine learning based on neural networks that draw low power for use in smart phones, watches, drones, automobiles, and medical devices, for example. Example assemblies can be configured from pluggable, interchangeable modules that have compatible ports with magnetic electrical contacts for interconnecting and integrating functionally dissimilar sensor systems. The magnetic electrical contacts physically couple the interfaces together or to a motherboard socket while providing an electrical coupling across the coupled magnetic contacts. The magnetic electrical contacts may arrayed in a reversible configuration so that a module or plug connection is reversible. A controller may dynamically assign power, ground, and data channels to the magnetic electrical contacts on the fly as the system is configured or reconfigured.Type: ApplicationFiled: March 7, 2019Publication date: September 12, 2019Applicant: Xcelsis CorporationInventors: Belgacem HABA, Ilyas MOHAMMED, Gabriel Z. GUEVARA, Min TAO
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Publication number: 20190273016Abstract: Apparatus and method relating generally to electronics are disclosed. In one such an apparatus, a film assembly has an upper surface and a lower surface opposite the upper surface. A dielectric film of the film assembly has a structured profile along the upper surface or the lower surface for having alternating ridges and grooves in a corrugated section in an at rest state of the film assembly. Conductive traces of the film assembly conform to the upper surface or the lower surface in or on the dielectric film in the corrugated section.Type: ApplicationFiled: September 20, 2018Publication date: September 5, 2019Applicant: Invensas CorporationInventors: Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara, Min Tao