Abstract: A thiol-ene curable composition achieves both sufficient elongation properties and elasticity, and ensures the preservation stability of a formulation. The thiol-ene curable composition includes a compound (A) having an isocyanuric skeleton and at least two mercapto groups in one molecule, and at least one of a compound (B) including diallyl maleate and diallyl fumarate. The compound (A) is at least one selected from 1,3,5-tris(3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, and tris(mercaptopropyl)isocyanurate.

Abstract: There is provided an active energy ray-curable composition having excellent storage stability. The active energy ray-curable composition includes: active energy ray-curable compound (A) having an unsaturated ethylenic double bond; thiol compound (B) having two or more mercapto groups in one molecule; reaction inhibitor (C) configured to inhibit a reaction between the unsaturated ethylenic double bond and the mercapto groups; radical polymerization inhibitor (D); and water (E), wherein the content of water (E) is 0.05 ppm by mass or more and less than 1% by mass. When the total content of active energy ray-curable compound (A) and thiol compound (B) is 100 parts by mass, the content of reaction inhibitor (C) is 0.005 parts by mass or more and 10 parts by mass or less, and the content of radical polymerization inhibitor (D) is 0.005 parts by mass or more and 5 parts by mass or less.

Abstract: There is provided an active energy ray-curable composition having excellent storage stability. The active energy ray-curable composition includes: active energy ray-curable compound (A) having an unsaturated ethylenic double bond; thiol compound (B) having two or more mercapto groups in one molecule; reaction inhibitor (C) configured to inhibit a reaction between the unsaturated ethylenic double bond and the mercapto groups; radical polymerization inhibitor (D); and water (E), wherein the content of water (E) is 0.05 ppm by mass or more and less than 1% by mass. When the total content of active energy ray-curable compound (A) and thiol compound (B) is 100 parts by mass, the content of reaction inhibitor (C) is 0.005 parts by mass or more and 10 parts by mass or less, and the content of radical polymerization inhibitor (D) is 0.005 parts by mass or more and 5 parts by mass or less.

Abstract: An electrostatic discharge protector including two electrodes for forming a discharge gap, and a discharge gap filling-member including a discharge gap filing composition filed in the discharge gap, the discharge gap filling composition contains metal particles (A) obtainable by metal particles with a hydrolyzed product of a metal alkoxide represented by the following formula (1) and a binder component (C), and the electrostatic discharge protector includes the composition; R—O-[M(OR)2—O—]n—R??(1) wherein M is a metal atom, O is an oxygen atom, R is an alkyl group, all or a part of R's may be the same as or different each other, and n is an integer of 1 to 40. Also disclosed is an electronic circuit board including the electrostatic discharge protector and an electronic device.

Abstract: The present invention provides an electrostatic discharge protector capable of protecting electronic circuit boards having various designs from electrostatic discharge freely, simply and easily. The electrostatic discharge protector of the present invention comprises at least three conductive members containing one pair of electrodes and the conductive members other than the electrodes, the conductive members are each disposed in such a way that the gap between one conductive member and the other conductive member has a width of 0.1 to 10 ?m, an insulating member is disposed and embedded in at least one of gaps having a width of 0.1 to 10 ?m which are adjacent to each conductive member and one electrode is connected to the other electrode paired with the one electrode through the insulating member and the conductive members other than electrodes.

Abstract: A discharge gap-filling composition including a metal powder (A), a binder component (B) and a diluent (C). The diluent (C) has two or more characteristic groups in a molecule, and the characteristic groups are not directly bonded to each other in a molecule but are bonded to each other through a hydrocarbon group or a silicon atom.

Abstract: A discharge gap filling composition which includes metal powders (A) and a binder component (B), wherein surfaces of primary particles of the metal powders (A) are coated with a film composed of a metal oxide, and the primary particles of the metal powders (A) have a flake form. An electrostatic discharge protector is obtained using the composition.

Abstract: The present invention provides an electrostatic discharge protector capable of taking measures for electrostatic discharge against electronic wiring boards having various designs freely, simply and easily, having excellent accuracy of regulating an operating voltage and capable of being downsized and decreased on its cost, and also provides a resin composition for a discharge gap capable of preparing the electrostatic discharge protector. The resin composition for filling a discharge gap of an electrostatic discharge protector comprises a resin having a urethane structure represented by the formula (1): wherein plural R's are each independently an alkylene group of 1 to 18 carbon atoms, X is a bivalent organic group and m and n are each independently an integer of 1 to 20. The electrostatic discharge protector is obtainable by filling the discharge gap with the resin composition. The discharge gap has a width of 2 to 10 ?m.

Abstract: A discharge gap filling composition which includes metal powders (A) and a binder component (B), wherein surfaces of primary particles of the metal powders (A) are coated with a film composed of a metal oxide, and the primary particles of the metal powders (A) have a flake form. An electrostatic discharge protector is obtained using the composition.

Abstract: The present invention provides an electrostatic discharge protector capable of simply taking ESD measures with a free shape against electronic circuit boards having various designs, having excellent regulation accuracy for an operating voltage and capable of downsizing and cost decreasing, and also provides a discharge gap filling composition capable of using in the production of the electrostatic discharge protector. The discharge gap filling composition comprises metal particles (A) obtainable by metal particles with a hydrolyzed product of a metal alkoxide represented by the following formula (1) and a binder component (C), and the electrostatic discharge protector comprises the composition; R—O—[M(OR)2—O—]n—R??(1) wherein M is a metal atom, O is an oxygen atom, R is an alkyl group, all or a part of R's may be the same as or different each other, and n is an integer of 1 to 40.

Abstract: A discharge gap filling composition for an electrostatic discharge protector. The composition contains oxide film coated metal particles (A), a layered substance (B) and a binder component (C). Also disclosed is an electrostatic discharge protector including a discharge gap and a discharge gap filling material containing the discharge gap filling composition that is filled in the discharge gap.

Abstract: The present invention provides an electrostatic discharge protector capable of taking measures for electrostatic discharge against electronic wiring boards having various designs freely, simply and easily, having excellent accuracy of regulating an operating voltage and capable of being downsized and decreased on its cost, and also provides a resin composition for a discharge gap capable of preparing the electrostatic discharge protector. The resin composition for filling a discharge gap of an electrostatic discharge protector comprises a resin having a urethane structure represented by the formula (1): wherein plural R's are each independently an alkylene group of 1 to 18 carbon atoms, X is a bivalent organic group and m and n are each independently an integer of 1 to 20. The electrostatic discharge protector is obtainable by filling the discharge gap with the resin composition. The discharge gap has a width of 2 to 10 ?m.

Abstract: The present invention provides an electrostatic discharge protector capable of protecting electronic circuit boards having various designs from electrostatic discharge freely, simply and easily. The electrostatic discharge protector of the present invention comprises at least three conductive members containing one pair of electrodes and the conductive members other than the electrodes, the conductive members are each disposed in such a way that the gap between one conductive member and the other conductive member has a width of 0.1 to 10 ?m, an insulating member is disposed and embedded in at least one of gaps having a width of 0.1 to 10 ?m which are adjacent to each conductive member and one electrode is connected to the other electrode paired with the one electrode through the insulating member and the conductive members other than electrodes.

Abstract: The present invention relates to a resin composition comprising resin (A), a filler (B) and a solvent (C), wherein the solvent (C) contains at least one organic solvent selected from a group consisting of propylene carbonate, dimethylsulfoxide and sulfolane; a cured film obtained by curing the resin composition; and use of the cured film as an overcoat for electronic circuit boards or the like. The resin composition of the present invention has a high filtration rate when it is prepared and has excellent productivity. A cured film obtained by curing the resin composition has excellent long-term electric reliability and is useful in the fields of solder resists, electrical insulating materials such as interlayer dielectric films, encapsulating materials for ICs and ultra LSIs, laminates and the like.

Abstract: The resin composition includes a color pigment (A) and a curable resin (B) and gives a cured film satisfying the following requirements (I), (II), (III), (IV) and (V): (I) the maximum transmittance of light having wavelengths of 500 nm to 550 nm is not less than 90%; (II) the minimum transmittance of light having wavelengths of 600 nm to 650 nm is less than 80%; (III) the maximum reflectance of light having wavelengths of 500 nm to 550 nm is less than 12%; (IV) the minimum reflectance of light having wavelengths of 600 nm to 650 nm is less than 7%; (V) the 60° gloss value measured with white light is not less than 80.

Abstract: The present invention relates to a thiol compound represented by formula (1): wherein R1, R2 and n have the same meanings as in the specification, method for producing the compound, and to a photosensitive composition and a black matrix resist composition using the same which have high sensitivity and excellent property of retaining a line width in fine line patterns at the time of alkaline development, that is, being excellent in development latitude.

Abstract: The present invention relates to a thiol compound represented by formula (1): wherein R1, R2 and n have the same meanings as in the specification, method for producing the compound, and to a photosensitive composition and a black matrix resist composition using the same which have high sensitivity and excellent property of retaining a line width in fine line patterns at the time of alkaline development, that is, being excellent in development latitude.

Abstract: Overcoating agents and thermosetting resin compositions of the invention give protective layers that have excellent adhesion to substrates and in particular to tin, excellent long-term reliability of electric insulation and small warpage. A thermosetting resin composition according to the invention includes a carboxyl group-containing urethane resin (A), a curing agent (B) and an acid anhydride (C) as essential components. A flexible circuit board overcoating agent includes the thermosetting resin composition. A surface protective layer of the invention comprises a cured product of the thermosetting resin composition.

Abstract: The present invention relates to a thiol compound represented by formula (1): wherein R1, R2 and n have the same meanings as in the specification, method for producing the compound, and to a photosensitive composition and a black matrix resist composition using the same which have high sensitivity and excellent property of retaining a line width in fine line patterns at the time of alkaline development, that is, being excellent in development latitude.

Abstract: The present invention relates to a thiol compound represented by formula (1): wherein R1, R2 and n have the same meanings as in the specification, method for producing the compound, and to a photosensitive composition and a black matrix resist composition using the same which have high sensitivity and excellent property of retaining a line width in fine line patterns at the time of alkaline development, that is, being excellent in development latitude.