Patents by Inventor Ming Fang

Ming Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250147937
    Abstract: The present invention is a data cleaning device executing a data cleaning method. The data cleaning method includes executing an application, and executing a prompt plugin management program. The operation of executing the prompt plugin management program includes generating a prompt instruction based on an unformatted content via a first prompt template, transmitting the prompt instruction to a first device, and receiving a formatted content from the first device. The formatted content is generated by the first device based on the prompt instruction through a large language model.
    Type: Application
    Filed: November 29, 2023
    Publication date: May 8, 2025
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Yu-Chen TSAI, Ming-Fang WENG
  • Publication number: 20250146862
    Abstract: Systems and methods for cable inspection using optical fiber sensing includes a hardware processor and a memory storing a computer program which, when executed by the hardware processor, causes the hardware processor to collect data from a fiber optic cable and analyze the data with a distributed fiber optic sensing (DFOS) system. Losses and anomalies and their locations are identified in the cable. An alert is generated based on the losses and anomalies.
    Type: Application
    Filed: October 23, 2024
    Publication date: May 8, 2025
    Inventors: Ming-Fang Huang, Ting Wang
  • Publication number: 20250146865
    Abstract: Disclosed are integrated systems and methods employing distributed fiber optic sensing (DFOS) systems and methods to locate buried and/or aerial cables, as well as loop-back aerial cable sections and slack fiber lengths, in real-time. In sharp contrast to the prior art, systems and methods according to aspects of the present disclosure provide the location of cables without necessitating the opening of manholes/hand holes or pull cables to the round—thereby making the overall process faster, more cost-effective and more accurate and precise. Our inventive systems and methods provide a reliable and accurate alternative to current methods utilizing optical time domain reflectometry (OTDR), which requires known and accessible locations and may be ineffective for legacy fibers. By implementing systems and methods according to the present disclosure, service providers, carriers, and owners can efficiently maintain optical fiber networks and ensure reliable services for users.
    Type: Application
    Filed: November 2, 2024
    Publication date: May 8, 2025
    Applicant: NEC Laboratories America, Inc.
    Inventors: Ming-Fang HUANG, Yuheng CHEN, Philip JI
  • Publication number: 20250140698
    Abstract: Contact structures and methods of forming the same are provided. A contact structure according to the present disclosure includes an etch stop layer (ESL), a first pillar feature and a second pillar feature disposed on the ESL, a metal feature disposed between the first pillar feature and the second pillar feature, the metal feature including a first sidewall, a bottom surface, a second sidewall, and a top surface, a dielectric liner extending continuously from a top surface of the first pillar feature, along the first sidewall, the bottom surface and the second sidewall of the metal feature, and onto a top surface of the second pillar feature, and a gap between the first pillar feature and a portion of the dielectric liner that extends along the first sidewall of the metal feature.
    Type: Application
    Filed: July 15, 2024
    Publication date: May 1, 2025
    Inventors: Kai-Fang Cheng, Hsiao-Kang Chang, Ming-Han Lee
  • Publication number: 20250139911
    Abstract: A method of correcting depth of field, performed by a first MR head-mounted device, comprises: superimposing a first virtual object on a first background image to generate an superimposed image, inputting the superimposed image into a depth-of-field correction model to generate a displayed image and display the displayed image, receiving at least one user feedback signal corresponding to the displayed image, and updating a depth-of-field parameter of the depth-of-field correction model with the at least one user feedback signal for the depth-of-field correction model to generate an updated virtual object.
    Type: Application
    Filed: December 5, 2023
    Publication date: May 1, 2025
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Min DI, Ti-Hung KU, Jing Tong FU, MING-FANG WENG
  • Publication number: 20250135046
    Abstract: Disclosed herein is a drug complex having a synthetic peptide, which has an amino acid sequence of SEQ ID: NO.1; a metal chelator coupled to the synthetic peptide; and a peptide chain disposed between the synthetic peptide and the metal chelator, wherein the peptide chain is composed of plural glutamate molecules.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 1, 2025
    Inventors: MING-CHENG CHANG, CHUN-TANG CHEN, PING-FANG CHIANG, CHENG-LIANG PENG
  • Patent number: 12285472
    Abstract: The invention provides a composition, and method of use thereof, comprising self-antigen displaying nanoparticles to target auto-reactive immune components for treating and/or preventing the autoimmune diseases associated therewith. The nanoparticles can also be loaded with cytotoxic drugs for targeted cell killing or with immune-tolerizing compounds to normalize the immune regulation.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: April 29, 2025
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Liangfang Zhang, Che-Ming Jack Hu, Jonathan Copp, Ronnie H. Fang, Brian T. Luk
  • Patent number: 12288752
    Abstract: A semiconductor package includes a first die and a through via. The through via is electrically connected to the first die. The through via includes a first conductive layer having a first width, a second conductive layer having a second width different from the first width and a first seed layer disposed aside an interface between the first conductive layer and the second conductive layer.
    Type: Grant
    Filed: July 5, 2023
    Date of Patent: April 29, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih
  • Patent number: 12286449
    Abstract: Metal complexes including cyclopentadienyl ligands and methods of using such metal complexes to prepare metal-containing films are provided.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: April 29, 2025
    Assignee: MERCK PATENT GMBH
    Inventors: Ming Fang, Joby Eldo, Charles Dezelah, Daniel Moser, Ravi Kanjolia
  • Patent number: 12289476
    Abstract: A method may include obtaining parameter information of a plurality of acquisition devices that communicate with the system to transmit video data to the system. The parameter information of each of the plurality of acquisition device may include transmission information of a target key frame of the video data of the acquisition device. The method may also include determining, based on the parameter information, whether there are collision key frames in the target key frames of the plurality of acquisition devices. The method may also include adjusting an original generation time of at least one of the collision key frames in response to determining that there are collision key frames, so that after the adjustment, there is no collision key frame in the target key frames of the plurality of acquisition devices.
    Type: Grant
    Filed: March 30, 2023
    Date of Patent: April 29, 2025
    Assignee: ZHEJIANG DAHUA TECHNOLOGY CO., LTD.
    Inventors: Jinyu Zhang, Fei Wang, Xiang Li, Zhiji Deng, Ming Liu, Qi Ye, Yongjun Fang
  • Publication number: 20250132235
    Abstract: A method of manufacturing a semiconductor device is provided. The method includes forming a first non-conductive layer over a top side a semiconductor die and patterning the first non-conductive layer to form an opening exposing a top surface of a bond of the semiconductor die. A metal trace of a redistribution layer is formed over a portion of the first non-conductive layer and exposed top surface of the bond pad. A surrounding bump metallization (SBM) structure is formed on a portion of the metal trace. The SBM structure includes a plurality of vertical metal wall segments surrounding a central opening.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 24, 2025
    Inventors: Kuan-Hsiang Mao, Che Ming Fang, Wen Yuan Chuang, Wen Hung Huang
  • Patent number: 12283616
    Abstract: A method includes forming a semiconductor fin; forming a gate dielectric layer over the semiconductor fin; depositing a first work function metal layer over the gate dielectric layer, the first work function metal layer having a first concentration of a work function material; depositing a second work function metal layer over the first work function metal layer, the second work function metal layer having a second concentration of the work function material, wherein the first concentration is higher than the second concentration; and forming a gate electrode over the second work function metal layer.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 22, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Peng-Soon Lim, Zi-Wei Fang, Cheng-Ming Lin
  • Publication number: 20250124716
    Abstract: Disclosed is a stroke-based differentiable rendering for both representation of spatiotemporal sensor data and unsupervised spatiotemporal events detection wherein we encode DAS waterfall data into a structured latent space based on parameterized brushstrokes. The structured brushstroke representation can (1) suppress background noise and distracting clutters from the original waterfall data, (2) allow easy leverage of geometrical prior knowledge for physics-informed pattern recognition. Guided by multiple specially designed targets that emphasize different aspects of the original data, the optimized strokes not only preserve the salient information, but also align well with the original data in terms of spatial and temporal coordinates. As a results, it also provides pixel-level annotation as a byproduct. Based on long term DFOS data and cumulative statistics, we can further localize landmarks (such as traffic lights, manholes, etc.) from the waterfall data. These landmarks can be used for cable mapping.
    Type: Application
    Filed: September 30, 2024
    Publication date: April 17, 2025
    Applicant: NEC Laboratories America, Inc.
    Inventors: Shaobo HAN, Ming-Fang HUANG, Tingfeng LI, Yuheng CHEN, Zhuowei LI
  • Publication number: 20250115069
    Abstract: Systems and methods related to adaptive ribbon speed control for a line matrix impact printer are provided. A ribbon cartridge includes a ribbon configured to be driven at a ribbon speed, and a ribbon gear configured to rotate with movement of the ribbon. The ribbon includes a ribbon joint patch detectable via a first sensor to determine a first ribbon speed of the ribbon. Rotation of the ribbon gear is detectable via a second sensor to determine a second ribbon speed of the ribbon. A target ribbon speed is determined based on at least one print job characteristic. A current ribbon speed is determined based on the first ribbon speed and the second ribbon speed. The ribbon speed is adjusted based on a difference between the current ribbon speed and the target ribbon speed. Associated systems and methods are also provided.
    Type: Application
    Filed: December 16, 2024
    Publication date: April 10, 2025
    Inventors: Yu-Min Grant Chang, Robert Ovcharenko, Lee Fang Chong, Ming Ming Yin
  • Publication number: 20250115671
    Abstract: The present disclosure provides antibodies and antigen-binding fragments thereof that bind to human CCR8, a pharmaceutical composition comprising said antibody, and use of the antibody or the composition for treating a disease, such as cancer.
    Type: Application
    Filed: October 29, 2024
    Publication date: April 10, 2025
    Applicant: BeiGene, Ltd.
    Inventors: Ming FANG, Liu XUE, Hanzi SUN, Xiaoyan TANG, Ming JIANG, Xitao WANG, Yun CHEN, Chichi HUANG, Wenjie WANG, Jing ZHANG, Wenbo JIANG
  • Publication number: 20250115070
    Abstract: Systems and methods related to adaptive ribbon speed control for a line matrix impact printer are provided. A ribbon cartridge includes a ribbon configured to be driven at a ribbon speed, and a ribbon gear configured to rotate with movement of the ribbon. The ribbon includes a ribbon joint patch detectable via a first sensor to determine a first ribbon speed of the ribbon. Rotation of the ribbon gear is detectable via a second sensor to determine a second ribbon speed of the ribbon. A target ribbon speed is determined based on at least one print job characteristic. A current ribbon speed is determined based on the first ribbon speed and the second ribbon speed. The ribbon speed is adjusted based on a difference between the current ribbon speed and the target ribbon speed. Associated systems and methods are also provided.
    Type: Application
    Filed: December 16, 2024
    Publication date: April 10, 2025
    Inventors: Yu-Min Grant Chang, Robert Ovcharenko, Lee Fang Chong, Ming Ming Yin
  • Publication number: 20250112088
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a first low dielectric constant (low-k) layer, a first metal layer, a metal cap layer, a dielectric on dielectric (DoD) layer, an etch stop layer (ESL), a second low-k layer, a metal via and a second metal layer. The dielectric constant of the first low-k layer is less than 4. The first metal layer is embodied in the first low-k layer. The first low-k layer exposes the first metal layer. The metal cap layer is disposed on the first metal layer. The DoD layer is disposed on the first low-k layer. The etch stop layer is disposed on the metal cap layer and the DoD layer. The second low-k layer is disposed above the etch stop layer. The metal via is embodied in the second low-k layer and connected to the first metal layer.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 3, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chin LEE, Yen Ju WU, Shao-Kuan LEE, Kuang-Wei YANG, Hsin-Yen HUANG, Jing Ting SU, Kai-Fang CHENG, Hsiao-Kang CHANG, Wei-Chen CHU, Shu-Yun KU, Chia-Tien WU, Ming-Han LEE, Hsin-Ping CHEN
  • Publication number: 20250094234
    Abstract: A system and computer-implemented method include accessing a request for allocating graphical processing unit (GPU) resources for performing an operation. The request includes metadata identifying a client identifier associated with a client, throughput, and a latency of the operation. A predicted resource limit for performing the operation is determined based on the metadata. A parameter of GPU resources is obtained. The parameter includes a status indicating whether a GPU resource is occupied for performing another operation. A GPU resource utilization value is determined for each node based on the status. The GPU resource utilization value indicates the amount of utilization of GPU resources of the corresponding node. The GPU resource utilization value of each node is compared with a pre-defined resource utilization threshold value. The GPU resources are re-scheduled based on the predicted resource limit. Further, a set of GPU resources from the re-scheduled GPU resources for performing the operation.
    Type: Application
    Filed: May 28, 2024
    Publication date: March 20, 2025
    Applicant: Oracle International Corporation
    Inventors: Ming Fang, Yifeng Liu, Simo Lin, Wei Gao
  • Publication number: 20250094223
    Abstract: A system and computer-implemented method include receiving a request for allocating graphical processing unit (GPU) resources for performing an operation. The request includes metadata identifying a client identifier (ID) associated with a client, throughput, and latency of the operation. A resource limit is determined for performing the operation based on the metadata. Attributes associated with each GPU resource of a plurality of GPU resources available for assignment are obtained. The attribute is analyzed that is associated with each GPU resource with respect to the resource limit. A set of GPU resources is identified from the plurality of GPU resources based on the analysis. A dedicated AI cluster is generated by patching the set of GPU resources within a single cluster. The dedicated AI cluster reserves a portion of a computation capacity of a computing system for a period of time and the dedicated AI cluster is allocated to the client associated with the client ID.
    Type: Application
    Filed: May 28, 2024
    Publication date: March 20, 2025
    Applicant: Oracle International Corporation
    Inventors: Ming Fang, Simo Lin, Jinguo Zhang, Wei Gao
  • Publication number: 20250097013
    Abstract: The present disclosure relates to secure deployment of model weights from a generative artificial intelligence (GenAI) platform to a cloud service. The method includes accessing the model metadata and a set of weights of a GenAI model associated with a GenAI platform. These model weights may be encrypted using a first encryption key that may be provided in the model metadata. These encrypted model weights may be decrypted based on the model metadata by utilizing the first encryption key from the model metadata. Each key may be associated with the specific type of GenAI model. Before storing the model weights from the GenAI platform cloud tenancy to a cloud storage in GenAI home region, the model weights may be encrypted again by utilizing a second encryption key. This encryption by the cloud may enable independent control over the sensitive information during transit and storing.
    Type: Application
    Filed: May 28, 2024
    Publication date: March 20, 2025
    Applicant: Oracle International Corporation
    Inventors: Ming Fang, Simo Lin, Beiwen Guo, Wei Gao