Abstract: A chip package includes a first die, a second die, a molding material, and a redistribution layer. The first die includes a first conductive pad. The second die is disposed on the first die and includes a second conductive pad. The molding material covers the first die and the second die. The molding material includes a top portion, a bottom portion, and an inclined portion adjoins the top portion and the bottom portion. The top portion is located on the second die, and the bottom portion is located on the first die. The redistribution layer is disposed along the top portion, the inclined portion, and the bottom portion. The redistribution layer is electrically connected to the first conductive pad and the second conductive pad.

Abstract: A method of manufacturing a semiconductor structure includes receiving a die comprising a top surface and a sacrificial layer covering the top surface; disposing the die on a substrate; disposing a molding surrounding the die; removing a portion of the molding to expose a sidewall of the sacrificial layer, wherein a top surface of the molding is at a level substantially same as the top surface of the die; and removing the sacrificial layer from the die.

Abstract: Embodiments of the present disclosure relate to a data backup method, a data backup device, and a computer program product. The method comprises: receiving a request for backing up stored data; determining a backup requirement based on the request, the backup requirement comprising a requirement with respect to processing backup data of the stored data in a backup system; and determining a backup operation for processing the backup data based on the backup requirement.

Abstract: A process for making an interconnect of a group III-V semiconductor device includes the steps of applying a positive photoresist layer and an image-reversible photoresist layer, subjecting the image-reversible photoresist and positive photoresist layers to patternwise exposure, subjecting the image-reversible photoresist layer to image reversal bake, subjecting the image-reversible photoresist and positive photoresist layers to flood exposure, subjecting the image-reversible photoresist and positive photoresist layers to development, depositing a diffusion barrier layer, depositing a copper layer, and removing the image-reversible photoresist and positive photoresist layers.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method includes forming a plurality of bond pad structures over an interconnect structure on a front-side of a semiconductor body. The plurality of bond pad structures respectively have a titanium contact layer. The interconnect structure and the semiconductor body are patterned to define trenches extending into the semiconductor body. A dielectric fill material is formed within the trenches. The dielectric fill material is etched to expose the titanium contact layer prior to bonding the semiconductor body to a carrier substrate. The semiconductor body is thinned to expose the dielectric fill material along a back-side of the semiconductor body and to form a plurality of integrated chip die. The dielectric fill material is removed to separate the plurality of integrated chip die.

Abstract: An electronic device may be provided with wireless circuitry and a housing with upper and lower ends. The lower end may include first and second open slot antennas that are directly fed by respective feeds and that radiate in a cellular ultra-high band. The lower end may also include first and second inverted-F antennas. The upper end may include third and fourth inverted-F antennas. The first inverted-F antenna may have a first feed that conveys currents below 2700 MHz and a second feed that conveys antenna currents in the cellular ultra-high band, a wireless local area network band, and/or ultra-wideband frequency bands. If desired, the upper end may include a third open slot antenna that is directly fed by a corresponding antenna feed and that radiates in the cellular ultra-high band and/or in the ultra-wideband frequency bands.

Abstract: Embodiments and methods of an interconnect structure are provided. The interconnect structure includes a via, a trench that has an overlapping area with a top of the via, and a first layer of conducting material that has an overlapping area with a bottom of the via. The interconnect also includes a second layer of conducting material formed in the via, and a third layer of conducting material formed in the trench. The second layer of conducting material is in contact with the first layer of conducting material without a barrier in between the two conducting materials. The absence of the barrier at the bottom of the via can reduce the contact resistance of the interconnect structure.

Abstract: The microfluidic chip can comprise at least one multichamber flow assembly that can comprise a plurality of microchannels. The plurality of microchannels can comprise a first microchannel that includes: a first inlet; a first outlet; and a first chamber fluidly connected to the first inlet and the first outlet. The plurality of microchannels can comprise a second microchannel that includes: a second inlet; a second outlet; and a second chamber fluidly connected to the second inlet and the second outlet. The multichamber flow assembly can comprise a porous biocompatible membrane oriented along a longitudinal interface between the first microchannel and the second microchannel, wherein the porous biocompatible membrane is permeable for movement of biomolecules from the first chamber to the second chamber through the porous biocompatible membrane.

Abstract: A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the steps of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality of fixed magnets with respective ones of a second plurality of magnets, performing at least one of adjusting a position of at least one of the second plurality of the magnets, and adjusting a size of at least one of the second plurality of magnets, adjusting a magnetic flux of at least one of the second plurality of magnets, measuring the magnetic field distribution in the deposition chamber, and comparing the measured magnetic field distribution in the deposition chamber with the target magnetic field distribution.

Abstract: Systems and methods for cross-region active-active data replication are described. A system includes a cross-region replication service (CRS), a cross-region synchronization service (CSS), and a conflict-free replication data type (CRDT) module executed by a cache service instance.

Abstract: A communications apparatus includes a plurality of communications circuits and a coexistence management circuit. Each communications circuit is configured to provide wireless communications services in compliance with a protocol. The coexistence management circuit is configured to manage radio activities of the communications circuits. In response to a detection result of at least two radio activities to occur in a subsequent packet time, the coexistence management circuit is configured to determine whether an interference signal related to said at least two radio activities falls in a predetermined frequency band, and when the interference signal falls in the predetermined frequency band, the coexistence management circuit is configured to adjust a transmission power or an execution time of one of said at least two radio activities.

Abstract: A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is bonded to a first IC die by a first bonding structure. A third IC die is bonded to the second IC die by a second bonding structure. The second bonding structure is arranged between back sides of the second IC die and the third IC die opposite to corresponding interconnect structures and comprises a first TSV (through substrate via) disposed through a second substrate of the second IC die and a second TSV disposed through a third substrate of the third IC die. The second bonding structure further comprises conductive features with oppositely titled sidewalls disposed between the first TSV and the second TSV.

Abstract: The present disclosure provides a driving method of a display device and a display device. The driving method of the display device includes: inputting a gate signal with a length of a first duration to each of gate lines; and inputting a data signal to each of data lines to drive the display device for displaying. Among M data lines crossing the gate line in a direction of the gate line from a signal input terminal to an terminal away from the signal input terminal, a start time at which an mth data line input with the data signal is delayed by a second duration, relative to the start time at which a first data line closest to the signal input terminal of the gate line is input with the data signal, and the second duration is less than the first duration.

Abstract: The disclosure relates to a derailleur assembly including a connecting member, a power module, a linkage member, and a driving module. The power module includes a base body and a battery assembly, wherein the battery assembly is disposed on the base body. The linkage member is pivotably disposed on the base body via a first pivot shaft, and the linkage member is pivotably disposed on the connecting member via a second pivot shaft. The driving module includes a casing and a motor, wherein the casing is pivotably disposed on the base body via a third pivot shaft, the casing is pivotably disposed on the connecting member via a fourth pivot shaft, and the motor is disposed in the casing and is electrically connected to the battery assembly.

Abstract: A structure including stacked substrates, a first semiconductor die, a second semiconductor die, and an insulating encapsulation is provided. The first semiconductor die is disposed over the stacked substrates. The second semiconductor die is stacked over the first semiconductor die. The insulating encapsulation includes a first encapsulation portion encapsulating the first semiconductor die and a second encapsulation portion encapsulating the second semiconductor die.

Abstract: Embodiments may include a method of determining a nucleic acid sequence. The method may include receiving a plurality of DNA fragments. The method may also include concatemerizing a first set of the DNA fragments to obtain a concatemer. The method may include performing single-molecule sequencing of the concatemer to obtain a first sequence of the concatemer. In some embodiments, single-molecule sequencing may be performed using a nanopore, and the method may include passing the concatemer through a nanopore. A first electrical signal may then be detected as the concatemer passes through the nanopore. The first electrical signal may correspond to a first sequence of the concatemer. In addition, the method may include analyzing the first electrical signal to determine the first sequence. Subsequences of the first sequence may be aligned to identify sequences corresponding to each of the first set of the DNA fragments.

Abstract: Methods and systems for remote multiplayer gameplay are disclosed. An example method can include joining a multiplayer interactive physical game including first and second players competing in an activity; capturing a first game video of a first player in a first play of the multiplayer interactive physical game, using a first camera on a first mobile computing device in a first gaming area; determining a first object flow associated with the first player from the first game video, by performing an algorithm on one or more frames of the first game video to detect one or more key points of the first player; generating a first analytic based on the first object flow; receiving a second analytic associated with the second player in a second gaming area; and generating a feedback to the first player based on the first analytic or the second analytic.

Abstract: Remote multi-target client monitoring for streaming content is disclosed. Raw data generated within a remote client device is received from the client device. The raw data is associated with content playback. An adaptor is used to translate the raw data into a unified data model. The translating comprises determining, from the raw data, a designation of at least one of a start and an end of a monitoring session.

Abstract: A light emitting apparatus and a display device are provided. The light emitting apparatus includes a light emitting unit and a pixel circuit. The pixel circuit is electrically connected to the light emitting unit. The pixel circuit includes a first driving transistor and a second driving transistor. The first driving transistor and the second driving transistor are configured to provide a first driving current and a second driving current to the light emitting unit at the same time, respectively. The first driving transistor includes a first gate terminal. The second driving transistor includes a second gate terminal. The first gate terminal and the second gate terminal are electrically connected to different nodes. The display device includes the light emitting apparatus.