Abstract: A semiconductor package includes a die pad, a semiconductor die mounted on the die pad and comprising a first terminal facing away from the die pad and a second terminal facing and electrically connected to the die pad, an interconnect clip electrically connected to the first terminal, an encapsulant body of electrically insulating material that encapsulates the semiconductor die and the interconnect clip, and a first opening in the encapsulant body that exposes a surface of the interconnect clip, the encapsulant body comprises a lower surface, an upper surface opposite from the lower surface, and a first outer edge side extending between the lower surface and the upper surface, and the first opening is laterally offset from the first outer edge side.

Abstract: Systems and methods for image editing are described. Embodiments of the present disclosure provide an image editing system for performing image object replacement or image region replacement (e.g., an image editing system for replacing an object or region of an image with an object or region from another image). For example, the image editing system may replace a sky portion of an image with a more desirable sky portion from a different replacement image. According to some embodiments described herein, real-time color harmonization based on the visible sky region may be used to produce more natural colorization. In some examples, horizon-aware sky alignment and placement with advanced padding may also be used. For example, the horizons of the original image and the replacement image may be automatically detected and aligned, and color harmonization may be performed based on the aligned images.

Abstract: Provided are a CLDN18.2-targeting antibody or an antigen-binding fragment thereof, a preparation method therefor, and the use thereof. The antibody comprises a light chain variable region and/or a heavy chain variable region, and the heavy chain variable region comprises HCDR1, HCDR2 and HCDR3, and the light chain variable region comprises LCDR1, LCDR2 and LCDR3. Compared with the prior art, the antibody has significant advantages in terms of binding affinity, ADCC, CDC, inhibitory effects on growth, endocytic activity, etc.

Abstract: The present disclosure provides a system of a redundancy structure for an autonomous driving system. The system may comprise an acquisition sub-system, a power supply sub-system and a processing sub-system connecting the acquisition sub-system. The acquisition sub-system may include at least one primary acquisition device and at least one backup acquisition device. The power supply sub-system may include a primary power supply device configured to power the at least one primary acquisition device and a first portion of the at least one backup acquisition device, and a backup power supply device configured to power the at least one primary acquisition device and a second portion of the at least one backup acquisition device. The processing sub-system may include a primary processing device, and a backup processing device that serves as a backup device of at least a part of the primary processing device.

Abstract: The present invention is to provide a method for producing nanodiamonds doped with a Group 14 element, the method comprising: detonating by exploding an explosive composition containing at least one explosive and at least one Group 14 element compound in a sealed container to obtain nanodiamonds doped with at least one Group 14 element selected from the group consisting of Si, Ge, Sn, and Pb, and removing the Group 14 element and/or oxide thereof by subjecting the nanodiamonds doped with a Group 14 element to an alkali treatment.

Abstract: An X-ray sensing device includes a photosensitive element, lead-containing glass, and an X-ray conversion structure. The photosensitive element is configured to sense light having a first wavelength. The lead-containing glass overlaps the photosensitive element. The X-ray conversion structure is disposed on the lead-containing glass. The lead-containing glass is located between the photosensitive element and the X-ray conversion structure. The X-ray conversion structure is configured to at least partially convert X-rays into light having the first wavelength.

Abstract: Impurities in a liquefied solid fuel utilized in a droplet generator of an extreme ultraviolet photolithography system are removed from vessels containing the liquefied solid fuel. Removal of the impurities increases the stability and predictability of droplet formation which positively impacts wafer yield and droplet generator lifetime.

Abstract: A semiconductor package includes an encapsulated semiconductor device and a redistribution structure. The encapsulated semiconductor device includes a semiconductor device encapsulated by an encapsulating material. The redistribution structure overlays the encapsulated semiconductor device and includes a plurality of vias and a redistribution line. The plurality of vias are located on different layers of the redistribution structure respectively and connected to one another through a plurality of conductive lines, wherein, from a top view, an angle greater than zero is included between adjacent two of the plurality of conductive lines. The redistribution line is disposed under the plurality of conductive lines and connects corresponding one of the plurality of vias and electrically connected to the semiconductor device through the plurality of vias.

Abstract: The present disclosure provides an assistive equipment and a supporting device of the same. The supporting device includes a housing, a first positioning element, a second positioning element and an elastic element. The first positioning element and the second positioning element are respectively disposed at two ends of the housing. The elastic element is disposed between the first positioning element and the second positioning element. When the second positioning element positions an end of the elastic element, a rotation of the second positioning element at a first pivot produce a deformation to the elastic element.

Abstract: A package structure including a first semiconductor die, a first insulating encapsulation, a bonding enhancement film, a second semiconductor die and a second insulating encapsulation is provided. The first insulating encapsulation laterally encapsulates a first portion of the first semiconductor die. The bonding enhancement film is disposed on a top surface of the first insulating encapsulation and laterally encapsulates a second portion of the first semiconductor die, wherein a top surface of the bonding enhancement film is substantially leveled with a top surface of the semiconductor die. The second semiconductor die is disposed on and bonded to the first semiconductor die and the bonding enhancement film. The second insulating encapsulation laterally encapsulates the second semiconductor die.

Abstract: A stacking structure including a first die, a second die stacked on the first die, and a third die and a fourth die disposed on the second die. The first die has a first metallization structure, and the first metallization structure includes first through die vias. The second die has a second metallization structure, and second metallization structure includes second through die vias. The first through die vias are bonded with the second through die vias, and sizes of the first through die vias are different from sizes of the second through die vias. The third and fourth dies are disposed side-by-side and are bonded with the second through die vias.

Abstract: A package includes a first die, a second die, an encapsulant, and through insulating vias (TIV). The first die has a first bonding structure. The first bonding structure includes a first dielectric layer and first connectors embedded in the first dielectric layer. The second die has a semiconductor substrate and a second bonding structure over the semiconductor substrate. The second bonding structure includes a second dielectric layer and second connectors embedded in the second dielectric layer. Sidewalls of the second dielectric layer are aligned with sidewalls of the semiconductor substrate. The first bonding structure is in physical contact with the second bonding structure such that the first dielectric layer is bonded to the second dielectric layer and the first connectors are bonded to the second connectors. The encapsulant laterally encapsulates the second die. The TIVs are aside the second die and are connected to the first bonding structure.

Abstract: A method for information feedback and related devices are provided. The method includes the following. A terminal receives preset information from a network device, where the preset information at least includes point-to-multipoint (PTM) transmission information. The terminal feeds back HARQ response information of the preset information to the network device, where the HARQ response information includes HARQ response information of the PTM transmission information.

Abstract: Provided is a wiring device for a high-voltage connector for energy storage. The high-voltage connector for energy storage includes a socket and a plug. The socket comprises a socket body, a mounting flange, an electrical isolation groove, a fastening ring, a pin and an anti-electric shock cap. The plug comprises a plug main body, a pressing buckle, hand-held pluggable portions, a hammering boss, a jack, a crown spring, a wiring cup opening, and a locking slider, waterproof lock washer and protective back cover.

Abstract: A battery monitoring module may be arranged in such a way as to receive a sensor signal from a light sensor configured to detect light within a battery module. The battery monitoring module may determine, using processing circuitry, a light characteristic within the battery module based on the sensor signal. The battery monitoring module may determine, using processing circuitry, a battery condition of the battery module based on the light characteristic.

Abstract: A particle removal device, along with methods of using such, are described. The device includes a handheld module having a body. A first one or more channels and a second one or more channels are formed in the body. The body includes a nozzle, and the handheld module is configured to provide suction by the nozzle and to inject an ionized fluid stream by the nozzle. The body further includes a handle attached to the nozzle.

Abstract: The present application discloses a semiconductor device with a barrier layer including aluminum fluoride and a method for fabricating the semiconductor device. The semiconductor device includes a substrate, a circuit layer positioned on the substrate, a pad layer positioned in the circuit layer and including aluminum and copper, a first barrier layer positioned on the pad layer and including aluminum fluoride, and a first connector positioned on the first barrier layer.

Abstract: A package structure includes at least one first redistribution layer, at least one second redistribution layer, a chip pad, a solder ball pad, a chip, a solder ball, and a molding compound. The first redistribution layer includes a first dielectric layer and a first redistribution circuit that fills a first opening and a second opening of the first dielectric layer. The first dielectric layer is aligned with the first redistribution circuit. The second redistribution layer includes a second and a third dielectric layers and a second redistribution circuit. The third dielectric layer is aligned with the second redistribution circuit. The chip pad and the solder ball pad are electrically connected to the first and the second redistribution circuits respectively. The chip and the solder ball are disposed on the chip pad and the solder ball pad respectively. The molding compound at least covers the chip and the chip pad.

Abstract: Copper chemical mechanical planarization (CMP) polishing formulation, method and system are disclosed. The CMP polishing formulation comprises abrasive particles of specific morphology and mean particle sizes (?100 nm, ?50 nm, ?40 nm, ?30 nm, or ?20 nm), at least two or more amino acids, oxidizer, corrosion inhibitor, and water.

Abstract: The present disclosure is directed to a modularized vessel droplet generator assembly (MGDVA) including a droplet generator assembly (DGA). Under a normal operation, the liquid fuel moves along an operation pathway extending through the DGA to eject or discharge the liquid fuel (e.g., liquid tin) from a nozzle of the DGA into a vacuum chamber. The liquid fuel in the vacuum chamber is then exposed to a laser generating an extreme ultra-violet (EUV) light. Under a service operation, the operation pathway is closed and a service pathway extending through the DGA is opened. A gas is introduced into the service pathway forming a gas-liquid interface between the gas and the liquid fuel. The gas-liquid interface is driven to an isolation valve directly adjacent to the DGA. In other words, the gas pushes back the liquid fuel to the isolation valve. Once the gas-liquid interface reaches the isolation valve, the isolation valve is closed isolating the DGA from the liquid fuel.