Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A gripper includes a body part, a finger base part coupled to the body part, and a finger part coupled to a first side of the body part or the finger base part and coupled to the body part or the finger base part to be reciprocal, wherein the finger part comprises a first link structure and a second link structure, sides of which are coupled to the finger base part, respectively, and wherein, in the first link structure and the second link structure, a first support area of the first link structure and a second support area of the second link structure reciprocate in only one of a plurality of directions that cross a direction in which the finger part reciprocates with respect to the finger base part.

Abstract: A gripper includes a body part, a finger base part coupled to the body part to be rotatable, the finger base part including a first finger base part and a second finger base part configured such that when the first finger base part is rotated in a first direction with respect to the body part, the second finger base part is provided to be rotatable in a second direction opposite the first direction with respect to the body part, and a finger part coupled to a first side of the body part or the finger base part to be reciprocal.

Abstract: An embodiment device includes an input module including a motor configured to generate a rotational force, an output module configured to receive power from the input module to be rotatable, and a connection module having a first side coupled to the input module and a second side, opposite the first side, coupled to the output module, wherein the connection module is configured to transmit the power from the input module to the output module.

Abstract: The present invention relates to a photoresist composition capable of realizing excellent pattern performance during formation of fine patterns, and of preparing a photoresist film that is excellent in chemical stability of a plating solution, and a photoresist film using the same.

Abstract: The present invention provides a positive photoresist composition having excellent storage stability, sensitivity, developing properties, plating resistance, and heat resistance. More specifically, a specific dissolution inhibitor in the form of an oligomer having the same repeating unit structure as the resin contained in the photoresist composition is applied to said composition.

Abstract: A chemically amplified photoresist composition comprising a triazole-based plasticizer and an alkali developable resin, which is capable of minimizing cracking of a photoresist obtained from the composition and improving adhesion to a substrate and sensitivity, and a photoresist film comprising a cured product of the chemically amplified photoresists composition.

Abstract: A non-ionic photoacid generator and a chemically amplified positive-type photoresist composition for a thick film including the non-ionic photoacid generator. The non-ionic photoacid generator may not only exhibit high solubility in a solvent of the photoresist composition, but may also exhibit chemical and thermal stability and high sensitivity. In particular, the non-ionic photoacid generator is decomposed by light to generate an acid, and at the same time, can exhibit a corrosion preventing effect on a metal substrate.

Abstract: The present invention relates to a chemically amplified photoresist composition including an alkali-soluble resin and a polymeric photo-acid generator having a predetermined structure, a photoresist pattern produced from the chemically amplified photoresist composition, and a method for preparing the chemically amplified photoresist pattern.

Abstract: The present invention relates to a positive photoresist composition including an acrylic resin including a repeat unit of a specific structure, and a photosensitive acid-generating compound, a photoresist pattern using the same, and a method for manufacturing a pattern.

Abstract: The present invention relates to a photoacid generator, and a chemically amplified photoresist composition for a thick film including the same, wherein the photoacid generator has excellent solubility and sensitivity, and also has an anti-corrosion effect, in addition to the effect as a photoacid generator. Thus, a chemically amplified photoresist composition for a thick film including the photoacid generator reduces scum and/or footing at the exposed part after development. The photoacid generator represented by the following Chemical Formula 1: In Chemical Formula 1, the definition of each substituents is the same as the detail description of the specification.

Abstract: The present invention provides a positive photoresist composition having excellent storage stability, sensitivity, developing properties, plating resistance, and heat resistance. More specifically, a specific dissolution inhibitor in the form of an oligomer having the same repeating unit structure as the resin contained in the photoresist composition is applied to said composition.

Abstract: The present invention relates to a chemically amplified photoresist composition including an alkali-soluble resin and a polymeric photo-acid generator having a predetermined structure, a photoresist pattern produced from the chemically amplified photoresist composition, and a method for preparing the chemically amplified photoresist pattern.

Abstract: The present invention relates to a photoresist composition capable of realizing excellent pattern performance during formation of fine patterns, and of preparing a photoresist film that is excellent in chemical stability of a plating solution, and a photoresist film using the same.

Abstract: A photoresist composition capable of forming a pattern in which a footing phenomenon is suppressed while being highly sensitive during formation of a fine pattern on a metal surface substrate, and capable of producing a photoresist film that is excellent in chemical stability, and a photoresist film using the photoresist composition.

Abstract: The present invention relates to a photoacid generator, and a chemically amplified photoresist composition for a thick film including the same, wherein the photoacid generator has excellent solubility and sensitivity, and also has an anti-corrosion effect, in addition to the effect as a photoacid generator. Thus, a chemically amplified photoresist composition for a thick film including the photoacid generator reduces scum and/or footing at the exposed part after development. The photoacid generator represented by the following Chemical Formula 1: In Chemical Formula 1, the definition of each substituents is the same as the detail description of the specification.

Abstract: A non-ionic photoacid generator and a chemically amplified positive-type photoresist composition for a thick film including the non-ionic photoacid generator. The non-ionic photoacid generator may not only exhibit high solubility in a solvent of the photoresist composition, but may also exhibit chemical and thermal stability and high sensitivity. In particular, the non-ionic photoacid generator is decomposed by light to generate an acid, and at the same time, can exhibit a corrosion preventing effect on a metal substrate.

Abstract: A chemically amplified photoresist composition comprising a triazole-based plasticizer and an alkali developable resin, which is capable of minimizing cracking of a photoresist obtained from the composition and improving adhesion to a substrate and sensitivity, and a photoresist film comprising a cured product of the chemically amplified photoresists composition.

Abstract: The present invention relates to a positive photoresist composition including an acrylic resin including a repeat unit of a specific structure, and a photosensitive acid-generating compound, a photoresist pattern using the same, and a method for manufacturing a pattern.

Abstract: Provided is a complex material that includes a first metal deposition layer, a first thermosetting resin layer positioned on one side of the first metal deposition layer, and a second thermosetting resin layer positioned on the other side of the first metal deposition layer.