Patents by Inventor Ming Fang
Ming Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12141359Abstract: A vibration feedback device and control method thereof are provided. The vibration feedback device includes a substrate, a frame and a plurality of displacement restoration devices; one end of each displacement restoration device is connected to the frame, and the other end is connected to the substrate; one side of the substrate is the user operation surface, and the other side includes at least one driving coil, at least one induction coil, a controller and a driver; the frame also includes a first magnet set corresponding to the driving coil and a second magnet set corresponding to the induction coil; the controller processes the signal obtained by the induction coil to drive the vibration feedback device to achieve a reliable vibration suppression effect.Type: GrantFiled: September 12, 2023Date of Patent: November 12, 2024Assignee: TOPRAY MEMS INC.Inventors: Chin-Sung Liu, Tzu-Kuang Fang, Hsiao-Ming Chien, Shin-Ter Tsai
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Patent number: 12137858Abstract: A water tank is provided for communicating with a cleaning system on a base station body of a base station and outside of the base station. The water tank includes a clean water cavity configured to hold clean water, a clean water input channel configured to be communicated with the clean water cavity and an external water source outside the base station, a clean water output channel configured to be communicated with the clean water cavity and the cleaning system on the base station body, a sewage cavity configured to hold sewage, a sewage input channel configured to be communicated with the cleaning system on the base station body and the sewage cavity, and a sewage output channel configured to be communicated with the sewage cavity and outside of the base station.Type: GrantFiled: January 18, 2024Date of Patent: November 12, 2024Assignees: YUNJING INTELLIGENCE INNOVATION (SHENZHEN) CO., LTD., YUNJING INTELLIGENCE (SHENZHEN) CO., LTD.Inventors: Churui Xu, Ming Duan, Zhenkang Fang, Yafei Ding, Kunhuan She, Wanlong Qin
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Publication number: 20240368820Abstract: Laundry machines and methods for operating the same are disclosed. A laundry machine includes a container for containing laundry and a dehumidifier including a circulation fan for generating moist air flowing out of the container toward a moisture absorption and removal structure for absorbing moisture in the moist air, a regeneration fan for generating airflow including the moisture absorbed by the moisture absorption and removal structure to flow toward a condenser for condensing water from the generated airflow. The moisture absorption and removal structure is disposed adjacent to the circulation fan, the regeneration fan, and the condenser; wherein the moisture absorption and removal structure comprises a roller assembly, a functional roller is provided on at least one of a bottom portion of the roller assembly or a side of the roller assembly.Type: ApplicationFiled: September 1, 2022Publication date: November 7, 2024Inventors: Xing LI, Chuanlin DUAN, Yadong YAN, Jibai HUANG, Zhimin YANG, Zhe WANG, Ming LIU, Chenghu LIN, Junjun FANG, Hang QI, Ming XU, Tong LIU, Gang QUAN
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Publication number: 20240355826Abstract: A method includes forming a gate stack on a first portion of a semiconductor fin, removing a second portion of the semiconductor fin to form a recess, and forming a source/drain region starting from the recess. The formation of the source/drain region includes performing a first epitaxy process to grow a first semiconductor layer, wherein the first semiconductor layer has straight-and-vertical edges, and performing a second epitaxy process to grow a second semiconductor layer on the first semiconductor layer. The first semiconductor layer and the second semiconductor layer are of a same conductivity type.Type: ApplicationFiled: July 1, 2024Publication date: October 24, 2024Inventors: Jung-Chi Tai, Yi-Fang Pai, Tsz-Mei Kwok, Tsung-Hsi Yang, Jeng-Wei Yu, Cheng-Hsiung Yen, Jui-Hsuan Chen, Chii-Horng Li, Yee-Chia Yeo, Heng-Wen Ting, Ming-Hua Yu
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Publication number: 20240355782Abstract: In an embodiment, a device includes: a bottom integrated circuit die having a first front side and a first back side; a top integrated circuit die having a second front side and a second back side, the second back side being bonded to the first front side, the top integrated circuit die being free from through substrate vias (TSVs); a dielectric layer surrounding the top integrated circuit die, the dielectric layer being disposed on the first front side, the dielectric layer and the bottom integrated circuit die being laterally coterminous; and a through via extending through the dielectric layer, the through via being electrically coupled to the bottom integrated circuit die, surfaces of the through via, the dielectric layer, and the top integrated circuit die being planar.Type: ApplicationFiled: June 27, 2024Publication date: October 24, 2024Inventors: Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh, Nien-Fang Wu
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Publication number: 20240344280Abstract: A segmental precast composite-material composite-slab composite beam and a construction method thereof are provided, relating to the technical field of bridge design and construction. The segmental precast composite-material composite-slab composite beam mainly includes a segmental precast orthotropic composite top slab, a web, a bottom slab, and a wet joint between segments. The orthotropic composite top slab is composed of an orthotropic slab and an ultra-high-performance concrete layer (UHPC), and the interface connection of the orthotropic slab and the UHPC structural layer is achieved by a shear key. The UHPC structural layer is superposed with the orthotropic slab in segments in a precast plant to form a composite-slab composite beam segment to be entirely transported, hoisted and assembled, and the connection of the UHPC structural layers between the segments is achieved by casting a transverse wet joint in place.Type: ApplicationFiled: April 11, 2023Publication date: October 17, 2024Inventors: Jianhui ZHAN, Yan YANG, Yuan LIAO, Zhi FANG, Zhixiong LAN, Ying CHANG, Wangxing DING, Feng SHEN, Zhaohui LIU, Shoufeng TANG, Ming ZHANG, Xingyu TAN, Jinxia ZHAO, Shan PEI, Jing LIU, Zuowei QIN, Bo YAO, Wuzhou HU, Qifen WEI, Xingzhi CHEN, Xiaoqing LIU, Chenliang TAO, Wei JIANG
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Patent number: 12115815Abstract: A car wheel rim decoration cover fastening structure includes a wheel rim, a locking ring, a wheel rim cover, and a central cap. The wheel rim has a rim body and a central hole. The wheel rim has an inner flange formed in the central hole. The locking ring is mounted in the central hole of the wheel rim and locked on the inner flange of the wheel rim. The wheel rim cover has multiple locking blocks secured to the rim body of the wheel rim. The wheel rim cover corresponds to the locking ring. The central cap extends through the center of the wheel rim cover and is locked on the inside of the locking ring. The central cap presses the wheel rim cover. Thus, the wheel rim cover is fixed and will not be detached.Type: GrantFiled: April 13, 2022Date of Patent: October 15, 2024Assignee: Superior Crown Material Co., Ltd.Inventor: Ming-Fang Wang
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Patent number: 12119328Abstract: A die stack structure including a first semiconductor die, a second semiconductor die, an insulating encapsulation and a redistribution circuit structure is provided. The first semiconductor die includes a first semiconductor substrate including a first portion and a second portion, a first interconnect structure and a first bonding structure. The first interconnect structure is disposed on a top surface of the second portion, a lateral dimension of the first portion is greater than a lateral dimension of the top surface of the second portion. The second semiconductor die is disposed on the first semiconductor die and includes a second bonding structure, the second semiconductor die is electrically connected with the first semiconductor die through the first and second bonding structures. The insulating encapsulation is disposed on the first portion and laterally encapsulating the second portion and the second semiconductor die.Type: GrantFiled: August 1, 2023Date of Patent: October 15, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu
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Patent number: 12111189Abstract: Aspects of the present disclosure describe distributed fiber optic sensing (DFOS) systems, methods, and structures that advantageously identify location(s) of construction—or other activities—taking place along fiber optic cable routes that can damage the fiber optic cables.Type: GrantFiled: April 4, 2021Date of Patent: October 8, 2024Assignee: NEC CorporationInventors: Ming-Fang Huang, Ting Wang, Shaobo Han
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Publication number: 20240331862Abstract: The present invention provides a data analytic scheme for screening biomarkers for differential diagnosis of the status of Parkinson's disease, Parkinson's disease with mild cognitive impairment, Parkinson's disease dementia, Alzheimer's disease, and/or multiple system atrophy, the methodology implementing the same and the results of the screening thereof. Biomedical Oriented Logistic Dantzig Selector (BOLD Selector) was developed to identify candidate microRNAs and extracellular vesicle proteins effective at discerning between any two of the above mentioned disease categories from profiling results. The prediction models are finalized by establishing logistic regression formula for each pair of patient group differentiation.Type: ApplicationFiled: March 29, 2024Publication date: October 3, 2024Inventors: Shau-Ping LIN, Ruey-Meei WU, Frederick Kin Hing Phoa, Ming-Che KUO, Yi-Tzang TSAI, Jing-Wen HUANG, Yan-Han LIN, Hsiang-Hsuan LIN WANG, Chia-Lang HSU, Ya-Fang HSU, Pin-Jui KUNG
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Patent number: 12107134Abstract: A device includes a semiconductor channel region and a gate structure. The semiconductor channel region is on a substrate. The gate structure is over the semiconductor channel region and comprises a gate dielectric layer, a first gate conductor layer, and a second gate conductor layer. The first gate conductor layer is over the gate dielectric layer. The first gate conductor layer includes oxygen. The second gate conductor layer is over the first gate conductor layer.Type: GrantFiled: December 13, 2022Date of Patent: October 1, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Cheng-Ming Lin, Peng-Soon Lim, Zi-Wei Fang
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Publication number: 20240322561Abstract: An electrostatic discharge protection circuit includes an electrostatic discharge clamp between a first rail and a second rail, a trigger device configured to activate the electrostatic discharge clamp in response to an electrostatic discharge event, and a charge dissipation element between the first rail and the second rail to dissipate a residual charge at an input of the trigger device.Type: ApplicationFiled: May 24, 2024Publication date: September 26, 2024Applicant: Taiwan Semiconductor Manufacturing Company LimitedInventors: Ming-Fang Lai, Yi-Hsun Wu, Ching-Yun Chang
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Patent number: 12098225Abstract: The present invention discloses a preparation method for an amphiphilic nanosheet. The preparation method comprises the following steps: mixing choline chloride and urea, and heating to prepare a choline chloride-urea based deep eutectic solvent; adding styrene, divinylbenzene and azobisisobutyronitrile into a higher alkane solvent, stirring and dissolving to obtain an oil phase solvent, wherein an addition amount of the divinylbenzene is greater than 5% by mass of a styrene monomer; and adding a hydrophilic monomer, cetyltrimethylammonium chloride and the oil phase solvent into the deep eutectic solvent, stirring and mixing, ventilating and deoxidizing, then heating to 70° C., reacting for at least 6 h, and then crushing and centrifuging to obtain the amphiphilic nanosheet.Type: GrantFiled: July 14, 2023Date of Patent: September 24, 2024Assignee: Southwest Petroleum UniversityInventors: Ming Duan, Yinan Xu, Jian Zhang, Shenwen Fang, Gang Wu, Xinliang Li, Yuhan Wu, Mengyuan Nie
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Patent number: 12097290Abstract: Provided are nanoparticles and methods of using and making thereof. The inventive nanoparticle comprises a) an inner core comprising a non-cellular material; and b) an outer surface comprising a cellular membrane derived from a cell or a membrane derived from a virus. Medicament delivery systems or pharmaceutical compositions comprising the inventive nanoparticles are also provided. Further provided are immunogenic compositions comprising the inventive nanoparticles, and methods of using the inventive immunogenic compositions for eliciting an immune response, and for treating or preventing diseases or condition, such as neoplasm or cancer, or disease or conditions associated with cell membrane inserting toxin. Vaccines comprising the immunogenic composition comprising the nanoparticles are also provided.Type: GrantFiled: March 14, 2013Date of Patent: September 24, 2024Assignee: The Regents of the University of CaliforniaInventors: Liangfang Zhang, Che-Ming (Jack) Hu, Ronnie Hongbo Fang, Jonathan Copp
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Patent number: 12083138Abstract: Provided are methods of treating joint pain, comprising administering to a subject in need of joint pain treatment an effective amount of a pharmaceutical composition comprising a lipid mixture comprising one or more lipids; and an effective amount of an intra-articular steroid or a pharmaceutically acceptable salt thereof, wherein the therapeutic efficacy of the intra-articular steroid is sustained but the side effects associated with the intra-articular steroid are reduced.Type: GrantFiled: July 8, 2019Date of Patent: September 10, 2024Assignees: Taiwan Liposome Co., Ltd., TLC Biopharmaceuticals, Inc.Inventors: Sheue-Fang Shih, Po-Chun Chang, Ming-Ju Wu
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Publication number: 20240297151Abstract: A die stack structure including a first semiconductor die, a second semiconductor die, an insulating encapsulation and a redistribution circuit structure is provided. The first semiconductor die includes a first semiconductor substrate including a first portion and a second portion, a first interconnect structure and a first bonding structure. The first interconnect structure is disposed on a top surface of the second portion, a lateral dimension of the first portion is greater than a lateral dimension of the top surface of the second portion. The second semiconductor die is disposed on the first semiconductor die and includes a second bonding structure, the second semiconductor die is electrically connected with the first semiconductor die through the first and second bonding structures. The insulating encapsulation is disposed on the first portion and laterally encapsulating the second portion and the second semiconductor die.Type: ApplicationFiled: May 13, 2024Publication date: September 5, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu
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Patent number: 12078528Abstract: Systems, and methods for automatically identifying an underground optical fiber cable length from DFOS systems in real time and pair it with GPS coordinates that advantageously eliminate the need for in-field inspection/work by service personnel to make such real-time distance/location determinations. As such, inefficient, error-prone and labor-intensive prior art methods are rendered obsolete. Operationally, our method disclosure involves driving vehicles including GPS to generate traffic patterns and automatically mapping traffic trajectory signals from a deployed buried fiber optic cable to locate geographic location(s) of the buried fiber optic cable. Traffic patterns are automatically recognized; slack in the fiber optic cable is accounted for; location of traffic lights and other traffic control devices/structures may be determined; and turns in the fiber optic cable may likewise be determined.Type: GrantFiled: July 20, 2022Date of Patent: September 3, 2024Assignee: NEC CorporationInventors: Ming-Fang Huang, Shaobo Han, Yuheng Chen, Milad Salemi, Ting Wang
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Patent number: 12080650Abstract: Contact structures and methods of forming the same are provided. A contact structure according to the present disclosure includes an etch stop layer (ESL), a first pillar feature and a second pillar feature disposed on the ESL, a metal feature disposed between the first pillar feature and the second pillar feature, the metal feature including a first sidewall, a bottom surface, a second sidewall, and a top surface, a dielectric liner extending continuously from a top surface of the first pillar feature, along the first sidewall, the bottom surface and the second sidewall of the metal feature, and onto a top surface of the second pillar feature, and a gap between the first pillar feature and a portion of the dielectric liner that extends along the first sidewall of the metal feature.Type: GrantFiled: December 18, 2023Date of Patent: September 3, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kai-Fang Cheng, Hsiao-Kang Chang, Ming-Han Lee
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Publication number: 20240286423Abstract: Systems and methods related to adaptive ribbon speed control for a line matrix impact printer are provided. A ribbon cartridge includes a ribbon configured to be driven at a ribbon speed, and a ribbon gear configured to rotate with movement of the ribbon. The ribbon includes a ribbon joint patch detectable via a first sensor to determine a first ribbon speed of the ribbon. Rotation of the ribbon gear is detectable via a second sensor to determine a second ribbon speed of the ribbon. A target ribbon speed is determined based on at least one print job characteristic. A current ribbon speed is determined based on the first ribbon speed and the second ribbon speed. The ribbon speed is adjusted based on a difference between the current ribbon speed and the target ribbon speed. Associated systems and methods are also provided.Type: ApplicationFiled: February 27, 2023Publication date: August 29, 2024Inventors: Yu-Min Grant Chang, Robert Ovcharenko, Lee Fang Chong, Ming Ming Yin
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Publication number: 20240278816Abstract: A train braking control method and device supporting multi-stage deceleration, and a storage medium are provided. The method includes the following steps: calculating an initial value of kinetic energy of a train; calculating work of traction force of the train in a process from an initial position to traction removal; calculating work of gravity force of the train in a process from the initial position to a stop; calculating work of braking force of the train in a process from a braking application position to the stop; calculating maximum allowable kinetic energy of the train among all restriction points from the initial position to a stop point; obtaining kinetic energy of the train according to the following formula, determining whether the kinetic energy of the train exceeds the maximum allowable kinetic energy at the restriction point, if so, triggering emergency braking of the train, or else, operating the train normally.Type: ApplicationFiled: November 4, 2021Publication date: August 22, 2024Applicant: CASCO SIGNAL LTD.Inventors: Xuchao WANG, Xinjun LV, Ming CHANG, Xing FANG, Yong YE, Jingen HU