Patents by Inventor Ming Chien

Ming Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220216113
    Abstract: A method for manufacturing a MOS transistor includes following. A gate stack structure and a hardmask layer on the gate stack structure are sequentially formed on a substrate. A first spacer is formed on sidewalls of the gate stack structure and the hardmask layer. A photoresist layer is formed on a sidewall of the first spacer. A top surface of the photoresist layer is higher than a top surface of the gate stack structure. The hardmask layer and a portion of the first spacer are removed to expose the top surface of the gate stack structure. A top surface of a remaining first spacer is higher than the top surface of the gate stack structure. The photoresist layer is removed. A second spacer is formed on a sidewall of the remaining first spacer. A top surface of the second spacer is higher than the top surface of the gate stack.
    Type: Application
    Filed: April 9, 2021
    Publication date: July 7, 2022
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Wan-Yan Lin, Yu-Chieh Su, Ming-Chien Chiu, Mao-Hsing Chiu
  • Publication number: 20220216131
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate having a first surface and a second surface opposite thereto. A gallium nitride (GaN)-based device layer is formed on the first surface of the semiconductor substrate and has source, drain, and gate contact regions. First, second, and third through-substrate vias (TSVs) pass through the semiconductor substrate and are respectively electrically connected to the source, drain, and gate contact regions. An insulating liner layer is formed on the second surface of the semiconductor substrate and extends into the semiconductor substrate to separate the second and third TSVs from the semiconductor substrate. A semiconductor package assembly including the semiconductor device structure is also provided.
    Type: Application
    Filed: December 22, 2021
    Publication date: July 7, 2022
    Inventors: Po-Han LEE, Wei-Ming CHIEN
  • Publication number: 20220216277
    Abstract: A display device includes: a first substrate; a poly-silicon layer disposed on the first substrate; a first metal layer disposed on the poly-silicon layer and including a gate electrode; a first insulating layer disposed on the first metal layer; a second insulating layer disposed on the first insulating layer; a second metal layer covering a part of the second insulating layer; and a light emitting diode unit electrically connected to a first portion of the second metal layer, wherein a thickness of the second insulating layer under the second metal layer is larger than a thickness of the second insulating layer uncovered with the second metal layer.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 7, 2022
    Inventors: Kuang-Pin CHAO, Yun-Sheng CHEN, Ming-Chien SUN
  • Patent number: 11365311
    Abstract: A flexible transparent material is provided. The flexible transparent material includes a thermoplastic and a plurality of micelles dispersed in the thermoplastic. Each micelle includes a plurality of cross-linked rubber particles and a swelling liquid. The weight ratio of the thermoplastic to the total weight of the cross-linked rubber particles is from 1:5 to 4:5. The weight ratio of the swelling liquid to the total weight of the cross-linked rubber particles is from 1:5 to 2:1.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: June 21, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jin-An Wu, Bing-Jyun Zeng, Fan-Jie Lin, Fu-Ming Chien
  • Patent number: 11355659
    Abstract: A chip package includes a chip and a conductive structure. A first surface of the chip has a photodiode. A second surface of the chip facing away from the first surface has a recess aligned with the photodiode. The conductive structure is located on the first surface of the chip.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: June 7, 2022
    Assignee: XINTEC iNC.
    Inventors: Po-Han Lee, Chia-Ming Cheng, Wei-Ming Chien
  • Publication number: 20220171688
    Abstract: An exemplary testing environment can operate in a testing mode of operation to test whether a memory device or other electronic devices communicatively coupled to the memory device operate as expected or unexpectedly as a result of one or more manufacturing faults. The testing mode of operation includes a shift mode of operation, a capture mode of operation, and/or a scan mode of operation. In the shift mode of operation and the scan mode of operation, the exemplary testing environment delivers a serial input sequence of data to the memory device. In the capture mode of operation, the exemplary testing environment delivers a parallel input sequence of data to the memory device.
    Type: Application
    Filed: February 18, 2022
    Publication date: June 2, 2022
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Hung CHANG, Atul KATOCH, Chia-En HUANG, Ching-Wei WU, Donald G. MIKAN, JR., Hao-I YANG, Kao-Cheng LIN, Ming-Chien TSAI, Saman M.I. ADHAM, Tsung-Yung CHANG, Uppu Sharath CHANDRA
  • Patent number: 11333967
    Abstract: The present invention discloses a reticle container which comprises an upper cover and a lower cover. A plurality of identification modules is disposed on the edge of the reticle container. Therefore, the user can quickly identify the usage of the reticle container or number per se. On the other hand, the reticle container of the present invention further comprises supporters, sustainers and connecting modules. Therefore, the reticle container of the present invention is able to satisfy various structural requirements and conditions for carrying the reticle in a sealed environment.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: May 17, 2022
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, Yung-Chin Pan, Chih-Sheng Hung
  • Publication number: 20220141096
    Abstract: An electronic device (such as a controller) is described. During operation, the electronic device receives, from a second electronic devices, information that specifies occurrences of different types of events in a network (which includes the second electronic devices). For example, the information may include counts of the occurrences of the different types of events in the network, which may be collected by the second electronic devices. Then, the electronic device aggregates the information about the different types of events in the network, and stores the aggregated information in memory. Moreover, the electronic device predicts an occurrence of an anomaly or an error in the network based at least in part on the aggregated information and a pretrained machine-learning model (such as a neural network). Next, the electronic device selectively performs a remedial action based at least in part on the prediction.
    Type: Application
    Filed: October 29, 2021
    Publication date: May 5, 2022
    Applicant: ARRIS Enterprises LLC
    Inventor: Cheng-Ming Chien
  • Patent number: 11314175
    Abstract: A reticle pod having a positioning member includes a base, a lid and a plurality of positioning members. The lid shuts relative to the base to form a substantially cuboid case. The case has a storing space for receiving a reticle. The positioning members are arranged in a shutting direction and disposed on at least two edges of the lid or at least two edges of the base, respectively. The positioning members each include a connecting portion, a correcting portion and a guiding slope portion. The connecting portion connects the edges of the lid. The correcting portion has one end connected to the connecting portion and extending in a shutting direction and an opposing end connected to the guiding slope portion. The guiding slope portion has a slope extending outward. The reticle pod having a positioning member is error-free, allowing the lid to shut precisely relative to the base.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: April 26, 2022
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Chia-Ho Chuang, Hsing-Min Wen, Yi-Hsuan Lee, Hsin-Min Hsueh, Ming-Chien Chiu
  • Patent number: 11315991
    Abstract: A display device is disclosed, which comprises: a first substrate; a first metal layer disposed on a surface of the first substrate; a first insulating layer disposed on the first metal layer; a second insulating layer disposed on the first insulating layer; and a second metal layer covering a part of the second insulating layer and comprising a connecting region, wherein the first metal layer and the second metal layer are electrically connected to each other in the connecting region, wherein the second metal layer corresponding to the connecting region comprises a sidewall region and a non-sidewall region, a first thickness of the sidewall region corresponding to the second insulating layer along a direction parallel to the surface of the first substrate is smaller than a second thickness of the non-sidewall region along a direction perpendicular to the surface of the first substrate.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: April 26, 2022
    Assignee: INNOLUX CORPORATION
    Inventors: Kuang-Pin Chao, Yun-Sheng Chen, Ming-Chien Sun
  • Patent number: 11314176
    Abstract: An apparatus for containing a substrate and a method of manufacturing the apparatus are provided. The apparatus for containing a substrate includes: a base having a periphery and an upward-facing top horizontal planar surface with a plurality of contact elements, the contact elements being used for engaging the substrate to hold the substrate upon the upward-facing top horizontal planar surface, an upward-facing frame-like support surface extending from the upward-facing top horizontal planar surface and surrounding the contact elements at a position proximate to the periphery of the base; and a cover having a downward-facing frame-like support surface being in large-area contact with the upward-facing frame-like support surface to define a cavity for containing the substrate between the base and the cover. The downward-facing and upward-facing frame-like support surfaces in contact with each other are not at the same level as the upward-facing top horizontal planar surface.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: April 26, 2022
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD
    Inventors: Chia-Ho Chuang, Hsin-Min Hsueh, Ming-Chien Chiu
  • Patent number: 11306841
    Abstract: A quick release purge valve and a substrate container using same are provided. The container includes a base which has a cover plate and a bottom plate. The quick release purge valve includes a snap plate, a gasket fitting, and a valve element. The snap plate detachably engages with the bottom plate and is at most evenly aligned with the bottom plate. The gasket fitting is disposed between the cover plate and the bottom plate and has an airflow conduit communicating the two plates. The valve element is disposed in the conduit for limiting a flow direction of the gas. The gasket fitting is fixed in the base when the snap plate and the bottom plate are in an engaged state and is removable from the base when the snap plate and the bottom plate are in a disengaged state.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: April 19, 2022
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, Chia-Ho Chuang, Hsin-Min Hsueh
  • Patent number: 11310904
    Abstract: A chip package includes a high voltage withstanding substrate and a device chip. The high voltage withstanding substrate has a main body, a functional layer, and a grounding layer. The main body has a top surface, a bottom surface opposite the top surface, a through hole through the top surface and the bottom surface, and a sidewall surrounding the through hole. The functional layer is located on the top surface. The grounding layer covers the bottom surface and the sidewall. The device chip is located on the functional layer, and has a grounding pad that faces the main body. The grounding pad is electrically connected to the grounding layer in the through hole.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: April 19, 2022
    Assignee: XINTEC INC.
    Inventors: Tsang-Yu Liu, Po-Han Lee, Wei-Ming Chien
  • Patent number: 11292637
    Abstract: A central support device for supporting plate-shaped objects and a storage apparatus for storing the plate-shaped objects are provided and adapted to regulate the heights of support elements and confine front ends thereof to a specified range. The central support device includes a casing, the support elements and height adjustment elements. Partition portions each having a dent portions are disposed at the casing and arranged in the heightwise direction, with a support element receiving slot defined between every two adjacent partition portions. Bottom sides of the dent portions slope in the heightwise direction. One end of each support element is connected to a bottom portion of a corresponding support element receiving slot. The height adjustment elements are disposed in the dent portions, respectively, and extend in the heightwise direction to form top ends for supporting the support elements. The storage apparatus also includes the central support device.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: April 5, 2022
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, En-Nien Shen, Yung-Chin Pan, Chih-Ming Lin, Cheng-En Chung, Po-Ting Lee
  • Publication number: 20220102177
    Abstract: A reticle pod with antistatic capability includes a base and plural of support members. The base has a carrying surface having a recess formed thereon and defined by a bottom surface. The support members encircle the carrying surface of the base and are adapted to support a reticle. The recess is defined by a depth extending between the carrying surface and the bottom surface. The depth ranges from 300 ?m to 3400 ?m to thereby weaken the electrostatic force exerted upon particles on the carrying surface.
    Type: Application
    Filed: April 22, 2021
    Publication date: March 31, 2022
    Inventors: Ming-Chien Chiu, Chia-Ho Chuang, Yi-Hsuan Lee, Hsing-Min Wen, Hsin-Min Hsueh
  • Publication number: 20220104365
    Abstract: The invention discloses a substrate storage apparatus having a detecting device detachably connecting to an outer pod. The detecting device includes a sensing member having a sensing terminal, a cavity and a sensor. The sensing terminal detachably connects to the outer pod such that the sensing terminal exposes in an accommodating space inside of the outer pod. The cavity receiving the sensor extends to an outside of the outer pod and the accommodating space. The cavity communicates with the accommodating space through the sensing terminal, allowing the sensor to read information regarding the accommodating space.
    Type: Application
    Filed: July 28, 2021
    Publication date: March 31, 2022
    Inventors: Ming-Chien Chiu, Chia-Ho Chuang, Hsin-Min Hsueh, Yun-Zi Lin
  • Publication number: 20220102178
    Abstract: The invention discloses a reticle pod for receiving a reticle. The reticle pod includes a base and plural support device provided on the base for supporting the reticle. A first distance is defined between a peripheral area of a bottom surface of the reticle and an upward facing top surface of the base. A second distance is defined between a central area of the bottom surface of the base and the upward facing top surface of the base, wherein the central area is encircled by the peripheral area. The second distance is larger than the first distance.
    Type: Application
    Filed: June 4, 2021
    Publication date: March 31, 2022
    Inventors: Ming-Chien Chiu, Chia-Ho Chuang, Yi-Hsuan Lee, Hsing-Min Wen, Hsin-Min Hsueh
  • Publication number: 20220100080
    Abstract: The instant disclosure discloses a workpiece container system comprising a storage assembly. The storage assembly comprises a seat member and a seat cover. The seat member defines a workpiece receiving region that encompasses a geometric center region thereof, configured to receive a workpiece; wherein a lower diffuse inducing component is provided on the seat member within a planar projection of the workpiece yet offsets the geometric center region. The seat cover is configured to engage the seat member at a periphery region around the workpiece receiving region thereof, so as to cooperatively form an enclosure for housing the workpiece; wherein an upper diffuse inducing component is provided on the seat cover over the planar projection of the workpiece and protectively overlaps the geometric center region of the seat member.
    Type: Application
    Filed: March 30, 2021
    Publication date: March 31, 2022
    Inventors: MING-CHIEN CHIU, CHIA-HO CHUANG, HSING-MIN WEN, HSIN-MIN HSUEH, SHU-HUNG LIN
  • Patent number: D951208
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: May 10, 2022
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, Yung-Chin Pan, Yu-Chen Chu, Cheng-En Chung
  • Patent number: D957815
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: July 19, 2022
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, Yung-Chin Pan, Yu-Chen Chu, Cheng-En Chung