Patents by Inventor Ming Fang

Ming Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240152418
    Abstract: A communication system and an operation method thereof are provided. A transmitting device transmits a data unit to a receiving device through a data channel of a communication interface. The transmitting device calculates an original verification information unit of the data unit and synchronously transmits the original verification information unit to the receiving device through a verification information channel of the communication interface based on a transmission timing of the data unit in the data channel. After receiving a current data unit and before receiving a next data unit, the receiving device verifies whether the current data unit received from the data channel has errors in real time based on a current original verification information unit corresponding to the current data unit.
    Type: Application
    Filed: November 8, 2022
    Publication date: May 9, 2024
    Applicants: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Igor Elkanovich, Yung-Sheng Fang, Pei Yu, Chang-Ming Liu
  • Patent number: 11973076
    Abstract: The present disclosure provides a electrostatic discharge (ESD) protection circuit, coupled between a first reference terminal and a second reference terminal; the ESD protection circuit includes a first voltage divider, a second voltage divider, a first trigger circuit and a second trigger circuit. The first trigger circuit includes a first terminal and a second terminal, wherein the first terminal is coupled to the first reference terminal, and the second terminal is coupled to the second reference terminal via the first voltage divider. The second trigger circuit includes a first terminal and a second terminal, wherein the first terminal is coupled to the second reference terminal, the second terminal is coupled to the first reference terminal via the second voltage divider, and the second trigger circuit and the first trigger circuit are in parallel connection.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: April 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ming-Fang Lai, Liang-Yu Su, Hang Fan
  • Publication number: 20240133735
    Abstract: A device may receive, from a fiber sensor device, sensing data associated with a fiber optic cable, the sensing data being produced by an activity that poses a threat of damage to the fiber optic cable, and the sensing data identifying: amplitudes of vibration signals, frequencies of the vibration signals, patterns of the vibration signals, times associated with the vibration signals, and locations along the fiber optic cable associated with the vibration signals. The device may process, with a machine learning model, the sensing data to determine a threat level of the activity to the fiber optic cable, the machine learning model having been trained based on historical information regarding detected vibrations, historical information regarding sources of the detected vibrations, and historical information regarding threat levels to the fiber optic cable. The device may perform one or more actions based on the threat level to the fiber optic cable.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Applicants: Verizon Patent and Licensing Inc., NEC Laboratories America, Inc., NEC Corporation
    Inventors: Tiejun J. XIA, Glenn A. WELLBROCK, Ming-Fang HUANG, Ting WANG, Yoshiaki AONO
  • Publication number: 20240132621
    Abstract: Disclosed herein an isolated neutralizing antibody, which is capable of specifically binding to chitinase-3-like protein-1 (YKL-40) and uses thereof. The neutralizing antibody can further conjugate with a metal chelator to form an antibody complex. Further, labeling the antibody complex with a radioactive metal nuclide results in formation of a radioactive antibody complex, which can be used as a contrast agent and treatment for YKL-40 over-expression-related diseases. The radioactive antibody complex can specifically bind to YKL-40, and can be used for diagnosis and the preparation of the use of the treatment for cancers related to YKL-40 over-expression.
    Type: Application
    Filed: April 18, 2023
    Publication date: April 25, 2024
    Inventors: Ming-Cheng Chang, Ping-Fang Chiang, Yu-Jen Kuo
  • Publication number: 20240133719
    Abstract: Systems and methods for manhole localization along deployed fiber optic cables that employs cross-correlation methodologies and ambient road traffic operating proximate to the manholes including fiber optic telecommunications cables to detect the manhole locations using distributed fiber optic sensing (DFOS). Advantageously the manhole locations are determined without employing labor intensive field surveys.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 25, 2024
    Applicant: NEC Laboratories America, Inc.
    Inventors: Milad SALEMI, Ming-Fang HUANG, Shaobo HAN, Yuheng CHEN
  • Publication number: 20240135857
    Abstract: A display panel, a driving method thereof, and a display apparatus. The display panel includes a shift register circuit including shift units. The shift unit includes a first output circuit, a control circuit, and a first node. In a first mode, a display region includes a first sub-region refreshed with a first frequency and a second sub-region refreshed with a second frequency. The shift register circuit includes a first unit group and a second unit group. In some frames, the first and second unit groups output an active scanning level, and in some frames, the control circuit in a first shift unit supplies a non-enabling level to the first node at least after the first unit group outputs the active scanning level. The first shift unit is located in the second unit group and is adjacent to the first unit group.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 25, 2024
    Applicants: Xiamen Tianma Optoelectronics Co., Ltd., Xiamen Tianma Micro-Electronics Co., Ltd.
    Inventors: Yuhao ZHONG, Min HUANG, Jiancai HUANG, Ming FANG
  • Publication number: 20240134074
    Abstract: An AI-driven cable mapping system that employs distributed fiber optic sensing (DFOS) fiber sensing and machine learning that provides autonomous determination of fiber optic cable location and mapping of same. Designed Al algorithms operating within our inventive systems and methods provide an easy solution for cable mapping in a GIS system; automatically maps using landmarks and manhole locations; and employs a supervised learning algorithm. A vehicle-assist operation is employed wherein a vehicle carries a Global Positioning System (GPS) device and drives along a roadway thereby following the fiber optic cable route; data paring that provides further significant locational information wherein time synchronizes between the DFOS system and vehicle GPS device from which we automatically pair the data of fiber length from traffic trajectories and GPS coordinates by time series.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 25, 2024
    Applicant: NEC Laboratories America, Inc.
    Inventors: Ming-Fang HUANG, Chaitanya Prasad NARISETTY
  • Publication number: 20240134042
    Abstract: An underwater sonar device and an underwater detecting system. The underwater sonar device comprises a main body, a propeller, a detector and a hydrofoil assembly. The main body is an axisymmetric structure. The propeller, the detector, and the hydrofoil assembly are disposed on the main body. The detector is configured to detect and image an underwater target. The propeller is configured to drive the main body to move along a longitudinal direction and a vertical direction, and control a pitch angle, a roll angle, and a yaw angle of the main body. The hydrofoil assembly is disposed at a back of the main body, and is configured to adjust an included angle between the hydrofoil assembly and the longitudinal direction of the main body automatically based on water resistance on the hydrofoil assembly to keep the sonar device navigating at a fixed depth.
    Type: Application
    Filed: June 12, 2023
    Publication date: April 25, 2024
    Applicant: Nanfoon Applied Technologies Ltd.
    Inventors: Li FANG, Zhaofu ZHANG, Jing LI, Qiang ZHANG, Ming XU, Jinqing AI, Zaidi HONG
  • Publication number: 20240125962
    Abstract: Method for source localization for cable cut prevention using distributed fiber optic sensing (DFOS)/distributed acoustic sensing (DAS) is described that is robust/immune to underground propagation speed uncertainty. The method estimates the location of a vibration source while considering any uncertainty of vibration propagation speed and formulates the localization as an optimization problem, and both location of the sources and the propagation speed are treated as unknown. This advantageously enables our method to adapt to variances of the velocity and produce a better generalized performance with respect to environmental changes experienced in the field. Our method operates using a DFOS system and AI techniques as an integrated solution for vibration source localization along an entire optical sensor fiber cable route and process real-time DFOS data and extract features that are related to a location of a source of vibrations that may threaten optical fiber facilities.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 18, 2024
    Applicant: NEC Laboratories America, Inc.
    Inventors: Yifan WU, Ming-Fang HUANG, Shaobo HAN, Jian FANG, Yuheng CHEN, Yaowen LI, Mohammad KHOJASTEPOUR
  • Publication number: 20240103097
    Abstract: The present disclosure provides a direct current (DC) transformer error detection apparatus for a pulsating harmonic signal, including a DC and pulsating harmonic current output module and an external detected input module, where the DC and pulsating harmonic current output module outputs a DC and a DC superimposed pulsating harmonic current to an internal sampling circuit and a self-calibrated standard resistor array; and the internal sampling circuit converts the input DC and the input DC superimposed pulsating harmonic current into a voltage signal, and sends the voltage signal to an analog-to-digital (AD) sampling and measurement component through a front-end conditioning circuit and a detected input channel. The DC transformer error detection apparatus can complete self-calibration for measurement of the DC and the pulsating harmonic signal on a test site.
    Type: Application
    Filed: August 17, 2022
    Publication date: March 28, 2024
    Inventors: Xin Zheng, Wenjing Yu, Tao Peng, Yi Fang, Ming Lei, Hong Shi, Ben Ma, Li Ding, Wei Wei, Linghua Li, He Yu, Tian Xia, Yingchun Wang, Sike Wang, Dongri Xie, Xin Wang, Bo Pang, Xianjin Rong
  • Publication number: 20240102833
    Abstract: A DFOS system and machine learning method that automatically localizes manholes, which forms a key step in a fiber optic cable mapping process. Our system and method utilize weakly supervised learning techniques to predict manhole locations based on ambient data captured along the fiber optic cable route. To improve any non-informative ambient data, we employ data selection and label assignment strategies and verify their effectiveness extensively in a variety of settings, including data efficiency and generalizability to different fiber optic cable routes. We describe post-processing steps that bridge the gap between classification and localization and combining results from multiple predictions.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 28, 2024
    Applicant: NEC Laboratories America, Inc.
    Inventors: Shaobo HAN, Yuheng CHEN, Ming-Fang HUANG, Ting WANG, Alexander BUKHARIN
  • Publication number: 20240094288
    Abstract: A circuit screening system including a target circuit under test receiving a first testing signal in a first period and a second testing signal in a second period; and a clock generating circuit providing a clock signal to the target circuit under test, the clock signal triggering the target circuit under test to receive the first testing signal in the first period and the second testing signal in the second period; the clock signal having a first profile and a second profile in the first period and the second period, respectively, and the first profile and the second profile having a phase difference.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 21, 2024
    Inventors: CHI-CHE WU, TSUNG-YANG HUNG, JIA-MING GUO, YI-NA FANG, MING-YIH WANG
  • Patent number: 11935753
    Abstract: A method for forming a packaged integrated circuit device includes providing a semiconductor wafer having a plurality of integrated circuit devices, each integrated circuit device extending into the semiconductor wafer to a first depth, and grinding a backside of the silicon wafer to no more than the first depth. The method further includes forming a backside cut between the integrated circuit devices. The backside cut extends to within the first depth, but the backside cut does not extend completely through the semiconductor wafer. The backside cut exposes a plurality of edges of each of the integrated circuit devices. The method further includes depositing, on the backside of the wafer, a metallization layer on a bottom surface of the integrated circuit devices and on the edges.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: March 19, 2024
    Assignee: NXP B.V
    Inventors: Kuan-Hsiang Mao, Wen Hung Huang, Che Ming Fang, Yufu Liu
  • Publication number: 20240087980
    Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.
    Type: Application
    Filed: February 17, 2023
    Publication date: March 14, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kai-Fang CHENG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Yen-Ju WU, Yen-Pin HSU, Li-Ling SU, Ming-Hsien LIN, Hsiao-Kang CHANG
  • Patent number: 11914832
    Abstract: A membrane touch panel device includes a circuit board unit, a light-blocking frame plate, a plurality of light-blocking tabs, and an operation panel unit that are stacked along a front-rear direction. The circuit board unit includes a circuit board having a plurality of keypad circuits, and a plurality of LEDs being electrically connected to the circuit board. A light transmission rate of the circuit board ranges from 0% to 20%. The light-blocking frame plate is stacked on the circuit board, and defines a hollow section provided for the LEDs to protrude thereinto. The light-blocking tabs are connected to the light-blocking frame plate such that the light-blocking tabs respectively cover the LEDs. The operation panel unit is stacked on the light-blocking frame plate, and has a plurality of key segments being respectively aligned with the keypad circuits, and being adapted to permit light generated by the LEDs to pass therethrough.
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: February 27, 2024
    Assignee: Tong Lung Metal Industry Co., Ltd.
    Inventors: Pai-Hsiang Chuang, Ruei-Jie Jeng, Chen-Ming Lin, Ding-Sian Cai, Chun-Yi Fang
  • Patent number: 11916131
    Abstract: According to an exemplary embodiment, a method of forming a vertical device is provided. The method includes: providing a protrusion over a substrate; forming an etch stop layer over the protrusion; laterally etching a sidewall of the etch stop layer; forming an insulating layer over the etch stop layer; forming a film layer over the insulating layer and the etch stop layer; performing chemical mechanical polishing on the film layer and exposing the etch stop layer; etching a portion of the etch stop layer to expose a top surface of the protrusion; forming an oxide layer over the protrusion and the film layer; and performing chemical mechanical polishing on the oxide layer and exposing the film layer.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: De-Fang Chen, Teng-Chun Tsai, Cheng-Tung Lin, Li-Ting Wang, Chun-Hung Lee, Ming-Ching Chang, Huan-Just Lin
  • Patent number: 11885670
    Abstract: Aspects of the present disclosure describe distributed fiber optic sensing (DFOS) systems, methods, and structures that advantageously are employed in smart stadium or other venue applications, such applications including: parking lot security and management; intrusion detection; social sensing; air quality monitoring and early fire detection—among others.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: January 30, 2024
    Assignee: NEC Corporation
    Inventors: Ming-Fang Huang, Ting Wang
  • Publication number: 20240030173
    Abstract: An IC package includes one or more microelectronic devices, a plurality of package bumps disposed at a first side, and a metal structure electrically connecting at least a first device contact pad of a first microelectronic device and at least a first package bump of the plurality of package bumps. The metal structure includes an RDL trace extending between a first region aligned with the first device contact pad and a second region aligned with the first package bump, wherein the first package bump is mechanically and electrically connected directly to the second region of the RDL trace. The metal structure further includes a first via extending between the first region of the RDL trace and the first device contact pad and further includes a set of one or more support studs extending from the second region to a support surface facing the first side.
    Type: Application
    Filed: July 19, 2022
    Publication date: January 25, 2024
    Inventors: Che Ming Fang, Kuan-Hsiang Mao, Yufu Liu, Wen Hung Huang
  • Patent number: 11874160
    Abstract: A device may receive, from a fiber sensor device, sensing data associated with a fiber optic cable, the sensing data being produced by an activity that poses a threat of damage to the fiber optic cable, and the sensing data identifying: amplitudes of vibration signals, frequencies of the vibration signals, patterns of the vibration signals, times associated with the vibration signals, and locations along the fiber optic cable associated with the vibration signals. The device may process, with a machine learning model, the sensing data to determine a threat level of the activity to the fiber optic cable, the machine learning model having been trained based on historical information regarding detected vibrations, historical information regarding sources of the detected vibrations, and historical information regarding threat levels to the fiber optic cable. The device may perform one or more actions based on the threat level to the fiber optic cable.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: January 16, 2024
    Assignees: Verizon Patent and Licensing Inc., NEC Laboratories America, Inc., NEC Corporation
    Inventors: Tiejun J. Xia, Glenn A. Wellbrock, Ming-Fang Huang, Ting Wang, Yoshiaki Aono
  • Patent number: D1013461
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: February 6, 2024
    Assignees: PRAIRIE PLASTIC HARDWARE CO., LTD., FREE-FREE INDUSTRIAL CORP
    Inventor: Ming Fang Tsai