Abstract: Face mask including a mask body, lining around an edge of the mask body, and a nose strip, wherein the complete face mask including the mask body, the lining, and the nose strip is made of a single recyclable material, such as PET. The face mask can be ground directly for recycling without first separating the parts of the face mask.

Abstract: A package substrate and manufacturing method thereof are provided. The package substrate includes a substrate and an electronic component. The substrate includes a cavity. The electronic component is disposed in the cavity. The electronic component includes a first region and a second region, and an optical recognition rate of the first region is distinct from that of the second region.

Abstract: A balanced-lattice-ledge nucleant having ledge inducing local densification of proteins and a balanced-lattice inducing self-organized crystal packing. Using this balanced-lattice-ledge nucleant enhances nucleation of protein crystals.

Abstract: A display device and an operating method of the display device are provided. The display device includes a first light emitting diode (LED), a first switch, a second switch, a second LED, a third switch, and a first controller. A first terminal of the first switch receives a first electrical signal. A first terminal of the second switch receives a second electrical signal. A first terminal of the third switch receives a third electrical signal. Here, whether the first switch, the second switch, and the third switch are switched on or off is determined by whether the first LED and the second LED are damaged or not. The first controller is configured to detect whether the first LED and the second LED are damaged or not, generate the second electrical signal and the electrical signal, and generate a plurality of control signals controlling the first switch to the third switch.

Abstract: A substrate structure, a method for manufacturing the same and a semiconductor package structure including the same are provided. The substrate structure includes a substrate, a first electronic component, a second electronic component and a plurality of metal layers. The first electronic component is disposed within the substrate. The second electronic component is disposed within the substrate and arranged in a horizontal direction with the first electronic component. The metal layers are disposed above an upper surface of the substrate. The number of metal layers above the first electronic component is greater than the number of metal layers above the second electronic component.

Abstract: A package substrate and manufacturing method thereof are provided. The package substrate includes a substrate and an electronic component. The substrate includes a cavity. The electronic component is disposed in the cavity. The electronic component includes a first region and a second region, and an optical recognition rate of the first region is distinct from that of the second region.

Abstract: A substrate structure, a method for manufacturing the same and a semiconductor package structure including the same are provided. The substrate structure includes a substrate, a first electronic component, a second electronic component and a plurality of metal layers. The first electronic component is disposed within the substrate. The second electronic component is disposed within the substrate and arranged in a horizontal direction with the first electronic component. The metal layers are disposed above an upper surface of the substrate. The number of metal layers above the first electronic component is greater than the number of metal layers above the second electronic component.

Abstract: The present disclosure provides a package substrate and method of manufacturing the same. The package substrate includes a substrate, an electronic component and a conductive trace. The electronic component is disposed in the substrate, and the electronic component includes a magnetic layer and a conductive wire. The conductive wire includes a first section embedded in the magnetic layer, and a second section connected to the first section and thinner than the first section. A first upper surface of the first section is covered by the magnetic layer, a second upper surface of the second section is lower than the first upper surface, and the magnetic layer includes a first recess disposed in the upper surface and exposing the second upper surface of the second section. The first conductive trace is in the first recess and electrically connected to the second upper surface of the second section of the conductive wire.

Abstract: The present disclosure provides a package substrate and method of manufacturing the same. The package substrate includes a substrate, an electronic component and a conductive trace. The electronic component is disposed in the substrate. The electronic component includes a conductive wire comprising an alignment mark section and a connection section, and a magnetic layer partially covering the conductive wire. The magnetic layer includes an alignment window disposed in an upper surface of the magnetic layer and exposing a first upper surface of the alignment mark section, and a recess disposed in the upper surface of the magnetic layer and exposing a second upper surface of the connection section. The conductive trace is in the recess and electrically connected to the second upper surface of the connection section of the conductive wire.

Abstract: A package substrate and manufacturing method thereof are provided. The package substrate includes a substrate and an electronic component. The substrate includes a cavity. The electronic component is disposed in the cavity. The electronic component includes a first region and a second region, and an optical recognition rate of the first region is distinct from that of the second region.

Abstract: A semiconductor device package is provided. The semiconductor device package includes providing a first substrate, a computing unit and a power module. The first substrate has a first surface and a second surface opposite to the first surface. The computing unit is adjacent to the first surface. The computing unit includes a semiconductor die. The power module is adjacent to the second surface. The power module includes a power element and a passive element. Each of the semiconductor die, the power element, and the passive element is vertically arranged with respect to each other, and the passive elements are assembled between the semiconductor die and the power element.

Abstract: The present disclosure provides a package substrate and method of manufacturing the same. The package substrate includes a substrate, an electronic component and a conductive trace. The electronic component is disposed in the substrate, and the electronic component includes a magnetic layer and a conductive wire. The conductive wire includes a first section embedded in the magnetic layer, and a second section connected to the first section and thinner than the first section. A first upper surface of the first section is covered by the magnetic layer, a second upper surface of the second section is lower than the first upper surface, and the magnetic layer includes a first recess disposed in the upper surface and exposing the second upper surface of the second section. The first conductive trace is in the first recess and electrically connected to the second upper surface of the second section of the conductive wire.

Abstract: The present disclosure provides a package substrate and method of manufacturing the same. The package substrate includes a substrate, an electronic component and a conductive trace. The electronic component is disposed in the substrate, and the electronic component includes a magnetic layer and a conductive wire. The conductive wire includes a first section embedded in the magnetic layer, and a second section connected to the first section and thinner than the first section. A first upper surface of the first section is covered by the magnetic layer, a second upper surface of the second section is lower than the first upper surface, and the magnetic layer includes a first recess disposed in the upper surface and exposing the second upper surface of the second section. The first conductive trace is in the first recess and electrically connected to the second upper surface of the second section of the conductive wire.

Abstract: The present disclosure provides a package substrate and method of manufacturing the same. The package substrate includes a substrate, an electronic component and a conductive trace. The electronic component is disposed in the substrate. The electronic component includes a conductive wire comprising an alignment mark section and a connection section, and a magnetic layer partially covering the conductive wire. The magnetic layer includes an alignment window disposed in an upper surface of the magnetic layer and exposing a first upper surface of the alignment mark section, and a recess disposed in the upper surface of the magnetic layer and exposing a second upper surface of the connection section. The conductive trace is in the recess and electrically connected to the second upper surface of the connection section of the conductive wire.

Abstract: A substrate structure, a method for manufacturing the same and a semiconductor package structure including the same are provided. The substrate structure includes a substrate, a first electronic component, a second electronic component and a plurality of metal layers. The first electronic component is disposed within the substrate. The second electronic component is disposed within the substrate and arranged in a horizontal direction with the first electronic component. The metal layers are disposed above an upper surface of the substrate. The number of metal layers above the first electronic component is greater than the number of metal layers above the second electronic component.

Abstract: A display device and an operating method of the display device are provided. The display device includes a first light emitting diode (LED), a first switch, a second switch, a second LED, a third switch, and a first controller. A first terminal of the first switch receives a first electrical signal. A first terminal of the second switch receives a second electrical signal. A first terminal of the third switch receives a third electrical signal. Here, whether the first switch, the second switch, and the third switch are switched on or off is determined by whether the first LED and the second LED are damaged or not. The first controller is configured to detect whether the first LED and the second LED are damaged or not, generate the second electrical signal and the electrical signal, and generate a plurality of control signals controlling the first switch to the third switch.

Abstract: A display module including display pixels, driving circuit and first switches is provided. The display pixels are arranged in columns and rows in the display area, and every display pixel includes sub-pixels. The display pixels form pixel rows along the first direction, and the sub-pixels of the display pixels form sub-pixel columns along the second direction. The color of the light emitting from the sub-pixels of the same sub-pixel column are substantially the same. The first direction and the second direction are substantially perpendicular. The driving circuit includes signal connectors, and every signal connector connects one of the pixel rows. The first switch is connected between a power source and one of the pixel rows, transmitting driving signal. The first switch is controlled by the driving circuit. A display device and a driving method are also provided.

Abstract: The present disclosure provides a playing device and a playing method based on the playing device. The playing device includes a headphone interface circuit and a speaker circuit. Signal input terminals of the headphone interface circuit and the speaker circuit are directly connected to a sound source output terminal of the playing device. The signal input terminal of the speaker circuit is connected to a first enable signal output terminal when the first enable signal output terminal outputs a matched enable signal, a sound source signal output from the sound source output terminal is played by the speaker circuit. The signal input terminal of the headphone interface circuit is connected to a second enable signal output terminal. When a headphone is inserted and the second enable signal output terminal outputs a matched enable signal, a sound source signal output from the sound source output terminal is played by the headphone.

Abstract: A semiconductor device package is provided. The semiconductor device package includes providing a first substrate, a computing unit and a power module. The first substrate has a first surface and a second surface opposite to the first surface. The computing unit is adjacent to the first surface. The computing unit includes a semiconductor die. The power module is adjacent to the second surface. The power module includes a power element and a passive element. Each of the semiconductor die, the power element, and the passive element is vertically arranged with respect to each other, and the passive elements are assembled between the semiconductor die and the power element.

Abstract: The present disclosure provides a signal transmission circuit, a signal transmission system, a signal transmission method, and an intelligent terminal. The signal transmission circuit includes an earphone interface circuit, a comparison circuit, and a control circuit. The earphone interface circuit is configured for connection to an audio receiving device. The comparison circuit is configured to acquire a voltage value corresponding to an impedance of the audio receiving device via the earphone interface circuit, the voltage value is compared with a reference voltage of the comparison circuit, to output a comparison result to the control circuit. The control circuit judges whether the audio receiving device is a digital audio device according to the comparison result, and switches the earphone interface circuit to digital output when the audio receiving device is determined to be a digital audio device.