Abstract: A manufacturing method of a probing device is provided. The manufacturing method includes following steps. First, a plurality of space transformers is disposed on a reinforcing plate and the space transformer includes a plurality of first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings are formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.

Abstract: An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.

Abstract: A combining structure for shelves has a plurality of bearing portions, connecting rods integrally connected to the periphery of each bearing portion, and each connecting rod extends toward the storage space to form at least one joining end. Multiple vertical supporting tubes are provided having a circumferential wall and two abutting ends, wherein, on the circumferential wall of each vertical supporting tube near the abutting end, at least one avoiding groove is provided. Tubular connectors are provided inside each vertical supporting tube. At least one eccentric socket slot is vertically formed on at least one unilateral position inside each tubular connector, and corresponds to the avoiding groove of the vertical supporting tube, so that the vertical supporting tube can sheathe the joining end of the connecting rod through the eccentric socket slot of the tubular connector, and through the avoiding groove, each vertical supporting tubes can avoid the bearing portion.

Abstract: A probe needle includes a head, a tail and a body connected between the head and the tail and provided with a first flat section curvedly extending from the head towards the tail for providing sufficient deformation when the tail is pressed on a device under test, and a second flat section neighbored to the first flat section for supporting the probe needle in between upper and lower dies. When the probe needles are used in a probe module, the probe needles can be arranged with a pitch same as that of the conventional probe needles even though the probe needles are formed from posts having a relatively greater diameter than that of the posts for making the conventional probe needles, such that the probe needles may have enhanced current withstanding capacity and prolonged lifespan.

Abstract: A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.

Abstract: An apparatus for performing timer management regarding a system timer scheduler service includes: a processor arranged to control operations of the apparatus; an ordinary timer arranged to provide the processor with time ticks, for use of timing control; and a hardware-based Operating System (OS) timer arranged to provide the processor with at least one scheduler timer, for use of the system timer scheduler service. An associated method for performing timer management regarding a system timer scheduler service is also provided, and can be applied to the apparatus. In particular, the apparatus and the method can give considerations to both run-time power consumption and sleep mode power consumption. For example, the hardware-based OS timer can support an event-based OS timer scheduler to save the run-time power consumption. In another example, the hardware-based OS timer can support timer alignment in accordance with modulator/demodulator (modem) activities to minimize the sleep mode power consumption.

Abstract: A probe card for being abutted against a plurality of probes is provided. The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against the probes. In addition, a method of manufacturing the probe card is provided.

Abstract: A wireless communications device connected to a service network with a synchronized timing pattern therebetween is provided. In the wireless communications device, a wireless modem is configured to enable wireless signal transceiving from and to the service network in a non-sleep mode and disable wireless signal transceiving from and to the service network in a sleep mode. Also in the wireless communications device, a synchronization module is configured to initialize a first counter with a current time in the synchronized timing pattern in response to a first signal triggering the wireless modem to enter the sleep mode from the non-sleep mode, and enable counting of the first counter in a low-rate clock for the sleep mode. The synchronization module further provides the counted value of the first counter to the wireless modem to resynchronize with the service network in response to a second signal triggering the wireless modem to recover from the sleep mode to the non-sleep mode.

Abstract: A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings is formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer is planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.

Abstract: A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer.

Abstract: A wireless communications device connected to a service network with a synchronized timing pattern therebetween is provided. In the wireless communications device, a wireless modem is configured to enable wireless signal transceiving from and to the service network in a non-sleep mode and disable wireless signal transceiving from and to the service network in a sleep mode. Also in the wireless communications device, a synchronization module is configured to initialize a first counter with a current time in the synchronized timing pattern in response to a first signal triggering the wireless modem to enter the sleep mode from the non-sleep mode, and enable counting of the first counter in a low-rate clock for the sleep mode. The synchronization module further provides the counted value of the first counter to the wireless modem to resynchronize with the service network in response to a second signal triggering the wireless modem to recover from the sleep mode to the non-sleep mode.

Abstract: A method for clock calibration is provided. The method comprises receiving discontinuous reception period (DRX period) information from a base station, computing a calibration duration according to the discontinuous reception period and a clock error tolerance of a first clock, and when receiving paging information that informs of possible sent transmissions, calibrating the first clock with a second clock for a period of the calibration duration.

Abstract: An apparatus for performing timer management regarding a system timer scheduler service includes: a processor arranged to control operations of the apparatus; an ordinary timer arranged to provide the processor with time ticks, for use of timing control; and a hardware-based Operating System (OS) timer arranged to provide the processor with at least one scheduler timer, for use of the system timer scheduler service. An associated method for performing timer management regarding a system timer scheduler service is also provided, and can be applied to the apparatus. In particular, the apparatus and the method can give considerations to both run-time power consumption and sleep mode power consumption. For example, the hardware-based OS timer can support an event-based OS timer scheduler to save the run-time power consumption. In another example, the hardware-based OS timer can support timer alignment in accordance with modulator/demodulator (modem) activities to minimize the sleep mode power consumption.

Abstract: A direct-docking probing device is provided. The probing device includes a probe interface board, a space transformer, a conductive elastic member, a fixing frame, and at least one vertical probe assembly. The space transformer includes a space transforming plate and a reinforcing plate, and the mechanical strength of the reinforcing plate is larger than that of the space transforming plate. The reinforcing plate is electrically connected with the space transforming plate. Furthermore, the conductive elastic member is electrically connected with the probe interface board and the reinforcing plate. The fixing frame includes a stiffener, a frame body, and a pressing portion. The stiffener is disposed on the probe interface board. The frame body contains the conductive elastic member. The pressing portion is pressed on the space transformer. The vertical probe assembly includes a plurality of vertical probes which are electrically connected with the space transforming plate.

Abstract: A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The composite board further includes through hole which is made by drilling and passed all the way through the first board layer and the second board layer. The friction coefficient of the first board layer is less than that of the second board layer, and the thermal expansion coefficient of the second board layer is less than that of the first board layer. The probe pin is penetrated all the way through the through hole of the composite board. By this, friction between the probe pin and composite board is reduced so as to stabilize the position of the probe pin.

Abstract: A dual-mode communication apparatus and a method thereof are provided. The dual-mode communication apparatus comprises a microprocessor, a first tick generator, a second tick generator, and an operation system tick module that comprises a tick converter and an OS tick generator. The microprocessor receives an OS clock tick to execute a real-time program task. The first tick generator receives a first predetermined number of first clocks to generate a first clock tick when the first clock is active. The second tick generator receives a second predetermined number of second clocks to generate a second clock tick when the second clock is active. The tick converter, coupled to the first and second tick generators, converts the second clock tick such that the converted second clock tick has a converted clock tick rate substantially identical to the clock tick rate of the first clock tick.

Abstract: A wire cut electrical discharge machine is provided. The wire cut electrical discharge machine includes a base. At least two wire feeding and receiving components are disposed over the base. A working area is between the wire feeding and receiving components. At least two flaky wire electrodes are disposed in the working area, wherein ends of the flaky wire electrodes are respectively set on the wire feeding and receiving components.

Abstract: A method for clock calibration is provided. The method comprises receiving discontinuous reception period (DRX period) information from a base station, computing a calibration duration according to the discontinuous reception period and a clock error tolerance of a first clock, and when receiving paging information that informs of possible sent transmissions, calibrating the first clock with a second clock for a period of the calibration duration.

Abstract: A dual-mode communication apparatus and a method thereof are provided. The dual-mode communication apparatus comprises a microprocessor, a first tick generator, a second tick generator, and an operation system tick module that comprises a tick converter and an OS tick generator. The microprocessor receives an OS clock tick to execute a real-time program task. The first tick generator receives a first predetermined number of first clocks to generate a first clock tick when the first clock is active. The second tick generator receives a second predetermined number of second clocks to generate a second clock tick when the second clock is active. The tick converter, coupled to the first and second tick generators, converts the second clock tick such that the converted second clock tick has a converted clock tick rate substantially identical to the clock tick rate of the first clock tick.

Abstract: The present invention relates to an injection unit of a two-stage injection molding machine having an injection device and a meter device for providing plastic to the injection device. The injection motor of the injection device is secured to the base and does not move along with the injection linkage member so as to decrease the movement momentum and improve the injection response and acceleration capability. Additionally, the injection device can adopt a plurality of injection motors for meeting the injection capability requirement without employing high power injection motors. The length of the injection molding machines is relatively shortened, thus the problem of the prior arts is solved.