Abstract: A lid assembly for a container includes a frame; a lid button configured to receive an actuation force thereto and transmit the actuation force in a first direction; a push member having a first end, a second end and a slide surface having an inclination angle wherein the push member is operatively coupled to the lid button on the first end; a guide member having a guide surface and a feeder end wherein the guide surface and the slide surface are adapted to slide over each other; a spout configured to be operatively coupled with a rotary cam disc; and a retractable push-button mechanism operatively coupled to the second end of the push member wherein the retractable push-button mechanism is configured to switch between an engaged state and a disengaged state upon receiving the actuation force in the first direction from the push member.

Abstract: A watermark embedding method includes the following steps. The input video signal is received by a processing circuit. Grayscale information of a watermark signal is generated by the processing circuit according to a time series data and a predetermined plane. During a dark sate and a bright state in each of a plurality of consecutive periods, phases of the time series data are opposite and integral values of the grayscales of the predetermined plane are the same. The processing circuit embeds the watermark signal into the input video signal to generate an output video signal with the watermark information. The display panel displays an image according to the output video signal.

Abstract: A chip package includes a mother chip, a daughter chip, a molding compound, a first redistribution layer, and a second redistribution layer. The daughter chip is located on a first surface of the mother chip. The molding compound covers the mother chip and the daughter chip, and the daughter chip is surrounded by the molding compound. The first redistribution layer is located on the first surface of the mother chip and is covered by the molding compound. The second redistribution layer is electrically connected to the first redistribution layer, and is located on one of a second surface of the mother chip and a surface of the molding compound. One of the first redistribution layer and the second redistribution layer is electrically connected to the daughter chip, and the other is electrically connected to the mother chip.

Abstract: A film transfer tool has a casing, a tape-supplying assembly having a supply reel and a take-up reel linked therewith, a brake component which can move relative to the supply reel, and a transfer head. The transfer head moves between an original position and an operating position to drive the tape-supplying assembly and the brake component to move relative to the other. When the transfer head moves toward the operating position, a relative movement between the supply reel and the brake component is caused and the braking capacity gradually decreases.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to an extended drain metal oxide semiconductor (EDMOS) field effect transistor (FET) with a fully depleted region comprising a dual thicknesses semiconductor material and methods of manufacture. The structure includes: a semiconductor on insulator (SOI) material including a first portion with a first thickness and a second portion with a second thickness; a gate structure on the SOI material over the first portion with the first thickness; and sidewall spacers adjacent to the gate structure, with at least one sidewall spacer extending over both the first portion with the first thickness and the second portion with the second thickness.

Abstract: An optical element includes a substrate layer and a reflection element circular shaped on a surface of the substrate layer. The reflection element includes a base and a plurality of reflection structures protruding from the base to a direction away from the substrate layer. Each reflection structure includes an incident surface and an exit surface. The incident surface is configured to transmit a portion of a signal light and reflect another portion of the signal light. The exit surface is configured to transmit the portion of the signal light from the incident surface to a next incident surface, making the portion of the signal light transmit in the plurality of reflection structures successively, and making another portion of the signal light exit away from the substrate layer. A method for making an optical element and a head-mounted device are also provided.

Abstract: In some embodiments, the present disclosure relates to a semiconductor device. The semiconductor device includes a channel layer over a base substrate and an active layer over the channel layer. A source and a drain are over the active layer. A gate is over the active layer and laterally between the source and the drain. A dielectric is over the active layer and laterally surrounds the source, the drain, and the gate. A cap structure laterally contacts the source and is disposed laterally between the gate and the source. The source vertically extends to a top of the cap structure.

Abstract: A control method for a semi-centralized open winding multi-motor drive system includes: first, measuring current, voltage and position signal, computing system thrust by a velocity loop; then, distributing the thrust to each motor, converting the thrust into q axis current, computing dq axis voltages required for each motor by a current loop, and transforming the voltage demand to abc coordinate system through coordinate transformation; subsequently, modulating the voltage of each motor into a duty ratio instruction to judge whether the motor is in an over-modulated operating area, and performing over-modulation processing on the voltage in the over-modulated area; and finally, distributing the duty ratio instructions to independent and shared inverters. The control method of the present disclosure can reduce the hardware cost and improve the safety and reliability of the system.

Abstract: A method for fabricating integrated circuits comprises: forming, on a frontside of a substrate, a plurality of active components of an integrated circuit; forming, on the frontside of the substrate, a plurality of dummy components each laterally disposed next to one or more of the active components; forming a plurality of first via structures vertically extending through the substate from its backside to the frontside; forming a second via structure vertically extending through the substate from the backside to the frontside; and forming, on the backside of the substrate, a second interconnect structure.

Abstract: The invention is related to a buckle housing (1; 1?) for a safety belt in a child safety seat. The buckle housing (1; 1?) comprises a recess (2; 2?) adapted to receive a tongue (3; 3?) of the safety belt, a magnet (4; 4?) 5 arranged within the housing (1; 1?) to be movable between a first position (P1) and a second position (P2) thereof, and a magnet sensor (5; 5?) arranged in the housing (1, 1?) and adapted to detect when the magnet (4, 4?) is in the second position (P2). The invention also relates to a method for indicating the presence of a tongue (3; 3?) in a belt buckle housing (1; 1?).

Abstract: A signal sensing device includes a body and two signal sensing elements disposed in the body. An insulating layer is sandwiched between the two signal sensing elements. Each of the two signal sensing elements incudes a signal transmission section and a signal sensing section in electrical connection with the signal transmission section. The signal transmission sections are planar antennae parallel to each other and each having an antenna shape of meander-line type. The antenna shape of each transmission section has a vertical projection on a plane parallel to each signal transmission section. The vertical projections of the antenna shapes do not overlap completely. When a portion of the body forms a surrounding portion which surrounds a to-be-sensed target, a portion or an entirety of each signal sensing section is located on the surrounding portion.

Abstract: An optical transceiver module includes a housing, a substrate, and a chip and an optical component that are mounted on the substrate. The housing has a receptacle that accommodates the chip, the optical component, and the substrate. A top wall of the housing has a first region and a second region that are heat-insulated from each other. One of the chip or the optical component dissipates heat outside the housing through the first region, and the other one of the chip or the optical component dissipates heat outside the housing through the second region. The first region and the second region that are heat-insulated from each other are used to dissipate heat for the optical component and the chip.

Abstract: A display driving device comprises a signal supplier and a panel. The signal supplier is configured to output a first data signal, a second data signal, and a third data signal. The panel is coupled to the signal supplier. The panel includes a first region to a ninth region. During a first period, the first region, the second region, and the third region output a red signal based on the first data signal, the fourth region, the fifth region, and the sixth region output a green signal based on the second data signal, and the seventh region, the eighth region and the ninth region output a blue signal based on the third data signal. The red signal, the green signal, and the blue signal are different from each other.

Abstract: A semiconductor device includes a digital section, an analog active section, and an analog guard ring section between the analog active section and the digital section. The semiconductor device includes M_1st segments. The M_1st segments include a first M_1st segment extending in a first direction; and a second M_1st segment extending in the first direction, wherein the second M_1st segment is collinear with the first M_1st segment, and a first gap is between the first M_1st segment and the second M_1st segment. The semiconductor device includes active regions in a substrate. The active regions include first and second active regions extending in the first direction, the first active region being adjacent to the second active region, and the first and second active regions are separated by a second gap greater than or equal to the first gap.

Abstract: Methods and compositions for generating transgene-free plants are described. In particular, the transgene-free plants are regenerated by transient expression of morphogenic regulators in a plant cell that is precisely edited using a gene-editing methodology. Also, provided are transformed plants, plant cell, tissues, and seeds in which a target gene is edited, but non-transgenic.

Abstract: A chip package includes a semiconductor substrate, a first light-transmissive sheet, a second light-transmissive sheet, a first antenna layer, and a redistribution layer. The first light-transmissive sheet is disposed over the semiconductor substrate, and has a top surface facing away from semiconductor substrate and an inclined sidewall adjacent to the top surface. The second light-transmissive sheet is disposed over the first light-transmissive sheet. The first antenna layer is disposed between the first light-transmissive sheet and the second light-transmissive sheet. The redistribution layer is disposed on the inclined sidewall of the first light-transmissive sheet, and is in contact with an end of the first antenna layer.

Abstract: A display driving device includes a panel. The panel includes an output region, a first region, a second region, and a third region. The output region is configured to output a detection signal. The first region overlaps the output region, the second region overlaps the output region, and the third region overlaps the output region. During a first period, the second region and the third region output a point report signal according to the detection signal. During a second period, the first region and the third region output the point report signal according to the detection signal. During a third period, the first region and the second region output the point report signal according to the detection signal. The second period is later than the first period and the third period is later than the second period.

Abstract: A display panel includes a pixel circuit. The pixel circuit includes a first sub-pixel circuit and a second sub-pixel circuit. The first sub-pixel circuit includes a first light emitting element and a first driving circuit. The first driving circuit is coupled to the first light emitting element, and is configured to conduct according to a first driving signal and a second driving signal to drive the first light emitting element. The second sub-pixel circuit includes a second light emitting element, a third light emitting element and a second driving circuit. The second driving circuit is coupled to the second light emitting element and the third light emitting element, is configured to conduct according to the first driving signal to drive the second light emitting element, and is configured to conduct according to the second driving signal to drive the third light emitting element.

Abstract: A method of fabricating a semiconductor device includes providing a substrate that includes a handle substrate, a bottom cladding layer, and a semiconductor layer stacked in sequence from bottom to top. The substrate includes an electronic integrated circuit (EIC) region and a photonic integrated circuit (PIC) region. A thermal oxidation process is performed on the semiconductor layer in the PIC region to form an oxide layer. A first thickness of the semiconductor layer in the EIC region is greater than a second thickness of the semiconductor layer below the oxide layer. The oxide layer is removed and a PIC structure is formed on the bottom cladding layer in the PIC region. An EIC structure is formed on the bottom cladding layer in the EIC region. An interconnect structure is formed to be electrically connected to the PIC and EIC structures.