Patents by Inventor Ming-Feng Wu

Ming-Feng Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10755936
    Abstract: First, second, and third trenches are formed in a layer over a substrate. The third trench is substantially wider than the first and second trenches. The first, second, and third trenches are partially filled with a first conductive material. A first anti-reflective material is coated over the first, second, and third trenches. The first anti-reflective material has a first surface topography variation. A first etch-back process is performed to partially remove the first anti-reflective material. Thereafter, a second anti-reflective material is coated over the first anti-reflective material. The second anti-reflective material has a second surface topography variation that is smaller than the first surface topography variation. A second etch-back process is performed to at least partially remove the second anti-reflective material in the first and second trenches. Thereafter, the first conductive material is partially removed in the first and second trenches.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: August 25, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jin-Dah Chen, Ming-Feng Shieh, Han-Wei Wu, Yu-Hsien Lin, Po-Chun Liu, Stan Chen
  • Publication number: 20200170698
    Abstract: The present invention provides a medical torque hand tool, which comprises a holding part, a torque adjusting device, a torque damping device, and a surgery tool. The holding part is disposed in a hollow member. The torque damping device is disposed in said holding part. The torque adjusting device passes through said holding part. The torque adjusting device and the torque damping device control the elastic deformation of an elastic member for controlling the torque of screwing an object.
    Type: Application
    Filed: November 29, 2019
    Publication date: June 4, 2020
    Inventors: CHE-AN PAI, MING FENG WU, HAO-YUAN TANG, HSIANG-HO CHEN, CHING-AN LIN
  • Publication number: 20200168583
    Abstract: A semiconductor device includes a first semiconductor die package. The first semiconductor package includes a molding compound, and a conductive element in the molding compound, wherein a top surface of the conductive element is above or co-planar with a top-most surface of the molding compound. The semiconductor device further includes a second semiconductor die package The second semiconductor package includes a plurality of copper-containing contacts on a single metal pad, wherein each of the plurality of copper-containing contacts is bonded to the conductive element.
    Type: Application
    Filed: January 28, 2020
    Publication date: May 28, 2020
    Inventors: Yu-Feng CHEN, Chun-Hung LIN, Han-Ping PU, Ming-Da CHENG, Kai-Chiang WU
  • Publication number: 20200111753
    Abstract: A semiconductor device includes a semiconductor die having an insulative layer and a conductive feature in the insulative layer, and a shield in contact with a lateral surface of the conductive feature. In some embodiments, the lateral surface of the conductive feature is aligned with an edge of the insulating material.
    Type: Application
    Filed: December 4, 2019
    Publication date: April 9, 2020
    Inventors: CHUEI-TANG WANG, VINCENT CHEN, TZU-CHUN TANG, CHEN-HUA YU, CHING-FENG YANG, MING-KAI LIU, YEN-PING WANG, KAI-CHIANG WU, SHOU ZEN CHANG, WEI-TING LIN, CHUN-LIN LU
  • Publication number: 20200081498
    Abstract: An electronic device includes a base, a lifting mechanism, a body and a switching mechanism. The lifting mechanism and the body are movably disposed at the base. The lifting mechanism is located between the body and the base, and two ends of the lifting mechanism are connected to the body and the base. The switching mechanism is disposed at the base. The switching mechanism is configured to lock the body and the lifting mechanism to the base or configured to remove a locking relationship of the body and the lifting mechanism with respect to the base. An expansion device is further provided.
    Type: Application
    Filed: August 22, 2019
    Publication date: March 12, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ching-Shiang Chang, Tung-Ying Wu, Wang-Hung Yeh, Po-Hsuan Wang, Chien-Feng Chan, Ming-Cheng Tsou
  • Patent number: 10561934
    Abstract: A wearable device is configured to be worn by a first user, and to output pressure data indicating an amount of the pressure sensed thereby. An electronic device is communicatively connected to the wearable device for receiving the pressure data. In response to receipt of an initiating signal from a host device, the electronic device, continuously within a predetermined time period, accumulates a first number of exercise movements done by the first user based on the pressure data, receives data related to a second number of exercise movements done by a second user from the host device, and display a dynamic image indicating a relationship between the first number and the second number.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: February 18, 2020
    Assignee: NATIONAL TAIWAN NORMAL UNIVERSITY
    Inventors: Ming-Yueh Hwang, Jon-Chao Hong, Yu-Feng Wu
  • Patent number: 10553561
    Abstract: A method of forming a semiconductor device includes preparing a first semiconductor die package with conductive elements embedded in a molding compound, wherein the conductive elements are exposed on a surface of the molding compound. A top surface of the conductive elements is above or co-planar with a top-most surface of the molding compound. The method further includes providing a second semiconductor die package; and bonding the conductive elements of the first semiconductor die package to contacts on the semiconductor die package.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: February 4, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Ming-Da Cheng, Kai-Chiang Wu
  • Publication number: 20200006201
    Abstract: A semiconductor device includes a through-substrate via extending from a frontside to a backside of a semiconductor substrate. The through-substrate via includes a concave or a convex portion adjacent to the backside of the semiconductor substrate. An isolation film is formed on the backside of the semiconductor substrate. A conductive layer includes a first portion formed on the concave or convex portion of the through substrate via and a second portion formed on the isolation film. A passivation layer partially covers the conductive layer.
    Type: Application
    Filed: September 13, 2019
    Publication date: January 2, 2020
    Inventors: Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen, Ku-Feng Yang, Tsang-Jiuh Wu, Wen-Chih Chiou
  • Patent number: 10510641
    Abstract: A semiconductor device includes a through-substrate via extending from a frontside to a backside of a semiconductor substrate. The through-substrate via includes a concave or a convex portion adjacent to the backside of the semiconductor substrate. An isolation film is formed on the backside of the semiconductor substrate. A conductive layer includes a first portion formed on the concave or convex portion of the through substrate via and a second portion formed on the isolation film. A passivation layer partially covers the conductive layer.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen, Ku-Feng Yang, Tsang-Jiuh Wu, Wen-Chih Chiou
  • Patent number: 10510681
    Abstract: A semiconductor device includes a semiconductor die, an insulative layer, a plurality of conductive features, a dummy redistribution layer (RDL), and an Electromagnetic Interference (EMI) shield. The insulative layer covers the semiconductor die. The conductive features substantially surround the insulative layer. The dummy RDL is over the insulative layer and electrically disconnected from the semiconductor die. The EMI shield is in contact with the plurality of conductive features and the dummy RDL.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: December 17, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang, Ming-Kai Liu, Yen-Ping Wang, Kai-Chiang Wu, Shou Zen Chang, Wei-Ting Lin, Chun-Lin Lu
  • Publication number: 20190347033
    Abstract: The invention introduces an apparatus for facilitating deletions of file data that is protected by copy-on-write (COW) snapshots, at least including a storage device and a processing unit. The processing unit calculates release estimates for accumulated inspection sets, each of which includes one or more identities (IDs) of first COW snapshots, deleting second COW snapshots with references made to the release estimates, and deleting the sets of file data that are invisible from a directory tree and are not protected by any COW snapshot after the second COW snapshots are deleted.
    Type: Application
    Filed: January 16, 2019
    Publication date: November 14, 2019
    Applicant: Synology Inc.
    Inventors: Ming-Feng WEI, Po-Chun WU
  • Patent number: 10459431
    Abstract: A three-dimensional printing apparatus includes a liquid tank, a curing platform and a light source device. A bearing member of the liquid tank is air proof, and forms an accommodating space with a side wall of the liquid tank. The curing platform is disposed at a first side of the bearing member corresponding to the accommodating space for allowing a workpiece to be cured on a surface thereof. After the accommodating space accommodates a liquid material, a curing light beam provided by a light source device disposed at a second side of the bearing member opposite to the accommodating space cures at least part of the liquid material on a surface of the curing platform via the bearing member. The use of a solid release material between the curing platform and the bearing member may be omitted. Methods for printing and releasing a three-dimensional workpiece are also provided.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: October 29, 2019
    Assignee: YOUNG OPTICS INC.
    Inventors: Li-Han Wu, Yea-Ru Sheu, Ming-Feng Ho, Chao-Shun Chen
  • Publication number: 20190252193
    Abstract: First, second, and third trenches are formed in a layer over a substrate. The third trench is substantially wider than the first and second trenches. The first, second, and third trenches are partially filled with a first conductive material. A first anti-reflective material is coated over the first, second, and third trenches. The first anti-reflective material has a first surface topography variation. A first etch-back process is performed to partially remove the first anti-reflective material. Thereafter, a second anti-reflective material is coated over the first anti-reflective material. The second anti-reflective material has a second surface topography variation that is smaller than the first surface topography variation. A second etch-back process is performed to at least partially remove the second anti-reflective material in the first and second trenches. Thereafter, the first conductive material is partially removed in the first and second trenches.
    Type: Application
    Filed: April 26, 2019
    Publication date: August 15, 2019
    Inventors: Jin-Dah Chen, Ming-Feng Shieh, Han-Wei Wu, Yu-Hsien Lin, Po-Chun Liu, Stan Chen
  • Patent number: 10312209
    Abstract: The present disclosure provides a semiconductor package, which includes a substrate, a passivation layer, a post-passivation interconnect (PPI) having a top surface; and a conductive structure. The top surface of the PPI includes a first region receiving the conductive structure, and a second region surrounding the first region. The second region includes metal derivative transformed from materials made of the first region. The present disclosure provide a method of manufacturing a semiconductor package, including forming a first flux layer covering a portion of a top surface of a PPI; transforming a portion of the top surface of the PPI uncovered by the first flux layer into a metal derivative layer; removing the first flux layer; forming a second flux layer on the first region of the PPI; dropping a solder ball on the flux layer; and forming electrical connection between the solder ball and the PPI.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: June 4, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang
  • Publication number: 20190139956
    Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.
    Type: Application
    Filed: October 3, 2018
    Publication date: May 9, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kuan-Jung Chen, I-Chih Chen, Chih-Mu Huang, Kai-Di Wu, Ming-Feng Lee, Ting-Chun Kuan
  • Patent number: 9808121
    Abstract: A seasoning mill includes a receiving unit, a grinding unit disposed in the receiving unit, and a closure unit. The closure unit includes a stationary seat having at least one grinding opening, a rotation control seat having a cover wall formed with at least one control opening, and a coupling member for providing a resistive force between a coupling shaft and the rotation control seat such that the rotation control seat is co-rotatable with the coupling shaft relative to the stationary seat from a closed position to an opened position, and that the rotation control seat is capable of being maintained at the opened position when a rotational force exerted thereon is released.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: November 7, 2017
    Assignee: YIENN LIH ENTERPRISE CO., LTD.
    Inventor: Ming-Feng Wu
  • Publication number: 20170065128
    Abstract: A seasoning mill includes a receiving unit, a grinding unit disposed in the receiving unit, and a closure unit. The closure unit includes a stationary seat having at least one grinding opening, a rotation control seat having a cover wall formed with at least one control opening, and a coupling member for providing a resistive force between a coupling shaft and the rotation control seat such that the rotation control seat is co-rotatable with the coupling shaft relative to the stationary seat from a closed position to an opened position, and that the rotation control seat is capable of being maintained at the opened position when a rotational force exerted thereon is released.
    Type: Application
    Filed: November 25, 2015
    Publication date: March 9, 2017
    Inventor: Ming-Feng WU
  • Patent number: 9564297
    Abstract: In a plasma reactor for processing a workpiece, an electron beam is employed as the plasma source, and a remote radical source is incorporated with the process chamber.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: February 7, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Ming-Feng Wu, Leonid Dorf, Shahid Rauf, Ying Zhang, Kenneth S. Collins, Hamid Tavassoli, Kartik Ramaswamy, Steven Lane
  • Patent number: 9556218
    Abstract: The present invention provides intermediates for preparing abiraterone, and processes for preparing abiraterone and intermediates thereof. The intermediates include a compound of formula (IV): wherein R represents a hydroxy-protecting group.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: January 31, 2017
    Assignee: ScinoPharm Taiwan, Ltd.
    Inventors: Lung-Huang Kuo, Hsiao-Ping Fang, Ming-Feng Wu, Yu-Sheng Chang
  • Patent number: 9269546
    Abstract: Electron beam-confining electromagnets of an electron beam generator are aligned with an electron beam axis, each of the electromagnets being folded to define a main section and a pair of angled wing sections disposed at respective angles relative to said main section, and a conductor wound around the edge.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: February 23, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Ming-Feng Wu, Ajit Balakrishna, Leonid Dorf, Shahid Rauf, Kenneth S. Collins, Nipun Misra