Abstract: A measuring device and an error calibration method for a machine tool. The measuring device includes a housing, a movable component, a calibration ball and a sensing switch. The housing has an inner space. The movable component is movably disposed in the inner space. The calibration ball is disposed on an end of the movable component and at least partially located outside the housing. The sensing switch is disposed in the inner space and configured to detect a movement of the movable component relative to the housing.

Abstract: The present disclosure provides a method, which includes the following steps: obtaining a netlist of an integrated circuit (IC) design; performing an automatic placement and routing (APR) process on the netlist to generate a result layout diagram; and during each operation with the APR process, refining, using a machine-learning model, a power delivery network within a layout diagram generated at each operation within the APR process.

Abstract: A fixing system used in a wet process includes a platform, wherein the platform defines a concavity on the top of the platform, a chamber on the bottom of the platform, and a number of sucking holes inside of the platform, the concavity and the chamber are intercommunicated with each other by the number of sucking holes; and a pumping device connected to the chamber and configured to exhaust the gas. The fixing system further includes a container, the container is connected to the pumping device by a first pipe and connected to the chamber by a second pipe. Solution leaked from the through holes is collected by the container and does not enter the pumping device.

Abstract: A projection device is disposable into a display platform of a display rack having a plurality of display platforms, for directly projecting an image frame onto a projection screen of the display platform. The image frame projected to the projection screen is not reflected by any reflective mirror arranged between the projection device and the projection screen. A length of the image frame in a first direction is equal to at least ten times a length of the image frame in a second direction. Since no reflective mirror is arranged between the projection device and the projection screen, the projection device is more easily applicable to display racks.

Abstract: A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.

Abstract: An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.

Abstract: A probe needle includes a head, a tail and a body connected between the head and the tail and provided with a first flat section curvedly extending from the head towards the tail for providing sufficient deformation when the tail is pressed on a device under test, and a second flat section neighbored to the first flat section for supporting the probe needle in between upper and lower dies. When the probe needles are used in a probe module, the probe needles can be arranged with a pitch same as that of the conventional probe needles even though the probe needles are formed from posts having a relatively greater diameter than that of the posts for making the conventional probe needles, such that the probe needles may have enhanced current withstanding capacity and prolonged lifespan.

Abstract: A projection device is disposable into a display platform of a display rack having a plurality of display platforms, for directly projecting an image frame onto a projection screen of the display platform. The image frame projected to the projection screen is not reflected by any reflective mirror arranged between the projection device and the projection screen. A length of the image frame in a first direction is equal to at least ten times a length of the image frame in a second direction. Since no reflective mirror is arranged between the projection device and the projection screen, the projection device is more easily applicable to display racks.

Abstract: A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer.

Abstract: The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against plural probes.

Abstract: A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings is formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer is planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.

Abstract: A combining structure for shelves has a plurality of bearing portions, connecting rods integrally connected to the periphery of each bearing portion, and each connecting rod extends toward the storage space to form at least one joining end. Multiple vertical supporting tubes are provided having a circumferential wall and two abutting ends, wherein, on the circumferential wall of each vertical supporting tube near the abutting end, at least one avoiding groove is provided. Tubular connectors are provided inside each vertical supporting tube. At least one eccentric socket slot is vertically formed on at least one unilateral position inside each tubular connector, and corresponds to the avoiding groove of the vertical supporting tube, so that the vertical supporting tube can sheathe the joining end of the connecting rod through the eccentric socket slot of the tubular connector, and through the avoiding groove, each vertical supporting tubes can avoid the bearing portion.

Abstract: A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The composite board further includes through hole which is made by drilling and passed all the way through the first board layer and the second board layer. The friction coefficient of the first board layer is less than that of the second board layer, and the thermal expansion coefficient of the second board layer is less than that of the first board layer. The probe pin is penetrated all the way through the through hole of the composite board. By this, friction between the probe pin and composite board is reduced so as to stabilize the position of the probe pin.

Abstract: A manufacturing method of a probing device is provided. The manufacturing method includes following steps. First, a plurality of space transformers is disposed on a reinforcing plate and the space transformer includes a plurality of first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings are formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.

Abstract: An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.

Abstract: A combining structure for shelves has a plurality of bearing portions, connecting rods integrally connected to the periphery of each bearing portion, and each connecting rod extends toward the storage space to form at least one joining end. Multiple vertical supporting tubes are provided having a circumferential wall and two abutting ends, wherein, on the circumferential wall of each vertical supporting tube near the abutting end, at least one avoiding groove is provided. Tubular connectors are provided inside each vertical supporting tube. At least one eccentric socket slot is vertically formed on at least one unilateral position inside each tubular connector, and corresponds to the avoiding groove of the vertical supporting tube, so that the vertical supporting tube can sheathe the joining end of the connecting rod through the eccentric socket slot of the tubular connector, and through the avoiding groove, each vertical supporting tubes can avoid the bearing portion.

Abstract: A probe needle includes a head, a tail and a body connected between the head and the tail and provided with a first flat section curvedly extending from the head towards the tail for providing sufficient deformation when the tail is pressed on a device under test, and a second flat section neighbored to the first flat section for supporting the probe needle in between upper and lower dies. When the probe needles are used in a probe module, the probe needles can be arranged with a pitch same as that of the conventional probe needles even though the probe needles are formed from posts having a relatively greater diameter than that of the posts for making the conventional probe needles, such that the probe needles may have enhanced current withstanding capacity and prolonged lifespan.

Abstract: A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.

Abstract: An apparatus for performing timer management regarding a system timer scheduler service includes: a processor arranged to control operations of the apparatus; an ordinary timer arranged to provide the processor with time ticks, for use of timing control; and a hardware-based Operating System (OS) timer arranged to provide the processor with at least one scheduler timer, for use of the system timer scheduler service. An associated method for performing timer management regarding a system timer scheduler service is also provided, and can be applied to the apparatus. In particular, the apparatus and the method can give considerations to both run-time power consumption and sleep mode power consumption. For example, the hardware-based OS timer can support an event-based OS timer scheduler to save the run-time power consumption. In another example, the hardware-based OS timer can support timer alignment in accordance with modulator/demodulator (modem) activities to minimize the sleep mode power consumption.

Abstract: A probe card for being abutted against a plurality of probes is provided. The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against the probes. In addition, a method of manufacturing the probe card is provided.