Patents by Inventor Ming-Fan Tsai

Ming-Fan Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12123779
    Abstract: The present invention provides a far infrared (FIR) sensor device formed on a substrate, wherein the FIR sensor device includes: a sensor region, which is formed on the substrate, and is configured to operably sense a far infrared signal; and a sensor dielectric layer, which is formed on the sensor region, wherein a thickness of the sensor dielectric layer is determined by a sacrificial metal layer.
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: October 22, 2024
    Assignee: PIXART IMAGING INCORPORATION
    Inventors: Ming-Han Tsai, Chih-Fan Hu
  • Publication number: 20240304657
    Abstract: A semiconductor device includes a substrate, a first gate, a plurality of second gates and a resistor. The substrate is defined with an active region and a resistor region. The first gate is disposed in the active region. The first gate has a first length extending along a first direction and a second length extending along a second direction. The plurality of second gates are disposed in the resistor region. Each of the second gates has a third length extending along the first direction and a fourth length extending along the second direction. The first length is equal to the third length, and the second length is equal to the fourth length. The resistor is disposed on the plurality of second gates.
    Type: Application
    Filed: March 29, 2023
    Publication date: September 12, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yi-Chun Teng, Ming-Che Tsai, Ping-Chia Shih, Yi-Chang Huang, Wen-Lin Wang, Yu-Fan Hu, Ssu-Yin Liu, Yu-Nong Chen, Pei-Tsen Shiu, Cheng-Tzung Tsai
  • Publication number: 20240290728
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a cover is disposed on a carrier structure having an electronic element, and the electronic element is covered by the cover. A magnetic conductive member is arranged between the cover and the electronic element, and an air gap is formed between the magnetic conductive member and the cover to enhance the shielding effect of the electronic package.
    Type: Application
    Filed: June 14, 2023
    Publication date: August 29, 2024
    Inventors: Wen-Jung TSAI, Chih-Hsien CHIU, Chien-Cheng LIN, Ming-Fan TSAI, Cheng-You JENG, Hui-Jing CHANG
  • Publication number: 20240245037
    Abstract: A multi-use monitoring system is disclosed, which comprises an electronic device, multiple sensor devices, multiple cameras, at least one wireless interface, and a remote electronic device. According to the present invention, the sensor devices are adopted for detecting multiple environmental parameters such as gas level, humidity and temperature, and the multiple cameras are controlled to acquire images from the poultry bred in a breeding environment. Therefore, after receiving the images and the environmental parameters from the electronic device, the remote electronic device can extract at least one poultry characteristic from the images, and then correlate the environmental parameters to the poultry characteristic(s). As a result, the remote electronic device can subsequently calculate an evaluation score according to the growth and/or health state of the poultry, such that the breeder can plan how to distribute the breeding resources for the poultry.
    Type: Application
    Filed: January 22, 2024
    Publication date: July 25, 2024
    Applicant: CALYX, INC.
    Inventors: Po-Jui CHIU, Benson FAN, Ming-Yuan TSAI, I-Ting CHEN, Chia-Cheng LIAO, Shin-Kai MA, Tsung-Lin LU, Chan-Hsin YEH, To-An TING, Ting-Shuo CHANG
  • Patent number: 11764162
    Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: September 19, 2023
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Ming-Fan Tsai, Chih-Wei Chen, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
  • Patent number: 11723144
    Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: August 8, 2023
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chao-Ya Yang, Chia-Yang Chen
  • Patent number: 11476572
    Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: October 18, 2022
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
  • Publication number: 20220225493
    Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.
    Type: Application
    Filed: September 2, 2021
    Publication date: July 14, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chao-Ya Yang, Chia-Yang Chen
  • Patent number: 11069633
    Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: July 20, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Ming-Fan Tsai, Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
  • Publication number: 20210210435
    Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.
    Type: Application
    Filed: August 19, 2020
    Publication date: July 8, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Ming-Fan Tsai, Chih-Wei Chen, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
  • Publication number: 20200161756
    Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
    Type: Application
    Filed: January 23, 2020
    Publication date: May 21, 2020
    Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
  • Patent number: 10587041
    Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: March 10, 2020
    Assignee: Silicon Precision Industries Co., Ltd.
    Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
  • Publication number: 20190214352
    Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.
    Type: Application
    Filed: July 6, 2018
    Publication date: July 11, 2019
    Inventors: Ming-Fan Tsai, Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
  • Patent number: 10199317
    Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: February 5, 2019
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Hsien Chiu, Chia-Yang Chen, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai
  • Patent number: 10074621
    Abstract: Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: September 11, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Hsien Chiu, Chi-Pin Tsai, Chi-Liang Shih, Ming-Fan Tsai, Chia-Yang Chen
  • Patent number: 9999132
    Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: June 12, 2018
    Assignee: Silicon Precision Industries Co., Ltd.
    Inventors: Chih-Hsien Chiu, Chia-Yang Chen, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai
  • Publication number: 20180090835
    Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
    Type: Application
    Filed: May 16, 2017
    Publication date: March 29, 2018
    Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
  • Publication number: 20170278807
    Abstract: Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.
    Type: Application
    Filed: June 14, 2016
    Publication date: September 28, 2017
    Inventors: Chih-Hsien Chiu, Chi-Pin Tsai, Chi-Liang Shih, Ming-Fan Tsai, Chia-Yang Chen
  • Publication number: 20170231095
    Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.
    Type: Application
    Filed: May 24, 2016
    Publication date: August 10, 2017
    Inventors: Chih-Hsien Chiu, Chia-Yang Chen, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai
  • Publication number: 20170201023
    Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.
    Type: Application
    Filed: March 29, 2016
    Publication date: July 13, 2017
    Inventors: Chih-Hsien Chiu, Chia-Yang Chen, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai