Patents by Inventor Ming-Fan Tsai
Ming-Fan Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12123779Abstract: The present invention provides a far infrared (FIR) sensor device formed on a substrate, wherein the FIR sensor device includes: a sensor region, which is formed on the substrate, and is configured to operably sense a far infrared signal; and a sensor dielectric layer, which is formed on the sensor region, wherein a thickness of the sensor dielectric layer is determined by a sacrificial metal layer.Type: GrantFiled: February 21, 2022Date of Patent: October 22, 2024Assignee: PIXART IMAGING INCORPORATIONInventors: Ming-Han Tsai, Chih-Fan Hu
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Publication number: 20240304657Abstract: A semiconductor device includes a substrate, a first gate, a plurality of second gates and a resistor. The substrate is defined with an active region and a resistor region. The first gate is disposed in the active region. The first gate has a first length extending along a first direction and a second length extending along a second direction. The plurality of second gates are disposed in the resistor region. Each of the second gates has a third length extending along the first direction and a fourth length extending along the second direction. The first length is equal to the third length, and the second length is equal to the fourth length. The resistor is disposed on the plurality of second gates.Type: ApplicationFiled: March 29, 2023Publication date: September 12, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Yi-Chun Teng, Ming-Che Tsai, Ping-Chia Shih, Yi-Chang Huang, Wen-Lin Wang, Yu-Fan Hu, Ssu-Yin Liu, Yu-Nong Chen, Pei-Tsen Shiu, Cheng-Tzung Tsai
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Publication number: 20240290728Abstract: An electronic package and a manufacturing method thereof are provided, in which a cover is disposed on a carrier structure having an electronic element, and the electronic element is covered by the cover. A magnetic conductive member is arranged between the cover and the electronic element, and an air gap is formed between the magnetic conductive member and the cover to enhance the shielding effect of the electronic package.Type: ApplicationFiled: June 14, 2023Publication date: August 29, 2024Inventors: Wen-Jung TSAI, Chih-Hsien CHIU, Chien-Cheng LIN, Ming-Fan TSAI, Cheng-You JENG, Hui-Jing CHANG
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Publication number: 20240245037Abstract: A multi-use monitoring system is disclosed, which comprises an electronic device, multiple sensor devices, multiple cameras, at least one wireless interface, and a remote electronic device. According to the present invention, the sensor devices are adopted for detecting multiple environmental parameters such as gas level, humidity and temperature, and the multiple cameras are controlled to acquire images from the poultry bred in a breeding environment. Therefore, after receiving the images and the environmental parameters from the electronic device, the remote electronic device can extract at least one poultry characteristic from the images, and then correlate the environmental parameters to the poultry characteristic(s). As a result, the remote electronic device can subsequently calculate an evaluation score according to the growth and/or health state of the poultry, such that the breeder can plan how to distribute the breeding resources for the poultry.Type: ApplicationFiled: January 22, 2024Publication date: July 25, 2024Applicant: CALYX, INC.Inventors: Po-Jui CHIU, Benson FAN, Ming-Yuan TSAI, I-Ting CHEN, Chia-Cheng LIAO, Shin-Kai MA, Tsung-Lin LU, Chan-Hsin YEH, To-An TING, Ting-Shuo CHANG
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Patent number: 11764162Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.Type: GrantFiled: August 19, 2020Date of Patent: September 19, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ming-Fan Tsai, Chih-Wei Chen, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
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Patent number: 11723144Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.Type: GrantFiled: September 2, 2021Date of Patent: August 8, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chao-Ya Yang, Chia-Yang Chen
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Patent number: 11476572Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.Type: GrantFiled: January 23, 2020Date of Patent: October 18, 2022Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
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Publication number: 20220225493Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.Type: ApplicationFiled: September 2, 2021Publication date: July 14, 2022Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chao-Ya Yang, Chia-Yang Chen
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Patent number: 11069633Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.Type: GrantFiled: July 6, 2018Date of Patent: July 20, 2021Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Ming-Fan Tsai, Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
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Publication number: 20210210435Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.Type: ApplicationFiled: August 19, 2020Publication date: July 8, 2021Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ming-Fan Tsai, Chih-Wei Chen, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
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Publication number: 20200161756Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.Type: ApplicationFiled: January 23, 2020Publication date: May 21, 2020Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
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Patent number: 10587041Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.Type: GrantFiled: May 16, 2017Date of Patent: March 10, 2020Assignee: Silicon Precision Industries Co., Ltd.Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
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Publication number: 20190214352Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.Type: ApplicationFiled: July 6, 2018Publication date: July 11, 2019Inventors: Ming-Fan Tsai, Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
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Patent number: 10199317Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.Type: GrantFiled: March 29, 2016Date of Patent: February 5, 2019Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chih-Hsien Chiu, Chia-Yang Chen, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai
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Patent number: 10074621Abstract: Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.Type: GrantFiled: June 14, 2016Date of Patent: September 11, 2018Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chih-Hsien Chiu, Chi-Pin Tsai, Chi-Liang Shih, Ming-Fan Tsai, Chia-Yang Chen
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Patent number: 9999132Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.Type: GrantFiled: May 24, 2016Date of Patent: June 12, 2018Assignee: Silicon Precision Industries Co., Ltd.Inventors: Chih-Hsien Chiu, Chia-Yang Chen, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai
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Publication number: 20180090835Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.Type: ApplicationFiled: May 16, 2017Publication date: March 29, 2018Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
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Publication number: 20170278807Abstract: Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.Type: ApplicationFiled: June 14, 2016Publication date: September 28, 2017Inventors: Chih-Hsien Chiu, Chi-Pin Tsai, Chi-Liang Shih, Ming-Fan Tsai, Chia-Yang Chen
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Publication number: 20170231095Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.Type: ApplicationFiled: May 24, 2016Publication date: August 10, 2017Inventors: Chih-Hsien Chiu, Chia-Yang Chen, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai
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Publication number: 20170201023Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.Type: ApplicationFiled: March 29, 2016Publication date: July 13, 2017Inventors: Chih-Hsien Chiu, Chia-Yang Chen, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai