Patents by Inventor Ming Fang

Ming Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11710346
    Abstract: Methods and systems for training a neural network include generate an image of a mask. A copy of an image is generated from an original set of training data. The copy is altered to add the image of a mask to a face detected within the copy. An augmented set of training data is generated that includes the original set of training data and the altered copy. A neural network model is trained to recognize masked faces using the augmented set of training data.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: July 25, 2023
    Inventors: Manmohan Chandraker, Ting Wang, Xiang Xu, Francesco Pittaluga, Gaurav Sharma, Yi-Hsuan Tsai, Masoud Faraki, Yuheng Chen, Yue Tian, Ming-Fang Huang, Jian Fang
  • Publication number: 20230205284
    Abstract: A heat dissipation module is adapted for a circuit board, which has an M.2 bonding hole. The heat dissipation module includes a supporting bracket and a heat dissipation element. The supporting bracket has a first side and a second side opposite to each other, and an accommodating space, which is located between the first side and the second side, and is adapted for installing an SSD interface card. The first side has a first mounting hole and a second mounting hole. The heat dissipation element is combined to the first side through the first mounting hole. When the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board.
    Type: Application
    Filed: June 29, 2022
    Publication date: June 29, 2023
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Dun-Hao Yang, Kuang-Yu Chang, Ming-Fang Tsai
  • Patent number: 11686602
    Abstract: A method of providing a hybrid distributed fiber optic sensing system (DFOS) that extends an existing fiber optic telecommunications network thereby providing that existing fiber optic telecommunications network with DFOS capabilities.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: June 27, 2023
    Assignees: NEC Corporation, Verizon Patent and Licensing Inc.
    Inventors: Ming-Fang Huang, Ting Wang, Tiejun Xia, Glenn Wellbrock, Yoshiaki Aono
  • Patent number: 11686628
    Abstract: Aspects of the present disclosure describe distributed fiber optic sensing (DFOS) systems, methods, and structures that advantageously enable smart refrigeration systems including retail.
    Type: Grant
    Filed: April 10, 2021
    Date of Patent: June 27, 2023
    Assignee: NEC Corporation
    Inventors: Ming-Fang Huang, Ting Wang
  • Patent number: 11681042
    Abstract: Aspects of the present disclosure describe distributed fiber optic sensing systems, methods, and structures that advantageously are employed to determine the location and depth of underground fiber-optic facilities that may be carrying telecommunications traffic.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: June 20, 2023
    Assignee: NEC Corporation
    Inventors: Ming-Fang Huang, Ting Wang, Hansi Liu
  • Publication number: 20230187299
    Abstract: A method for manufacturing a packaged integrated circuit device includes providing a semiconductor wafer having a plurality of integrated circuit devices. Each integrated circuit device extends into the semiconductor wafer to a first depth. Prior to singulation of the integrated circuit devices on the semiconductor wafer, the method further includes forming a cut between the integrated circuit devices. The cut extends to at least the first depth, but does not extend completely through the semiconductor wafer. The cut exposes a plurality of edges of each of the integrated circuit devices. The method further includes depositing, on each integrated circuit device, a passivation layer on a top surface and on the edges.
    Type: Application
    Filed: December 9, 2021
    Publication date: June 15, 2023
    Inventors: Kuan-Hsiang Mao, Che Ming Fang, Yufu Liu, Wen Hung Huang
  • Publication number: 20230187211
    Abstract: A method for forming a packaged integrated circuit device includes providing a semiconductor wafer having a plurality of integrated circuit devices, each integrated circuit device extending into the semiconductor wafer to a first depth, and grinding a backside of the silicon wafer to no more than the first depth. The method further includes forming a backside cut between the integrated circuit devices. The backside cut extends to within the first depth, but the backside cut does not extend completely through the semiconductor wafer. The backside cut exposes a plurality of edges of each of the integrated circuit devices. The method further includes depositing, on the backside of the wafer, a metallization layer on a bottom surface of the integrated circuit devices and on the edges.
    Type: Application
    Filed: December 9, 2021
    Publication date: June 15, 2023
    Inventors: Kuan-Hsiang Mao, Wen Hung Huang, Che Ming Fang, Yufu Liu
  • Publication number: 20230185995
    Abstract: An electromagnetic field simulation method based on subgridding technique and one-step alternating-direction-implicit-finite-difference time-domain (ADI-FDTD) algorithm is provided herein. The method includes establishing an electromagnetic field simulation model by setting an absorption boundary condition, a periodic boundary condition, a total field boundary condition and a scattering field boundary condition based on the one-step ADI-FDTD algorithm, subgridding technique and FDTD algorithm. The electromagnetic field simulation model is configured to select a detection point and a detection surface, obtain a time-domain waveform diagram of a reflection field of a simulation area, a time-domain waveform diagram of a transmission field of the simulation area and frequency-domain information of the simulation area, and simulate an electromagnetic field, by the electromagnetic field simulation model.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 15, 2023
    Inventors: Ming FANG, Chenran LIU, Jian FENG, Guoda XIE, Ke XU, Xueshi HOU, Mandi RONG, Zhixiang HUANG, Xianliang WU
  • Patent number: 11664657
    Abstract: An electrostatic discharge protection circuit includes an electrostatic discharge clamp between a first rail and a second rail, a trigger device configured to activate the electrostatic discharge clamp in response to an electrostatic discharge event, and a charge dissipation element between the first rail and the second rail to dissipate a residual charge at an input of the trigger device.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: May 30, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ming-Fang Lai, Yi-Hsun Wu, Ching-Yun Chang
  • Patent number: 11663752
    Abstract: An augmented reality processing device is provided, comprising an image capturing circuit and a processor. The processor is connected to the image capturing circuit, and execute operations of: generating an original point cloud image according to the first environment image and a physical object in the first environment image; generating an expanded point cloud image corresponding to the physical object from the second environment image according to the first environment image and the physical object point cloud set, and generating a superimposed point cloud image according to the expanded point cloud image and the original point cloud image; and generating a transformation matrix according to the original point cloud image and the expanded point cloud image, and superimposing a virtual object to the second environment image according to the superimposed point cloud image and the transformation matrix.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: May 30, 2023
    Assignee: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Jhih-Rong Chen, Jia-Wei Hong, Ming-Fang Weng
  • Publication number: 20230152130
    Abstract: Systems, methods, and structures for efficiently identifying individual fibers located in a deployed cable that advantageously reduces laborious field efforts while reducing service outage time. The systems and methods locate a targeted fiber in a cable (“Cable ID”) and then identify the targeted fiber (“Fiber ID”) by detecting DFOS signal attentions—without cutting the optical fiber. Two distinct determinations may be made namely, Cable ID and Fiber ID. DFOS operation detects vibration signals occurring along a sensor fiber. As implemented, Cable ID is an interactive-machine learning-based algorithm that automatically locates cable position along a sensor fiber route. Fiber ID detects a signal attenuation by bending a group of fibers with bifurcation to pinpoint a targeted individual fiber within a fiber cable.
    Type: Application
    Filed: November 15, 2022
    Publication date: May 18, 2023
    Applicant: NEC LABORATORIES AMERICA, INC
    Inventors: Ming-Fang HUANG, Philip JI, Shaobo HAN, Ting WANG
  • Publication number: 20230152150
    Abstract: A fiber optic sensing cable located along a side of a paved road and runs parallel to a driving direction is monitored by distributed fiber optic sensing (DFOS) using Rayleigh backscattering generated along the length of the optical sensor fiber cable under dynamic vehicle loads. The interaction of vehicles with roadway locations exhibiting distressed pavement generates unique patterns of localized signals that are identified/distinguished from signals resulting from vehicles operating on roadway exhibiting a smooth pavement surface. Machine learning methods are employed to estimate an overall road surface quality as well as localizing pavement damage. Power spectral density estimation, principal component analysis, support vector machine (SVM) combined with principal component analysis (PCA), local binary pattern (LBP), and convolutional neural network (CNN) are applied to develop the machine learning models.
    Type: Application
    Filed: November 15, 2022
    Publication date: May 18, 2023
    Applicant: NEC LABORATORIES AMERICA, INC
    Inventors: Yuheng CHEN, Ming-Fang HUANG, Ting WANG, Jingnan ZHAO
  • Publication number: 20230152152
    Abstract: Disclosed are distributed fiber optic sensing arrangements that—in sharp contrast to the prior art—utilize C-OTDR capabilities to detect an optical fiber end point while still maintaining operational DFOS vibration/acoustic signal sensing functions. Advantageously, such operations are performed automatically without requiring a manual confirmation. A change is made in digital signal processing in the C-OTDR operation by bypassing a high-pass-filtering stage when calculating intensity changes such that the DC signal component is preserved and used to differentiate from a “no-fiber” section. It then calculates the no-fiber section's signal level and uses a back-tracking operation to determine the fiber end automatically.
    Type: Application
    Filed: November 17, 2022
    Publication date: May 18, 2023
    Applicant: NEC LABORATORIES AMERICA, INC
    Inventors: Philip JI, Junqiang HU, Ting WANG, Ming-Fang HUANG, Yuheng CHEN
  • Publication number: 20230152543
    Abstract: Disclosed are buried cable protection systems and methods that employ impulse signal detection by optical fiber sensing technologies, and which provide such protection automatically and in real-time. The methods theoretically model a time difference of arrival (TDoA) of an impulse wave travelling to a DFOS sensor fiber cable. A model employing a set of propagation relationships that account for vague knowledge about wave propagation speed and threat range(s) is fitted with parameters based on a numerical simulation—without specific knowledge of a source of vibration. As compared to vibration magnitude information, time of arrival (ToA) information is more consistent and less sensitive to ambiguities and inaccuracies. In addition, the model parameter can be adjusted adaptively when temporal resolution of the sensor changes or fluctuates.
    Type: Application
    Filed: November 16, 2022
    Publication date: May 18, 2023
    Applicant: NEC LABORATORIES AMERICA, INC
    Inventors: Shaobo HAN, Ming-Fang HUANG, Yuheng CHEN
  • Patent number: 11652552
    Abstract: Aspects of the present disclosure describe systems, methods and structures providing detection and localization of disaster-related indoor events via hybrid ethernet/optical fiber cable.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: May 16, 2023
    Assignee: NEC Corporation
    Inventors: Ming-Fang Huang, Ting Wang
  • Publication number: 20230142932
    Abstract: A method for underground cable localization by fast time series template matching and distributed fiber optic sensing (DFOS) includes: providing the DFOS system including a length of optical sensor fiber; a DFOS interrogator in optical communication with the optical sensor fiber, said DFOS interrogator configured to generate optical pulses, introduce the generated pulses into the length of optical sensor fiber, and receive backscattered signals from the length of the optical sensor fiber; and an intelligent analyzer configured to analyze DFOS data received by the DFOS interrogator and determine from the backscattered signals, vibrational activity occurring at locations along the length of the optical sensor fiber; deploying a programmable vibration generator to a field location proximate to the length of optical sensor fiber; transmitting to the programmable vibration generator a unique vibration pattern to be generated by the vibration generator; and operating the programmable vibration generator to generate
    Type: Application
    Filed: November 2, 2022
    Publication date: May 11, 2023
    Applicant: NEC LABORATORIES AMERICA, INC
    Inventors: Shaobo HAN, Ming-Fang HUANG, Yuheng CHEN, Ting WANG, Sheng ZHONG
  • Publication number: 20230148172
    Abstract: An augmented reality processing device is provided, comprising an image capturing circuit and a processor. The processor is connected to the image capturing circuit, and execute operations of: generating an original point cloud image according to the first environment image and a physical object in the first environment image; generating an expanded point cloud image corresponding to the physical object from the second environment image according to the first environment image and the physical object point cloud set, and generating a superimposed point cloud image according to the expanded point cloud image and the original point cloud image; and generating a transformation matrix according to the original point cloud image and the expanded point cloud image, and superimposing a virtual object to the second environment image according to the superimposed point cloud image and the transformation matrix.
    Type: Application
    Filed: January 14, 2022
    Publication date: May 11, 2023
    Inventors: Jhih-Rong CHEN, Jia-Wei HONG, Ming-Fang WENG
  • Patent number: 11644369
    Abstract: Aspects of the present disclosure describe monitoring of optical fiber by distributed temperature sensing (DTS) and determining optical fiber degradation and/or abnormal environmental events including landslides, fires, etc., from DTS data.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: May 9, 2023
    Assignee: NEC Corporation
    Inventors: Ming-Fang Huang, Yaowen Li
  • Patent number: 11640947
    Abstract: A packaging semiconductor device, such as a fan-out Wafer-Level Packaging (FOWLP) device, is fabricated by providing a semiconductor device (20) having conductive patterns (22) disposed on a first surface and then forming, on the conductive patterns, photoresist islands (24) having a first predetermined shape defined by a first critical width dimension and a minimum height dimension so that a subsequently-formed dielectric polymer layer (26) surrounds but does not cover each photoresist island (24), thereby allowing each photoresist island to be selectively removed from the one or more conductive patterns to form one or more via openings (28) in the dielectric polymer layer such that each via opening has a second predetermined shape which matches at least part of the first predetermined shape of the photoresist islands.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: May 2, 2023
    Assignee: NXP B.V.
    Inventors: Kuan-Hsiang Mao, Wen Hung Huang, Che Ming Fang, Yufu Liu
  • Publication number: 20230130788
    Abstract: Aspects of the present disclosure describe distributed fiber optic sensing (DFOS) systems, methods, and structures that advantageously sense/monitor outdoor facilities and structures including outdoor cabinets containing fiber optic facilities in which the cabinet/fiber optic cable contained therein are configured to provide superior acoustic sensing. Further outdoor facilities and structures that are monitored include manhole structures. Superior DFOS/DAS monitoring results are obtained by employing a machine learning-based analysis method that employs a temporal relation network (TRN).
    Type: Application
    Filed: October 2, 2022
    Publication date: April 27, 2023
    Applicant: NEC LABORATORIES AMERICA, INC
    Inventors: Sarper OZHARAR, Ting WANG, Yue TIAN, Yangmin DING, Philip JI, Shaobo Han, Ming-Fang Huang, Tingfeng Li