Abstract: Phase change memory devices include a heating electrode on a substrate and a phase change material pattern on the heating electrode. An adhesive pattern is disposed between the heating electrode and the phase change material pattern. The adhesive pattern contains carbon. Methods of fabricating phase change memory devices are also provided.

Abstract: An initialization file download method of a cable modem includes the steps of: registering configuration file name information in a DHCP server; receiving the configuration file name information registered in the DHCP server; comparing the received first configuration file name information with a previously stored second configuration file name information; downloading the received first configuration file name information, if the received first configuration file name/version is more updated file than the second configuration file name/version upon comparison; updating the memory with the downloaded first configuration file name information; and registering a cable modem by using the received first configuration file name information. Since the configuration file for initializing the cable modem is downloaded, there is no need to download the configuration file in the initializing process, so that the time required for initializing process can be shortened at the maximum.

Abstract: A method of fabricating and mounting a flip chip includes using an environmentally friendly plasma gas, which minimizes safety hazards during an implementation of the method and does not require an additional heat source during a reflow process thereof. That is, the method includes reflowing a solder bump using an argon-hydrogen plasma process. The argon-hydrogen plasma process used to fabricate the flip chip includes maintaining a pressure in a chamber at 250 to 270 mtorr, feeding a mixed gas of argon with 10 to 20% hydrogen to the chamber to generate a plasma with power of 100 to 200 W, and exposing the flip chip to the plasma for 30 to 120 seconds. Additionally, an argon-hydrogen plasma process used to mount the flip chip includes maintaining pressure in a chamber at 100 to 400 mtorr, feeding a mixed gas of argon with 0 to 20% hydrogen to the chamber to generate a plasma with power of 10 to 50 W, and exposing the flip chip to the plasma for 10 to 120 seconds.

Abstract: A method of surface-mounting a semiconductor chip on a PCB, for mounting a flip chip type semiconductor chip on the PCB mounted with electronic components, that includes forming a solder bump on a conductive contact area of each semiconductor chip on a back of a semiconductor wafer mounted with a plurality of semiconductor chips, injecting underfill material on the area of the semiconductor wafer formed with the solder bump, partially hardening the underfill material to have cohesive properties, severing the semiconductor wafer into a plurality of individual semiconductor chips, arranging the severed semiconductor chips having the hardened underfill material on the PCB, and heating the PCB with a predetermined temperature.

Abstract: A method of fabricating and mounting a flip chip includes using an environmentally friendly plasma gas, which minimizes safety hazards during an implementation of the method and does not require an additional heat source during a reflow process thereof. That is, the method includes reflowing a solder bump using an argon-hydrogen plasma process. The argon-hydrogen plasma process used to fabricate the flip chip includes maintaining a pressure in a chamber at 250 to 270 mtorr, feeding a mixed gas of argon with 10 to 20% hydrogen to the chamber to generate a plasma with power of 100 to 200 W, and exposing the flip chip to the plasma for 30 to 120 seconds. Additionally, an argon-hydrogen plasma process used to mount the flip chip includes maintaining pressure in a chamber at 100 to 400 mtorr, feeding a mixed gas of argon with 0 to 20% hydrogen to the chamber to generate a plasma with power of 10 to 50 W, and exposing the flip chip to the plasma for 10 to 120 seconds.

Abstract: In a cable modem network system and a method for selecting an upstream channel in a cable modem, a time required for an initialization of a cable modem can be reduced by grouping cable modems by a certain units and selecting an upstream channel on the basis of upstream channel group information and preset upstream channel information. A cable modem network system includes a CMTS (cable modem termination system) grouping cable modems by a certain units and transmitting UCDs (upstream channel descriptors) information including upstream channel group information according to the grouping and a cable modem selecting an upstream channel on the basis of the upstream channel group information included in the UCDs information and preset upstream channel information.

Abstract: An initialization file download method of a cable modem includes the steps of: registering configuration file name information in a DHCP server; receiving the configuration file name information registered in the DHCP server; comparing the received first configuration file name information with a previously stored second configuration file name information; downloading the received first configuration file name information, if the received first configuration file name/version is more updated file than the second configuration file name/version upon comparison; updating the memory with the downloaded first configuration file name information; and registering a cable modem by using the received first configuration file name information. Since the configuration file for initializing the cable modem is downloaded, there is no need to download the configuration file in the initializing process, so that the time required for initializing process can be shortened at the maximum.