Abstract: Provided is an food packing material, manufacturing method and mold thereof having hydrophobicity including a number of columns formed in one side of food packing material. The disclosure may provide food packing material, manufacturing method and mold thereof in which an amount of contents off a wall of the food packing material may be minimized by hydrophobicity.

Abstract: A method of forming a metal thin film can reduce leakage current while improving electric properties by improving step coverage of a device. The method of forming a metal thin film includes supplying a metal precursor including chlorine, purging byproducts produced after the supplying of the metal precursor by injecting a purge gas, supplying a reactant to allow the reactant and the metal precursor to react with each other to form a thin film layer, and purging the byproducts produced after the reaction by injecting a purge gas, wherein before the supplying of the metal precursor, the method further includes supplying a reactant to be adsorbed on a treated product.

Abstract: Methods of fabricating a semiconductor device include forming a deposited film on a semiconductor substrate in a process chamber by repeatedly forming unit layers on the semiconductor substrate. The unit layer is formed by forming a preliminary unit layer on the semiconductor substrate by supplying a process material including a precursor material and film-control material into the process chamber, purging the process chamber, forming a unit layer from the preliminary unit layer, and again purging the process chamber. The precursor material includes a central atom and a ligand bonded to the central atom, and the film-control material includes a hydride of the ligand.

Abstract: An upper body support apparatus for toilets which enables a user to place his/her arms thereon when having a bowel movement. The upper body support apparatus includes a support board, which supports the arms of the user thereon, and a horizontal shaft, which provides a path, along which the support board slides relative to the horizontal shaft. The upper body support apparatus further includes a hinge unit, which supports a first end of the horizontal shaft such that the horizontal shaft is rotatable upwards or downwards within an angular range of 90° around the first end thereof, and a vertical frame, which supports the hinge unit and receives therein a drive unit, which rotates the hinge unit to the left or the right or moves the hinge unit upwards or downwards.

Abstract: A variable resistance memory device includes a variable resistance memory cell, and a by-pass circuit configured to electrically by-pass a programming pulse supplied to the variable resistance memory cell after a resistive state of the variable resistance memory cell has changed in response to the programming pulse.

Abstract: A shield can fixing device of an electronic device is provided. The fixing device includes a base having a specific length and attached to a shield can fixing line of the printed circuit board, a pair of panels, each of which is bent upwards and formed on the base to have a slit between them for inserting a lateral portion of the shield can, at least one opening portion formed in any one or both of the panels, and an insertion protrusion formed in the lateral portion located in a corresponding position to the opening portion in a protruding manner to ensure a fixing force of the shield can. The shield can fixing device is fixed by inserting a lateral portion of a shield can between double walls.

Abstract: The present invention relates to a composition containing a paprika extract as an active ingredient, and more particularly to a pharmaceutical composition or health functional food for preventing or treating inflammatory, allergic or asthma disease, which contains a paprika extract. Particularly, paprika is a natural food which is readily available to anyone, and thus does not cause adverse effects even when it is taken for a long period of time.

Abstract: A method of fabricating a semiconductor device includes depositing tungsten on an insulating layer in which a contact hole is formed by chemical vapor deposition (CVD), performing chemical mechanical planarization (CMP) on the tungsten to expose the insulating layer and form a tungsten contact plug, and performing rapid thermal oxidation (RTO) on the tungsten contact plug in an oxygen atmosphere such that the tungsten expands volumetrically into tungsten oxide (W?O?).

Abstract: Multi-level nonvolatile memory devices using variable resistive elements, the multi-level nonvolatile memory devices including a word line, a bit line, and a multi-level memory cell coupled between the word line and the bit line, the multi-level memory cell having first resistance level and a second resistance level higher than the first resistance level when the first and second write biases having the same polarity are applied thereto, and a third resistance level and a fourth resistance level ranging between the first and second resistance levels, when third and fourth write biases having different polarities from each other are applied thereto.

Abstract: The embodiment of the present invention provides an ultrasound diagnostic system, including: an ultrasound diagnosis unit for transmitting ultrasound signals to a target object and receiving ultrasound echo signals to acquire B-mode image signals and Doppler spectrum image signals; a processor for forming at least one B-mode image based on the B-mode image signals and forming a plurality of Doppler spectrum images for a plurality of sample volumes designated on the B-mode image based on the Doppler spectrum image signals; a user input unit for allowing a user to input selection information indicating locations and sizes of the plurality of sample volumes; and an image display unit for displaying at least one B-mode image and the plurality of Doppler spectrum images.

Abstract: Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.

Abstract: To form a dielectric layer, an organometallic precursor is adsorbed on a substrate loaded into a process chamber. The organometallic precursor includes a central metal and ligands bound to the central metal. An inactive oxidant is provided onto the substrate. The inactive oxidant is reactive with the organometallic precursor. An active oxidant is also provided onto the substrate. The active oxidant has a higher reactivity than that of the inactive oxidant.

Abstract: Provided is a data storage device. The data storage device includes an interface, a buffer controller, a memory controller, a non-volatile memory, and a self-powered semiconductor device adjacent to and electrically connected to the buffer controller. The self-powered semiconductor device includes a semiconductor chip and a rechargeable micro-battery attached to the semiconductor chip. The rechargeable micro-battery includes a first current collector and a second current collector, which face each other, a first polarizing electrode in contact with the first current collector and facing the second current collector, a second polarizing electrode in contact with the second current collector and facing the first polarizing electrode, and an electrolyte layer formed between the first and second polarizing electrodes.

Abstract: Provided is a method of forming a metal thin film which can reduce leakage current while improving electric properties by improving step coverage of a device. The method of forming a metal thin film includes supplying a metal precursor including chlorine, purging byproducts produced after the supplying of the metal precursor by injecting a purge gas, supplying a reactant to allow the reactant and the metal precursor to react with each other to form a thin film layer, and purging the byproducts produced after the reaction by injecting a purge gas, wherein before the supplying of the metal precursor, the method further includes supplying a reactant to be adsorbed on a treated product.

Abstract: A display panel and a method of manufacturing the same are provided. The display panel includes a plurality of chip panels, each chip panel having an upper surface, a lower surface disposed parallel to the upper surface, a side surface between the upper surface and the lower surface and a connection portion between the side surface and at least one of the upper surface and the lower surface, the connection portion having a rounded configuration, and an adhesive layer interposed between the chip panels in order to vertically stack the chip panels to connect the chip panels. Therefore, in the display panel, the strength of the edge portion can be improved. Also, by forming a connection portion, a stress can be suppressed from being concentrated at the edge portion by an external mechanical stress.