Patents by Inventor Ming Fang
Ming Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240405022Abstract: A method for fabricating semiconductor devices is disclosed. The method includes forming a first fin structure and a second fin structure in a first region and a second region of a substrate, respectively, wherein the first and second fin structure and the substrate comprise a first semiconductor material; forming a first liner structure and a second liner structure at least extending along sidewalls of the first fin structure and sidewalls of the second fin structure, respectively; replacing an upper portion of the second fin structure with a second semiconductor material, while leaving the first fin structure substantially intact; and exposing a top surface and upper sidewalls of the first fin structure, and a top surface and upper sidewalls of the second fin structure.Type: ApplicationFiled: May 31, 2023Publication date: December 5, 2024Applicant: Tokyo Electron LimitedInventors: Eric Chih-Fang LIU, Subhadeep KAL, Peter WANG, Ying TRICKETT, Ya-Ming CHEN
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Publication number: 20240400598Abstract: The disclosed and claimed subject matter provides precursors having at least one tethered cyclopentadienyl ligand (“Cp ligand”), at least one amidinate ligand (“Ad ligand”) and a lanthanide and/or lanthanide-like transition metal (“M”) of the general formulae (i) (Cp ligand)2-M-(Ad ligand) or (ii) (Cp ligand)-M-(Ad ligand)2.Type: ApplicationFiled: November 18, 2021Publication date: December 5, 2024Inventors: Christoph WETZEL, Holger HEIL, Michal KROMPIEC, Lars LIETZAU, David BRUGE, Ming FANG, Sergei V. IVANOV
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Publication number: 20240395882Abstract: A method includes following steps. A semiconductor fin is formed extending from a substrate. A gate dielectric layer is formed to wrap around semiconductor fin. A P-type work function layer is formed to wrap around the gate dielectric layer. An N-type work function layer is formed to wrap around the P-type work function layer. The N-type work function layer has a work function different from a work function of the P-type work function layer. The N-type work function layer is treated such that an upper portion of the N-type work function layer has a different composition than a lower portion of the N-type work function layer.Type: ApplicationFiled: July 30, 2024Publication date: November 28, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Cheng-Ming LIN, Peng-Soon LIM, Zi-Wei FANG
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Publication number: 20240392494Abstract: Provided is a laundry treating device.Type: ApplicationFiled: August 31, 2022Publication date: November 28, 2024Applicant: Nanjing Roborock Innovation Technology Co., Ltd.Inventors: Xing LI, Chuanlin DUAN, Yadong YAN, Jibai HUANG, Zhimin YANG, Zhe WANG, Ming LIU, Chenghu LIN, Junjun FANG, Hang QI, Ming XU, Tong LIU, Gang QUAN
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Patent number: 12153565Abstract: In computer methods and systems for operating a database management system using a catalog table collection module each table in the database management system is cataloged. Multiple tables are automatically dispatched into multiple consistency groups by collecting real-time statistics using a real time statistics module. Workload profile data of the database management system is generated using a workload profile collection module, and an optimized multiple consistency group definition for the database management system is generated using a transaction splitting analysis module.Type: GrantFiled: September 14, 2023Date of Patent: November 26, 2024Assignee: International Business Machines CorporationInventors: Xin Xin Dong, Mai Zeng, Xing Jun Zhou, Ming Qiao Shang Guan, Wei Song, Cheng Fang Wang
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Patent number: 12154007Abstract: A fiber-based roadside condition sensing system is provided. The system includes a fiber optic cable arranged in various roadside locations for Distributed Vibration Sensing (DVS) and Distributed Acoustic Sensing (DAS) at the various roadside locations. The system further includes a machine-learning-based analyzer for selectively providing any of an early warning and a prevention of various detected conditions responsive to a machine-learning-based analysis of results from the DVS and the DAS.Type: GrantFiled: December 21, 2018Date of Patent: November 26, 2024Assignee: NEC CorporationInventors: Ming-Fang Huang, Ting Wang
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Publication number: 20240384455Abstract: Disclosed is an integrated washer-dryer, including: a drum and a drying module assembly, the drying module assembly includes a moisture-absorbing and dehumidifying component, a moisture-absorbing passage, and a dehumidifying passage; the moisture-absorbing passage includes an air inlet and air outlet of the moisture-absorbing passage; the drum is communicated with the air inlet and air outlet of the moisture-absorbing passage, respectively; a fan for the moisture-absorbing passage is arranged in the moisture-absorbing passage, so as to form a moisture-absorbing airflow in the drum and in the moisture-absorbing passage; a fan for the dehumidifying passage is arranged in the dehumidifying passage, so as to form a dehumidifying airflow in the dehumidifying passage; and the moisture-absorbing and dehumidifying component is disposed in a path of the moisture-absorbing passage and the dehumidifying passage, such that the moisture-absorbing airflow and the dehumidifying airflow both flow through the moisture-absorbiType: ApplicationFiled: August 31, 2022Publication date: November 21, 2024Applicant: Nanjing Roborock Innovation Technology Co., Ltd.Inventors: Xing LI, Chuanlin DUAN, Yadong YAN, Jibai HUANG, Zhimin YANG, Zhe WANG, Ming LIU, Chenghu LIN, Junjun FANG, Hang QI, Ming XU, Tong LIU, Gang QUAN
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Publication number: 20240387364Abstract: An interconnection structure includes a first dielectric layer, a first conductive layer disposed in the first dielectric layer, a second dielectric layer disposed over the first dielectric layer, a second conductive layer disposed in the second dielectric layer in electrical contact with the first conductive layer, a third dielectric layer formed over the second dielectric layer, wherein the third dielectric layer comprises silicon carbon-nitride (SiCN) based material, and a resistor device disposed in the third dielectric layer.Type: ApplicationFiled: July 29, 2024Publication date: November 21, 2024Inventors: Kai-Fang CHENG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Ming-Hsien LIN, Hsiao-Kang CHANG
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Patent number: 12146925Abstract: The present disclosure provides a direct current (DC) transformer error detection apparatus for a pulsating harmonic signal, including a DC and pulsating harmonic current output module and an external detected input module, where the DC and pulsating harmonic current output module outputs a DC and a DC superimposed pulsating harmonic current to an internal sampling circuit and a self-calibrated standard resistor array; and the internal sampling circuit converts the input DC and the input DC superimposed pulsating harmonic current into a voltage signal, and sends the voltage signal to an analog-to-digital (AD) sampling and measurement component through a front-end conditioning circuit and a detected input channel. The DC transformer error detection apparatus can complete self-calibration for measurement of the DC and the pulsating harmonic signal on a test site.Type: GrantFiled: August 17, 2022Date of Patent: November 19, 2024Assignee: State Grid Hubei Marketing Service Center (Measurement Center)Inventors: Xin Zheng, Wenjing Yu, Tao Peng, Yi Fang, Ming Lei, Hong Shi, Ben Ma, Li Ding, Wei Wei, Linghua Li, He Yu, Tian Xia, Yingchun Wang, Sike Wang, Dongri Xie, Xin Wang, Bo Pang, Xianjin Rong
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Patent number: 12146341Abstract: An electronic lock device includes a lock mechanism, an actuation mechanism that actuates the lock mechanism, and a control unit including a processor and a current detection module. During an operation in which the actuation mechanism is activated to start switching the lock mechanism from an original state to an intended state, the current detection module continuously detects an amount of electric current flowing through the actuation mechanism. When the amount of electric current is greater than a predetermined threshold, the processor controls the actuation mechanism to switch the lock mechanism back to the original state, and deactivates the actuation mechanism.Type: GrantFiled: September 19, 2022Date of Patent: November 19, 2024Assignee: TONG LUNG METAL INDUSTRY CO., LTD.Inventors: Pai-Hsiang Chuang, Yu Lin, Chun-Yi Fang, Ding-Sian Cai, Chen-Ming Lin, Ruei-Jie Jeng
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Patent number: 12141359Abstract: A vibration feedback device and control method thereof are provided. The vibration feedback device includes a substrate, a frame and a plurality of displacement restoration devices; one end of each displacement restoration device is connected to the frame, and the other end is connected to the substrate; one side of the substrate is the user operation surface, and the other side includes at least one driving coil, at least one induction coil, a controller and a driver; the frame also includes a first magnet set corresponding to the driving coil and a second magnet set corresponding to the induction coil; the controller processes the signal obtained by the induction coil to drive the vibration feedback device to achieve a reliable vibration suppression effect.Type: GrantFiled: September 12, 2023Date of Patent: November 12, 2024Assignee: TOPRAY MEMS INC.Inventors: Chin-Sung Liu, Tzu-Kuang Fang, Hsiao-Ming Chien, Shin-Ter Tsai
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Patent number: 12137858Abstract: A water tank is provided for communicating with a cleaning system on a base station body of a base station and outside of the base station. The water tank includes a clean water cavity configured to hold clean water, a clean water input channel configured to be communicated with the clean water cavity and an external water source outside the base station, a clean water output channel configured to be communicated with the clean water cavity and the cleaning system on the base station body, a sewage cavity configured to hold sewage, a sewage input channel configured to be communicated with the cleaning system on the base station body and the sewage cavity, and a sewage output channel configured to be communicated with the sewage cavity and outside of the base station.Type: GrantFiled: January 18, 2024Date of Patent: November 12, 2024Assignees: YUNJING INTELLIGENCE INNOVATION (SHENZHEN) CO., LTD., YUNJING INTELLIGENCE (SHENZHEN) CO., LTD.Inventors: Churui Xu, Ming Duan, Zhenkang Fang, Yafei Ding, Kunhuan She, Wanlong Qin
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Publication number: 20240368820Abstract: Laundry machines and methods for operating the same are disclosed. A laundry machine includes a container for containing laundry and a dehumidifier including a circulation fan for generating moist air flowing out of the container toward a moisture absorption and removal structure for absorbing moisture in the moist air, a regeneration fan for generating airflow including the moisture absorbed by the moisture absorption and removal structure to flow toward a condenser for condensing water from the generated airflow. The moisture absorption and removal structure is disposed adjacent to the circulation fan, the regeneration fan, and the condenser; wherein the moisture absorption and removal structure comprises a roller assembly, a functional roller is provided on at least one of a bottom portion of the roller assembly or a side of the roller assembly.Type: ApplicationFiled: September 1, 2022Publication date: November 7, 2024Inventors: Xing LI, Chuanlin DUAN, Yadong YAN, Jibai HUANG, Zhimin YANG, Zhe WANG, Ming LIU, Chenghu LIN, Junjun FANG, Hang QI, Ming XU, Tong LIU, Gang QUAN
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Publication number: 20240355826Abstract: A method includes forming a gate stack on a first portion of a semiconductor fin, removing a second portion of the semiconductor fin to form a recess, and forming a source/drain region starting from the recess. The formation of the source/drain region includes performing a first epitaxy process to grow a first semiconductor layer, wherein the first semiconductor layer has straight-and-vertical edges, and performing a second epitaxy process to grow a second semiconductor layer on the first semiconductor layer. The first semiconductor layer and the second semiconductor layer are of a same conductivity type.Type: ApplicationFiled: July 1, 2024Publication date: October 24, 2024Inventors: Jung-Chi Tai, Yi-Fang Pai, Tsz-Mei Kwok, Tsung-Hsi Yang, Jeng-Wei Yu, Cheng-Hsiung Yen, Jui-Hsuan Chen, Chii-Horng Li, Yee-Chia Yeo, Heng-Wen Ting, Ming-Hua Yu
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Publication number: 20240355782Abstract: In an embodiment, a device includes: a bottom integrated circuit die having a first front side and a first back side; a top integrated circuit die having a second front side and a second back side, the second back side being bonded to the first front side, the top integrated circuit die being free from through substrate vias (TSVs); a dielectric layer surrounding the top integrated circuit die, the dielectric layer being disposed on the first front side, the dielectric layer and the bottom integrated circuit die being laterally coterminous; and a through via extending through the dielectric layer, the through via being electrically coupled to the bottom integrated circuit die, surfaces of the through via, the dielectric layer, and the top integrated circuit die being planar.Type: ApplicationFiled: June 27, 2024Publication date: October 24, 2024Inventors: Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh, Nien-Fang Wu
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Publication number: 20240344280Abstract: A segmental precast composite-material composite-slab composite beam and a construction method thereof are provided, relating to the technical field of bridge design and construction. The segmental precast composite-material composite-slab composite beam mainly includes a segmental precast orthotropic composite top slab, a web, a bottom slab, and a wet joint between segments. The orthotropic composite top slab is composed of an orthotropic slab and an ultra-high-performance concrete layer (UHPC), and the interface connection of the orthotropic slab and the UHPC structural layer is achieved by a shear key. The UHPC structural layer is superposed with the orthotropic slab in segments in a precast plant to form a composite-slab composite beam segment to be entirely transported, hoisted and assembled, and the connection of the UHPC structural layers between the segments is achieved by casting a transverse wet joint in place.Type: ApplicationFiled: April 11, 2023Publication date: October 17, 2024Inventors: Jianhui ZHAN, Yan YANG, Yuan LIAO, Zhi FANG, Zhixiong LAN, Ying CHANG, Wangxing DING, Feng SHEN, Zhaohui LIU, Shoufeng TANG, Ming ZHANG, Xingyu TAN, Jinxia ZHAO, Shan PEI, Jing LIU, Zuowei QIN, Bo YAO, Wuzhou HU, Qifen WEI, Xingzhi CHEN, Xiaoqing LIU, Chenliang TAO, Wei JIANG
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Patent number: 12115815Abstract: A car wheel rim decoration cover fastening structure includes a wheel rim, a locking ring, a wheel rim cover, and a central cap. The wheel rim has a rim body and a central hole. The wheel rim has an inner flange formed in the central hole. The locking ring is mounted in the central hole of the wheel rim and locked on the inner flange of the wheel rim. The wheel rim cover has multiple locking blocks secured to the rim body of the wheel rim. The wheel rim cover corresponds to the locking ring. The central cap extends through the center of the wheel rim cover and is locked on the inside of the locking ring. The central cap presses the wheel rim cover. Thus, the wheel rim cover is fixed and will not be detached.Type: GrantFiled: April 13, 2022Date of Patent: October 15, 2024Assignee: Superior Crown Material Co., Ltd.Inventor: Ming-Fang Wang
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Patent number: 12119328Abstract: A die stack structure including a first semiconductor die, a second semiconductor die, an insulating encapsulation and a redistribution circuit structure is provided. The first semiconductor die includes a first semiconductor substrate including a first portion and a second portion, a first interconnect structure and a first bonding structure. The first interconnect structure is disposed on a top surface of the second portion, a lateral dimension of the first portion is greater than a lateral dimension of the top surface of the second portion. The second semiconductor die is disposed on the first semiconductor die and includes a second bonding structure, the second semiconductor die is electrically connected with the first semiconductor die through the first and second bonding structures. The insulating encapsulation is disposed on the first portion and laterally encapsulating the second portion and the second semiconductor die.Type: GrantFiled: August 1, 2023Date of Patent: October 15, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu
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Patent number: 12111189Abstract: Aspects of the present disclosure describe distributed fiber optic sensing (DFOS) systems, methods, and structures that advantageously identify location(s) of construction—or other activities—taking place along fiber optic cable routes that can damage the fiber optic cables.Type: GrantFiled: April 4, 2021Date of Patent: October 8, 2024Assignee: NEC CorporationInventors: Ming-Fang Huang, Ting Wang, Shaobo Han
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Publication number: 20240331862Abstract: The present invention provides a data analytic scheme for screening biomarkers for differential diagnosis of the status of Parkinson's disease, Parkinson's disease with mild cognitive impairment, Parkinson's disease dementia, Alzheimer's disease, and/or multiple system atrophy, the methodology implementing the same and the results of the screening thereof. Biomedical Oriented Logistic Dantzig Selector (BOLD Selector) was developed to identify candidate microRNAs and extracellular vesicle proteins effective at discerning between any two of the above mentioned disease categories from profiling results. The prediction models are finalized by establishing logistic regression formula for each pair of patient group differentiation.Type: ApplicationFiled: March 29, 2024Publication date: October 3, 2024Inventors: Shau-Ping LIN, Ruey-Meei WU, Frederick Kin Hing Phoa, Ming-Che KUO, Yi-Tzang TSAI, Jing-Wen HUANG, Yan-Han LIN, Hsiang-Hsuan LIN WANG, Chia-Lang HSU, Ya-Fang HSU, Pin-Jui KUNG