Abstract: A chassis quick release device includes a housing including a base with a connected sliding channel and accommodating space therein and a cover assembled with the base, a locking block linearly movably set in the accommodating space, and an operating handle having a rod body positioned on the sliding channel and a grip assembled with the rod body. The rod body has a cylindrical joint that corresponds to the grip and has a shaft groove defined therein. The grip is provided with a sleeve corresponding to the cylindrical joint and defining therein an accommodating cavity. Moving the operating handle in the direction of the housing causes the locking block to slide out from the accommodating space to form a locked state. Pulling the operating handle away from the housing causes the locking block to move linearly in a second direction to form an unlocked state.

Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: A chassis quick release device includes a housing including a base provided with a sliding channel, a compression space, and accommodating space, a rotating space and a shaft in the rotating space and covered with a cover, a locking block linearly movably set in the accommodating space and providing a guide groove, a guide chamber, a receiving groove and an elastic member set in the receiving groove, a locking member having a shaft hole coupled to the shaft, a rotary reset member positioned on the shaft, resisting edge located at one end thereof that can rotate and protrude from the housing and a locking edge located at the other end thereof, and an operating handle including a rod body positioned in the sliding channel, the guide groove and the guide chamber and mounted with a grp and having a locking portion stopped against the guide chamber.

Abstract: A method, system, and article provide image processing with power reduction while using universal serial bus cameras.

Abstract: A lens module includes a driving device, an image sensing device, a lens group frame, and an infrared filter. The driving device has a lens barrel for an optical signal passing through. The image sensing device is on a path of the optical signal to convert the optical signal into an electric signal. The lens group frame is provided in the lens barrel, and has a main body, which is driven by the driving device to be moved between a first position and a second position, and a lens holder, which is pivotally connected on the main body and is swung between a third position and a fourth position when the main body is respectively at the first and the second positions. The infrared filter is provided on the lens holder, and is precisely aligned with the image sensing device when the lens holder is at the fourth position.

Abstract: Disclosed is an IP camera and a video playback method thereof, the IP camera connected to a host through the network, the IP camera includes an image capturing unit, a processor, and an input/output buffer unit. An external video is captured by the image capturing unit, and the external video includes a plurality of frames. An image outputting rate is determined by the processor, and an output external image is produced by reducing a resolution of the external image and remarking a confirm flag in at least one first frame when an image output rate is lower than a threshold value. The external image or the processed image is inputted to the I/O buffer unit to form an output external image. By way of the present invention, the captured video may still be watched instantly and fluently on the host while the host is suffering from the network congestion.

Abstract: A zoom lens includes a driving device, a zooming frame, and a lens group, wherein the driving device has a lens barrel. The zooming frame is located in the lens barrel, and has a body, a first lens holder, and a second lens holder which are pivotally connected to the body. The body is drivable by the driving device to reciprocally move between a first position and a second position. The first lens holder is respectively pivoted between a third position and a fourth position on the body along with the body being moved between the first position and the second position. The second lens holder is pivoted between a fifth position and a sixth position on the body in the same way. The lens group has a first lens sub-group provided on the first lens holder, and a second lens sub-group provided on the second lens holder.

Abstract: A lens module includes a driving device, an image sensing device, a lens group frame, and an infrared filter. The driving device has a lens barrel for an optical signal passing through. The image sensing device is on a path of the optical signal to convert the optical signal into an electric signal. The lens group frame is provided in the lens barrel, and has a main body, which is driven by the driving device to be moved between a first position and a second position, and a lens holder, which is pivotally connected on the main body and is swung between a third position and a fourth position when the main body is respectively at the first and the second positions. The infrared filter is provided on the lens holder, and is precisely aligned with the image sensing device when the lens holder is at the fourth position.

Abstract: A zoom lens includes a driving device, a zooming frame, and a lens group, wherein the driving device has a lens barrel. The zooming frame is located in the lens barrel, and has a body, a first lens holder, and a second lens holder which are pivotally connected to the body. The body is drivable by the driving device to reciprocally move between a first position and a second position. The first lens holder is respectively pivoted between a third position and a fourth position on the body along with the body being moved between the first position and the second position. The second lens holder is pivoted between a fifth position and a sixth position on the body in the same way. The lens group has a first lens sub-group provided on the first lens holder, and a second lens sub-group provided on the second lens holder.

Abstract: A zoom lens includes an external frame, a rotary shaft, an internal frame, a lens group and a spring. The internal frame is connected to the external frame via the rotary shaft, so that the internal frame is rotatable relative to the external frame. The lens group is fixed in the internal frame. The spring comprises a deformation part and two extension parts extended from the deformation part, wherein one extension part is propped against the internal frame and inclined at an acute angle relative to the rotary shaft, and the other extension part is propped against the external frame.

Abstract: A zoom lens includes an external frame, a rotary shaft, an internal frame, a lens group and a spring. The internal frame is connected to the external frame via the rotary shaft, so that the internal frame is rotatable relative to the external frame. The lens group is fixed in the internal frame. The spring comprises a deformation part and two extension parts extended from the deformation part, wherein one extension part is propped against the internal frame and inclined at an acute angle relative to the rotary shaft, and the other extension part is propped against the external frame.

Abstract: A method and a structure are provided for preventing lift-off of a semiconductor monitor pattern from a substrate. A semiconductor structure and a semiconductor monitor structure are formed on a substrate. A material layer is formed covering the semiconductor monitor structure. A part of the semiconductor structure is removed without removing the semiconductor monitor structure, by using the material layer as an etch protection layer. A mask for the method is also provided. The mask includes a clear area and a dark area. The dark area prevents a semiconductor monitor structure from being subjected to exposure so as to form a material layer covering the semiconductor monitor structure and prevent removal of the semiconductor monitor structure from the substrate while a part of a semiconductor structure is removed.

Abstract: A method of manufacturing a micro-lens is disclosed. The method includes providing a convex photoresist surface, forming a lens mold on the convex photoresist surface, removing the lens mold from the convex photoresist surface, forming a micro-lens in the lens mold and removing the micro-lens from the lens mold.

Abstract: An ink-ejection unit of an inkjet printhead integrates an ink-channel wafer onto a CMOS wafer with a heating element fabricated therein. A nozzle film with a nozzle orifice is formed on the backside of the CMOS wafer, which allows two-dimensional ink ejecting from the backside of the CMOS wafer.

Abstract: A method and a structure are provided for preventing lift-off of a semiconductor monitor pattern from a substrate . A semiconductor structure and a semiconductor monitor structure are formed on a substrate. A material layer is formed covering the semiconductor monitor structure. A part of the semiconductor structure is removed without removing the semiconductor monitor structure, by using the material layer as an etch protection layer. A mask for the method is also provided. The mask includes a clear area and a dark area. The dark area prevents a semiconductor monitor structure from being subjected to exposure so as to form a material layer covering the semiconductor monitor structure and prevent removal of the semiconductor monitor structure from the substrate while a part of a semiconductor structure is removed.

Abstract: An image-capturing and data-storing system includes a plurality of image-capturing devices for capturing images and generating corresponding formatted data, a first network-attached storage (NAS) device coupled via a network to the image-capturing devices for storing the formatted data transferred through the network, and a second NAS device coupled via the network to the first NAS device for compressing the formatted data transferred through the network and storing the compressed data generated by the second NAS device.

Abstract: A method and a structure are provided for preventing lift-off of a semiconductor monitor pattern from a substrate. A semiconductor structure and a semiconductor monitor structure are formed on a substrate. A material layer is formed covering the semiconductor monitor structure. A part of the semiconductor structure is removed without removing the semiconductor monitor structure, by using the material layer as an etch protection layer. A mask for the method is also provided. The mask includes a clear area and a dark area. The dark area prevents a semiconductor monitor structure from being subjected to exposure so as to form a material layer covering the semiconductor monitor structure and prevent removal of the semiconductor monitor structure from the substrate while a part of a semiconductor structure is removed.