Abstract: A transceiver module is provided. The transceiver module includes a housing, a latch and a torsion spring. The housing includes a positioning post and a block. The latch includes a wedging protrusion. The torsion spring includes a coil portion, a first extending portion and a second extending portion, wherein the first extending portion and the second extending portion are connected to the coil portion, the first extending portion includes a first free end, the second extending portion includes a second free end, and the first extending portion intersects the second extending portion at an intersection point on a projection plane. A first area, a second area, a third area and a fourth area are defined by the torsion spring clockwise around the intersection point, the coil portion surrounds the positioning post in the first area, and the first free end is adapted to connect the latch.

Abstract: A current sensing module for measuring a current includes a conductive substrate, a frame, a circuit board and a magnetic sensor. The conductive substrate has two terminals and at least one slot. The frame has two side portions and a bottom portion, wherein the bottom portion connects the two side portions to form an opening ring-shape. At least one of the two side portions is disposed in the at least one slot, such that the two side portions surround a partial path of the current. A gap exists between two top ends of the two side portions. The circuit board is disposed with respect to the conductive substrate. The magnetic sensor is connected to the circuit board and located in a space between the two side portions rather than in the gap. The magnetic sensor senses the current and generates a first current sensing signal correspondingly.

Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that a size of electronic package structure can be reduced. The three-dimensional package structure comprises a first electronic component, a plurality of second electronic components and a plurality of conductive patterns. The first electronic component has a top surface and a bottom surface. The plurality of second electronic components are disposed over the top surface of the first electronic component. The plurality of conductive patterns are disposed over the plurality of second electronic components to electrically connect the plurality of second electronic components and the first electronic component.

Abstract: A current sensing module for measuring a current includes a conductive substrate, a frame, a circuit board and a magnetic sensor. The conductive substrate has two terminals and at least one slot. The frame has two side portions and a bottom portion, wherein the bottom portion connects the two side portions to form an opening ring-shape. At least one of the two side portions is disposed in the at least one slot, such that the two side portions surround a partial path of the current. A gap exists between two top ends of the two side portions. The circuit board is disposed with respect to the conductive substrate. The magnetic sensor is connected to the circuit board and located in a space between the two side portions rather than in the gap. The magnetic sensor senses the current and generates a first current sensing signal correspondingly.

Abstract: A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.

Abstract: A transceiver module is provided. The transceiver module includes a housing, a latch and a torsion spring. The housing includes a positioning post and a block. The latch includes a wedging protrusion. The torsion spring includes a coil portion, a first extending portion and a second extending portion, wherein the first extending portion and the second extending portion are connected to the coil portion, the first extending portion includes a first free end, the second extending portion includes a second free end, and the first extending portion intersects the second extending portion at an intersection point on a projection plane. A first area, a second area, a third area and a fourth area are defined by the torsion spring clockwise around the intersection point, the coil portion surrounds the positioning post in the first area, and the first free end is adapted to connect the latch.

Abstract: A three-dimensional package structure, comprising: a substrate; a first plurality of discrete electronic components disposed over the bottom surface of the substrate, wherein a first insulating layer is disposed over the bottom surface of the substrate to encapsulate the first plurality of discrete electronic components, wherein at least one second insulating layer is disposed over the first insulating layer, wherein a plurality of surface-mount pads are disposed on the bottom surface of the at least one second insulating layer and electrically connected to at least one via disposed in the at least one second insulating layer.

Abstract: The present invention discloses a substrate where the lateral surface of the substrate is formed to expose at least one portion of a via(s) for circuit connection. The substrate comprises a plurality of insulating layers; and a plurality of conductive layers separated by the plurality of insulating layers. A first lateral surface of the substrate is formed by the plurality of conductive layers and the plurality of insulating layers. The first lateral surface of the substrate comprises at least one first portion of a first via filled with a first conductive material.

Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that a size of electronic package structure can be reduced. The three-dimensional package structure comprises a first electronic component, a plurality of second electronic components and a plurality of conductive patterns. The first electronic component has a top surface and a bottom surface. The plurality of second electronic components are disposed over the top surface of the first electronic component. The plurality of conductive patterns are disposed over the plurality of second electronic components to electrically connect the plurality of second electronic components and the first electronic component.

Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that a size of electronic package structure can be reduced. The three-dimensional package structure comprises a first electronic component, a plurality of second electronic components and a plurality of conductive patterns. The first electronic component has a top surface and a bottom surface. The plurality of second electronic components are disposed over the top surface of the first electronic component. The plurality of conductive patterns are disposed over the plurality of second electronic components to electrically connect the plurality of second electronic components and the first electronic component.

Abstract: A three-dimensional package structure, comprising: a substrate; a first plurality of discrete electronic components disposed over the bottom surface of the substrate, wherein a first insulating layer is disposed over the bottom surface of the substrate to encapsulate the first plurality of discrete electronic components, wherein at least one second insulating layer is disposed over the first insulating layer, wherein a plurality of surface-mount pads are disposed on the bottom surface of the at least one second insulating layer and electrically connected to at least one via disposed in the at least one second insulating layer.

Abstract: The present invention discloses a substrate where the lateral surface of the substrate is formed to expose at least one portion of a via(s) for circuit connection. The substrate comprises a plurality of insulating layers; and a plurality of conductive layers separated by the plurality of insulating layers. A first lateral surface of the substrate is formed by the plurality of conductive layers and the plurality of insulating layers. The first lateral surface of the substrate comprises at least one first portion of a first via filled with a first conductive material.

Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that the size of electronic package structure can be reduced. The three-dimensional package structure comprises a substrate, a first plurality of discrete conductive components and a connecting structure. The substrate has a top surface and a bottom surface. The first plurality of discrete conductive components are disposed over the bottom surface of the substrate. The connecting structure is disposed over the bottom surface of the substrate for encapsulating the first plurality of discrete electronic components. The connecting structure comprises at least one insulating layer and a plurality of conductive patterns separated by the at least one insulating layer. The plurality of conductive patterns are disposed over the first plurality of discrete electronic components for electrically connecting the first plurality of discrete electronic components.

Abstract: The present invention discloses a substrate where the lateral surface of the substrate is formed to expose at least one portion of a via(s) for circuit connection. The substrate comprises a plurality of insulating layers; and a plurality of conductive layers separated by the plurality of insulating layers. A first lateral surface of the substrate is formed by the plurality of conductive layers and the plurality of insulating layers. The first lateral surface of the substrate comprises at least one first portion of a first via filled with a first conductive material.

Abstract: An externally-hung lamp assembly includes a circuit board, a battery pack, an upper cover, a lampshade, a rubber ring, a lower cover, and a hook. The circuit board has a first hole and a plurality of light-emitting components. The battery pack is electrically connected to the circuit board and is configured to provide power needed for turning on the light-emitting components. The upper cover is disposed on the circuit board. The lampshade is disposed in a second hole of the upper cover. The rubber ring is disposed beneath the circuit board. The lower cover is combined with the upper cover, wherein the lower cover has a back surface. The hook is pivotally disposed on the back surface of the lower cover. By means of the foregoing configurations, the externally-hung lamp assembly can meet configuration requirements of multiple different application scenarios.

Abstract: A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.

Abstract: A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.

Abstract: A mounting assembly contains a plate including a first fringe, a second fringe, a third fringe, and a fourth fringe. The first fringe has a first raised portion, and the second fringe has a semi-circular groove. The plate includes a plurality of first adjusting apertures, at least one pair of second adjusting apertures, and at least one pair of third adjusting apertures. The at least one pair of third adjusting apertures is defined between the at least one pair of second adjusting apertures, a distance between the at least one pair of second adjusting apertures is equal to that of two opposite orifices, two supporting members are symmetrically connected with the third fringe and the fourth fringe, and each supporting member has a plurality of first eyelets so that the first bolt inserts through the through hole to screw with one of the plurality of first eyelets.

Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that a size of electronic package structure can be reduced. The three-dimensional package structure comprises a first electronic component, a plurality of second electronic components and a plurality of conductive patterns. The first electronic component has a top surface and a bottom surface. The plurality of second electronic components are disposed over the top surface of the first electronic component. The plurality of conductive patterns are disposed over the plurality of second electronic components to electrically connect the plurality of second electronic components and the first electronic component.

Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that the size of electronic package structure can be reduced. The three-dimensional package structure comprises a substrate, a first plurality of discrete conductive components and a connecting structure. The substrate has a top surface and a bottom surface. The first plurality of discrete conductive components are disposed over the bottom surface of the substrate. The connecting structure is disposed over the bottom surface of the substrate for encapsulating the first plurality of discrete electronic components. The connecting structure comprises at least one insulating layer and a plurality of conductive patterns separated by the at least one insulating layer. The plurality of conductive patterns are disposed over the first plurality of discrete electronic components for electrically connecting the first plurality of discrete electronic components.