Abstract: A negative potential generating device which includes an insulating box, an AC/DC converter, a booster, a second wire and an insulating lid is presented. The insulating box has a side wall, and an inner surface of the side wall has a blind hole. The AC/DC converter is arranged inside the insulating box, and electrically connected with a plug through a first wire. The booster is arranged inside the insulating box and electrically connected with the AC/DC converter. One side of the second wire is electrically connected with the booster, another side of the second wire is exposed and inserted into the blind hole and contacts with an inner wall surface of the blind hole. The insulating lid covers the insulating box. The device is easy to carry and generates negative potential anytime and anywhere after connecting to a power supply, making it easier and more convenient to use.

Abstract: A negative potential inducing device has a box body, an AC/DC converter, a booster, a second wire, a lid and an insulating rod. The box body has a side wall, and the side wall has a via. The AC/DC converter is arranged inside the box body, and electrically connected with a plug through a first wire. The booster is arranged inside the box body and electrically connected with the AC/DC converter. The second wire passes through the via, wherein one end of the second wire is electrically connected with the booster. The lid covers the box body. A metal wire on another end of the second wire is exposed and inserted to one end of the insulating rod and touches the insulating rod.

Abstract: A negative potential generating device which includes an insulating box, an AC/DC converter, a booster, a second wire and an insulating lid is presented. The insulating box has a side wall, and an inner surface of the side wall has a blind hole. The AC/DC converter is arranged inside the insulating box, and electrically connected with a plug through a first wire. The booster is arranged inside the insulating box and electrically connected with the AC/DC converter. One side of the second wire is electrically connected with the booster, another side of the second wire is exposed and inserted into the blind hole and contacts with an inner wall surface of the blind hole. The insulating lid covers the insulating box. The device is easy to carry and generates negative potential anytime and anywhere after connecting to a power supply, making it easier and more convenient to use.

Abstract: A negative potential inducing device has a box body, an AC/DC converter, a booster, a second wire, a lid and an insulating rod. The box body has a side wall, and the side wall has a via. The AC/DC converter is arranged inside the box body, and electrically connected with a plug through a first wire. The booster is arranged inside the box body and electrically connected with the AC/DC converter. The second wire passes through the via, wherein one end of the second wire is electrically connected with the booster. The lid covers the box body. A metal wire on another end of the second wire is exposed and inserted to one end of the insulating rod and touches the insulating rod.

Abstract: A light-emitting device with improved light-emitting brightness comprises a first electrode and a second electrode on the upper surface of a light emitting element. On the positions opposite to the first electrode and the second electrode, a first power supply electrode and a second power supply electrode are provided on the partial upper surface of a power supply substrate. A reflective layer is provided between the first power supply electrode, the second power supply electrode and power supply substrate. A eutectic layer is used to firmly provide the light emitting element on the power supply substrate such that the first electrode and second electrode can be electrically connected to corresponding first power supply electrode and second power supply electrode, and thus protecting structural feature of the reflective layer and maintaining the reflective efficiency of the reflective layer.

Abstract: The invention discloses a light-emitting diode lamp with high heat dissipation that uses the high heat conductible material to make the lamp cavity and coordinates with the design of directly adhering base of the flip-chip light-emitting diodes and the cavity to achieve the purpose of guiding light and dissipating heat. The flip-chip light-emitting diode is used and arranged in matrix, the brightness and the uniformity can be effectively improved. The present invention can be applied to be the light source of the liquid crystal display, the advertisement board, the scanner and so on.

Abstract: A light-emitting diode with a micro-lens layer, includes a die substrate, a second epitaxy layer deposited on the top surface of the die substrate, a first epitaxy layer deposited on a portion of the top surface of the second epitaxy layer, a second electrode formed on a portion of the top surface of the second epitaxy layer, a first electrode formed on a portion of the top surface of the first epitaxy layer, and a micro-lens layer mounted on a portion of the top surface of the first epitaxy layer. The micro-lens layer can change the projection angle and the projection path of the light beams radiated within the light-emitting diode in virtue of the diffusion effect caused by the micro-lens, and thereby improving the light-drawing efficiency and the luminance of the light-emitting diode.

Abstract: A package array and its package unit of flip chip LED are proposed, wherein an LED chip is mounted on a ceramic material capable of enduing the eutectic temperature of the fabrication process for packaging. Next, metal wires are directly distributed on the ceramic material to finish an LED package unit, or a plurality of LEDs are serial/parallel connected with metal wires on the ceramic material to finish a high density package array. Because the ceramic material has a good thermal expansion match and a good thermal conductivity and the LED chip itself has a high reflective index match, the light emission characteristic and heat-radiating effect of the packaged LED can be effectively improved.

Abstract: A light-emitting device with high heat-dissipating efficiency, includes a ceramic substrate having at least one pair of power-supply circuits mounted at a specific location of the substrate, a light-emitting die fixedly mounted on the ceramic substrate by flip-chip mounting, wherein the two electrodes of the light-emitting die are electrically connected to a corresponding power-supply circuit, respectively, and an optical reflector which is adjacently mounted in the periphery of the light-emitting die and made up of a metallic material or a material with a high coefficient of thermal conductivity for increasing the heat-dissipating area and providing a light-guiding mechanism.

Abstract: A light-emitting device is provided, having a light-reflecting layer on a power substrate, the main structure of which comprises a power substrate, at least one light-emitting die fixedly provided on a top surface of the power substrate, a light-reflecting body surroundingly provided around the periphery of the power substrate and light-emitting die, and a supporting foundation. At a side surface of the power substrate, there is coated with at least one light-reflecting layer, by which a side light source generated from the light-emitting die may be reflected out of the light-emitting device, free from being absorbed by the power substrate, thus raising the brightness of the light-emitting device.

Abstract: An organic electroluminescent device with the feature of three-wavelength luminescence is provided. The device includes a hole transporting layer, an electron blocking layer, a first host material layer, a second host material layer, a hole blocking layer, and an electron transporting layer placed between an anode and a cathode in turn. In which, the first host material layer has a first guest luminous substance mixed therein for projecting a first color light source (B), while the second host material layer correspondingly has a second guest luminous substance and a third guest luminous substance mixed therein for projecting a second color light source (G) and a third color light source (R), respectively, under the effect of an external bias voltage, wherein said second guest luminous substance or said third guest luminous substance may be a phosphorescence substance.

Abstract: A light-emitting diode (LED) device with at least three pins, mainly comprises an accommodating base provided therein with an electrostatic discharge protection device and at least one light-emitting die adhered onto this electrostatic discharge protection device in the manner of flip-chip, in such a way that a first electrode and a second electrode of the light-emitting die are electrically connected to a first protective electrode and a second protective electrode of the electrostatic discharge protection device, respectively and correspondingly. The accommodating base is connectedly provided with at least one heat-dissipating pin, and at the side of this accommodating base, a first electro-conductive pin and a second electro-conductive pin are provided, such that the first protective electrode and the second protective electrode are electrically connected thereto, respectively.

Abstract: A light-emitting device is provided, having an enlarged area of active luminescence region to enhance the brightness, mainly comprising a second epitaxy layer and at least one first epitaxy layer provided on a die substrate in turn. On the top surface of the first epitaxy layer, there are provided with at least one first electrode, and a plurality of second electrodes passing through the first epitaxy layer, insulated with the first epitaxy layer by means of an electrode insulation layer, and electrically connected to the second epitaxy layer, in which the first electrode and the second electrodes are alternately arranged. Moreover, first power supply circuits and second power supply circuits are provided on a power supply substrate at positions based on the locations of the first electrode and second electrodes so as to be adhesively electrically connected to the first electrode and the second electrodes, correspondingly.

Abstract: A light-emitting diode (LED) device with prevention of electrostatic damage, mainly comprises a surface insulated substrate onto which at least one power supply circuit and at least one second power supply circuit are provided, the former being electrically connected to a LED first electrode of a LED and a ESD second electrode of an electrostatic discharge protection device, while the latter being electrically connected to a LED second electrode of the LED and a ESD first electrode of the electrostatic discharge protection device, in such a way that an inverse-parallel circuit is formed by the LED and the electrostatic discharge protection device. Thus, not only a simplified manufacturing process and raised yield rate, but also a prolonged service life of the LED device may be obtained, due to the feature that active areas of the first power supply circuit and second power supply circuit are larger than those of the ESD first electrode and ESD second electrode.

Abstract: The present invention discloses a light-emitting diode and a method for manufacturing such a light-emitting diode with a direct band-gap III-V compound semiconductor material on a GaAs substrate. It is implemented by forming a first conductive electrode on the top edge of the epitaxial LED layer and a second conductive electrode opposite the first conductive electrode on the edge of a transparent substrate. Further, after the first conductive electrode and second conductive electrode are connected by chip bonding skill, it is selectively to remove the GaAs substrate and plate a transparent electrode on the top portion of the epitaxial LED layer. Therefore, when casting from P-N junction of the light-emitting diode, the light will go through with directions of the top portion of epitaxial layer and transparent substrate.

Abstract: A light-emitting device is provided. The device is with an enlarged active light-emitting region, mainly comprising a LED substrate provided with a first material layer and a second material layer on the top surface thereof in turn, and a PN junction formed between the first material layer and the second material layer naturally. Moreover, a first extended trench, allowed for passing through the second material layer and a part of the first material layer, is provided, and a first extended electrode is disposed inside the first extended trench. The electrical connection between the first extended electrode and the first electrode disposed on one part of top surface of the second material layer is made, such that the first electrode may be located at a horizontal level approximately identical to that of a second electrode equally disposed at the other part of top surface of the second material.

Abstract: An optoelectronic device is disclosed. The optoelectronic device comprises a transparent conductive substrate, an optoelectronic element, and a base. The transparent conductive substrate comprises a transparent plate, a transparent electrode film formed on the transparent plate, and an insulating part formed on the transparent plate. The insulating part divides the transparent electrode film into a first transparent electrode film and a second transparent electrode film that non-conduct each other. The optoelectronic element comprising a positive electrode and a negative electrode is disposed on the transparent conductive substrate and electrically connected to the first transparent electrode film and the second transparent electrode film individually. The base is formed with an opening that has a reflective surface on the bottom of the opening, and the optoelectronic element is held in the opening in a manner of suspending from or connecting with the bottom of the opening.

Abstract: A full-color display device is disclosed. The present invention comprises a plurality of pixel units each comprising a base, a plurality of transparent conductive substrates, a plurality of light emitting elements, and a plurality of electrode parts. The base has at least three openings formed thereon, the bottom of each opening is a reflective surface, and each of the transparent conductive substrates individually covers each opening. Each of the light emitting elements is individually disposed on one side of each transparent conductive substrate and held in each opening. Each of the electrode parts is formed on the base and electrically connected to the electrodes of the light emitting elements and the transparent conductive substrates.

Abstract: A light emitting diode package structure includes an insulating carrier base formed with a recess or a through hole. The recess or the through hole has a depth enough for completely accommodating a light emitting diode. The recess or the through hole may have two stepwise portions for providing two intermediate mesa planes. Two planar metal layers are separately formed on the two intermediate mesa planes and, respectively, connected to two metal pads which are arranged outside of the recess or the through hole. Two wiring lines connect two electrodes of the light emitting diode with the two planar metal layers, respectively. A resin fills the recess or the through hole for sealing all of the light emitting diode and the two wiring lines.

Abstract: A light emitting diode package structure includes an insulating carrier base formed with a recess or a through hole. The recess or the through hole has a depth enough for completely accommodating a light emitting diode. The recess or the through hole may have two stepwise portions for providing two intermediate mesa planes. Two planar metal layers are separately formed on the two intermediate mesa planes and, respectively, connected to two metal pads which are arranged outside of the recess or the through hole. Two wiring lines connect two electrodes of the light emitting diode with the two planar metal layers, respectively. A resin fills the recess or the through hole for sealing all of the light emitting diode and the two wiring lines.