Abstract: Provided is a method and apparatus for ensuring a deterministic execution characteristic of an application program to perform data processing and execute particular functions in a computing environment using a micro architecture. A lock controlling apparatus based on a deterministic progress index (DPI) may include a loading unit to load a DPI of a first core and a DPI of a second core among DPIs of a plurality of cores at a lock acquisition point in time of each thread, a comparison unit to compare the DPI of the first core and the DPI of the second core, and a controller to assign a lock to a thread of the first core when the DPI of the first core is less than the DPI of the second core and when the second core corresponds to a last core to be compared among the plurality of cores.

Abstract: Provided is a method and apparatus for measuring a performance or a progress state of an application program to perform data processing and execute particular functions in a computing environment using a micro architecture. A thread progress tracking apparatus may include a selector to select at least one thread constituting an application program; a determination unit to determine, based on a predetermined criterion, whether an instruction execution scheme corresponds to a deterministic execution scheme having a regular cycle or a nondeterministic execution scheme having an irregular delay cycle with respect to each of at least one instruction constituting a corresponding thread; and a deterministic progress counter to generate a deterministic progress index with respect to an instruction that is executed by the deterministic execution scheme, excluding an instruction that is executed by the nondeterministic execution scheme.

Abstract: A dynamic task management system and method for data parallel processing on a multi-core system are provided. The dynamic task management system may generate a registration signal for a task to be parallel processed, may generate a dynamic management signal used to dynamically manage at least one task, in response to the generated registration signal, and may control the at least one task to be created or cancelled in at least one core in response to the generated dynamic management signal.

Abstract: A semiconductor chip package includes a lead frame, an insulation member, a chip, bonding wires and a sealing member. The lead frame includes a plurality of first leads and a plurality of second leads. The second leads have a chip adhesion region. The insulation member fills a space between the second leads in the chip adhesion region. The chip is provided on at least one surface of the insulation member. The chip has single-side bonding pads. The bonding wires electrically connect the leads and the bonding pads. The sealing member covers the lead frame, the insulation member, the chip and the bonding wires. Since the space between the second leads is filled with the insulation member, voids may be prevented from occurring.

Abstract: A semiconductor package includes one or more semiconductor chips to form a semiconductor package. The semiconductor package may include a first semiconductor chip package having a first substrate including a first surface having a center portion on which a first semiconductor chip is mounted, at least one first boundary portion on which a plurality of conductive connection pad groups are formed, and/or a molding member including a body that covers the first semiconductor chip and at least one extension that extends from the body. The extension extends while avoiding the conductive connection pad group. The semiconductor package may further include a second semiconductor chip package stacked on the first semiconductor chip package and including a second substrate on which at least one second semiconductor chip that is electrically connected to the conductive connection pad group may be mounted.

Abstract: A multiprocessor system and a migration method of the multiprocessor system are provided. The multiprocessor system may process dynamic data and static data of a task to be operated in another memory or another processor without converting pointers, in a distributed memory environment and in a multiprocessor environment having a local memory, so that dynamic task migration may be realized.

Abstract: A task migration system is provided which transmits a migration request signal for a plurality of first tasks to a migration manager using a resource manager, transmits information used in response to the migration request signal from a migration initiation handler to the migration manager when a first task, of which a migration point is in a capture ready state, among the plurality of first tasks is received from a processor, and captures, using the migration manager, the migration point of the first task in the capture ready state, in response to a migration request signal for the first task in the capture ready state, so that the first task with the captured migration point migrates to a second task.

Abstract: Provided are a semiconductor package and a method for forming the same, and a PCB (printed circuit board). The semiconductor package comprises: a PCB including a slit at a substantially central portion thereof, the PCB including an upper surface and a lower surface; a semiconductor chip mounted on the upper surface of the PCB; an upper molding layer disposed on the upper surface and covering the semiconductor chip; and a lower molding layer filling the slit and covering a portion of the lower surface of the PCB, wherein the PCB comprises a connecting recess at a side surface thereof, and the upper molding layer and the lower molding layer are in contact with each other at the connecting recess.

Abstract: Described herein is a flash memory apparatus and method controlling the same. The flash memory apparatus includes a processor and one or more flash memory units. The processor controls one or more memory operations performed in the one or more flash memory units. The processor stops controlling a memory operation in a flash memory unit when the memory operation is performed, and continues performing the memory operation in the flash memory unit when the flash memory unit generates an interrupt signal.

Abstract: A memory device and a method of managing a memory are provided. The memory device includes a command queue configured to receive a first command from a host to store the first command, and to read and transmit the first command, a controller configured to read, from a storage device, data corresponding to the first command transmitted from the command queue, and to store the data in a buffer memory, and a first memory configured to store a data list of data stored in the buffer memory, wherein, in response to the command queue receiving the first command from the host, the controller updates the data list of data stored in the first memory.

Abstract: A memory device includes a data block storing first data, and a log block storing second data that is an updated value of the first data. A spare area of the log block stores a first mapping table including mapping information between the first data and the second data.

Abstract: A memory device may include a non-volatile memory and non-volatile RAM. The non-volatile memory may include a data block and a metadata block. Metadata information with respect to the data block may be included in the metadata block. A portion of metadata with respect to the data block or the metadata with respect to the metadata block may be stored in the non-volatile RAM.

Abstract: A semiconductor package includes: a semiconductor chip having a first surface, and a second surface that is opposite to the first surface and allows a semiconductor device to be formed thereon; bonding pads disposed on the second surface of the semiconductor chip; and a metal ion barrier layer disposed on the first surface of the semiconductor chip, and preventing metal ions from penetrating into the semiconductor chip through the first surface of the semiconductor chip. Accordingly, the semiconductor package can obtain a superior semiconductor device by minimizing moisture absorption and effectively blocking the penetration of metal ions.

Abstract: A memory device includes a first controller and a second controller. The first controller receives a first command from a host and stores the first command in a first command queue, and transmits the first command to the second controller relating to the first command stored in the first command queue. The second controller transmits the first command stored in the second command queue to a flash memory.

Abstract: Provided are a memory card and a method of fabricating the memory card. The memory card includes: a printed circuit board including conductive wires exposed to at least a portion of an outer wall of the printed circuit board; at least one electronic device mounted on the printed circuit board; and a molding part sealing the at least one electronic device on the printed circuit board and the conductive wires exposed to the outer wall of the printed circuit board, and simultaneously exposing at least a portion of the outer wall of the printed circuit board.

Abstract: Provided is a semiconductor package apparatus having a redistribution layer. The apparatus includes at least one or more semiconductor chips, a packing part protecting the semiconductor chips, and a support part supporting the semiconductor chips. The apparatus also includes external terminals extending outside the packing part, redistribution layers installed between the semiconductor chips and the support part and including redistribution paths, first signal transmitting units, and second signal transmitting units. The first signal transmitting units transmitting electrical signals generated from the semiconductor chips to the redistribution paths of the redistribution layers, and the second signal transmitting units transmit the electrical signals from the redistribution paths to the external terminals. Therefore, a size and a thickness of the semiconductor package apparatus can be reduced, and processes can be simplified to improve productivity.

Abstract: A semiconductor chip package includes a lead frame, an insulation member, a chip, bonding wires and a sealing member. The lead frame includes a plurality of first leads and a plurality of second leads. The second leads have a chip adhesion region. The insulation member fills a space between the second leads in the chip adhesion region. The chip is provided on at least one surface of the insulation member. The chip has single-side bonding pads. The bonding wires electrically connect the leads and the bonding pads. The sealing member covers the lead frame, the insulation member, the chip and the bonding wires. Since the space between the second leads is filled with the insulation member, voids may be prevented from occurring.

Abstract: A stacked semiconductor package includes a first semiconductor package, a second semiconductor package and a conductive connection member. The first semiconductor package includes a first semiconductor chip, a first lead frame having first outer leads that are electrically connected to the first semiconductor chip, and a first molding member formed on the first semiconductor chip and the first lead frame to expose the first outer leads. The second semiconductor package includes a second semiconductor chip, a second lead frame formed on the first molding member and having second outer leads that may be electrically connected to the second semiconductor chip, and a second molding member formed on the second semiconductor chip and the second lead frame to expose the second outer leads. The conductive connection member may electrically connect the first outer leads and the second outer leads to each other. Further, the conductive connection member may have a crack-blocking groove.

Abstract: Provided are a semiconductor package and a method for forming the same, and a PCB (printed circuit board). The semiconductor package comprises: a PCB including a slit at a substantially central portion thereof, the PCB including an upper surface and a lower surface; a semiconductor chip mounted on the upper surface of the PCB; an upper molding layer disposed on the upper surface and covering the semiconductor chip; and a lower molding layer filling the slit and covering a portion of the lower surface of the PCB, wherein the PCB comprises a connecting recess at a side surface thereof, and the upper molding layer and the lower molding layer are in contact with each other at the connecting recess.

Abstract: Provided are a semiconductor package, a method of forming the semiconductor package, and a printed circuit board (PCB). The semiconductor package includes: a PCB including at least two parts divided by an isolation region; a semiconductor chip mounted on the PCB; and a molding layer disposed in the isolation region. The method includes: preparing a PCB, the PCB including a plurality of chip regions and a scribe region; forming isolation regions dividing each of the chip regions into two parts, the isolation regions including inner isolation regions and outer isolation regions, the inner isolation regions being provided in the chip regions, the outer isolation regions being provided at both ends of the inner isolation regions so as to extend toward the scribe region; mounting semiconductor chips on the chip regions; and cutting the PCB along the scribe region to divide the chip regions into at least two parts.