Abstract: In some embodiments, the present disclosure relates an integrated chip including a substrate. A conductive interconnect feature is arranged over the substrate. The conductive interconnect feature has a base feature portion with a base feature width and an upper feature portion with an upper feature width. The upper feature width is narrower than the base feature width such that the conductive interconnect feature has tapered outer feature sidewalls. An interconnect via is arranged over the conductive interconnect feature. The interconnect via has a base via portion with a base via width and an upper via portion with an upper via width. The upper via width is wider than the base via width such that the interconnect via has tapered outer via sidewalls.

Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.

Abstract: An approach is provided in which the approach builds a combination model that includes a normal status model and an abnormal status model. The normal status model is built from a set of time-sequenced normal status records and the abnormal status model is built from a set of time-sequenced abnormal status records. The approach computes a set of time-sequenced coefficient combination values of the normal status model and the abnormal status model based on applying a set of fitting coefficient characteristics to the normal status model and the abnormal status model. The approach performs goal seek analysis on a system using the combination model and the set of time-sequenced coefficient combination values.

Abstract: An absorption type near-infrared filter comprising a first multilayer film, a second multilayer film, and an absorption film, wherein in the ultraviolet band, the difference of between the wavelength with the transmittance at 80% of the absorbing film and the wavelength with the reflectivity at 80% of the first multilayer film falls in the range between 25 nm and 37 nm, the difference of between the wavelength with the transmittance at 50% of the absorbing film and the wavelength with the reflectivity at 50% of the first multilayer film falls in the range between 6 nm and 14 nm, and the difference of between the wavelength with the transmittance at 20% of the absorbing film and the wavelength with the reflectivity at 20% of the first multilayer film falls in the range between ?6 nm and 2.5 nm.

Abstract: Systems and methods for manhole localization along deployed fiber optic cables that employs cross-correlation methodologies and ambient road traffic operating proximate to the manholes including fiber optic telecommunications cables to detect the manhole locations using distributed fiber optic sensing (DFOS). Advantageously the manhole locations are determined without employing labor intensive field surveys.

Abstract: A discontinuous transmission (DTX) information transmission method is provided. The DTX information transmission method may include the following steps. A processor of an apparatus may determine whether to enter a DTX mode. A transceiver of the apparatus may transmit DTX information to a network node in response to determining to enter the DTX mode.

Abstract: A method of fabricating a semiconductor interconnect structure includes forming a via in a dielectric layer, depositing a ruthenium-containing conductive layer over a top surface of the via and a top surface of the dielectric layer, and patterning the ruthenium-containing conductive layer to form a conductive line over the top surface of the via, where a thickness of the conductive line is less than a thickness of the via.

Abstract: Method for source localization for cable cut prevention using distributed fiber optic sensing (DFOS)/distributed acoustic sensing (DAS) is described that is robust/immune to underground propagation speed uncertainty. The method estimates the location of a vibration source while considering any uncertainty of vibration propagation speed and formulates the localization as an optimization problem, and both location of the sources and the propagation speed are treated as unknown. This advantageously enables our method to adapt to variances of the velocity and produce a better generalized performance with respect to environmental changes experienced in the field. Our method operates using a DFOS system and AI techniques as an integrated solution for vibration source localization along an entire optical sensor fiber cable route and process real-time DFOS data and extract features that are related to a location of a source of vibrations that may threaten optical fiber facilities.

Abstract: According to an aspect of an embodiment, operations may comprise accessing an HD map of a region comprising information describing an intersection of two or more roads and describing lanes of the two or more roads that intersect the intersection, automatically identifying constraints on the lanes at the intersection, automatically calculating, based on the constraints on the lanes at the intersection, lane connectivity for the intersection, displaying, on a user interface, the automatically calculated lane connectivity for the intersection, receiving, from a user through the user interface, confirmation that the automatically calculated lane connectivity for the intersection is an actual lane connectivity for the intersection, and adding the actual lane connectivity for the intersection to the information describing the intersection in the HD map.

Abstract: A process for reducing the interfacial tension between a hydrocarbon fluid and a surfactant mixture during chemical enhanced oil recovery includes introducing a surfactant mixture solution comprising an anionic surfactant, a cationic surfactant, a nonionic surfactant, a brine solution, and a co-solvent to a hydrocarbon-bearing reservoir under conditions of a salinity of greater than or equal to 50,000 mg/L, a hardness of greater than or equal to 2,500 mg/L, and a temperature of greater than or equal to 90° C., thereby reducing the interfacial tension at a liquid-liquid interface of the hydrocarbon fluid and the surfactant mixture solution. The anionic surfactant comprises organo sulfate. The cationic surfactant comprises quaternary ammonium, brominated trimethylammonium, chloride trimethylammonium, or combinations thereof. The nonionic surfactant comprises polyoxyethylene fatty acid ester, phenylated ethoxylate, or combinations thereof.

Abstract: Integrated circuit packages and methods of forming the same are provided. In an embodiment, a device includes: a power distribution interposer including: a first bonding layer; a first die connector in the first bonding layer; and a back-side interconnect structure including a power rail connected to the first die connector; and an integrated circuit die including: a second bonding layer directly bonded to the first bonding layer by dielectric-to-dielectric bonds; a second die connector in the second bonding layer, the second die connector directly bonded to the first die connector by metal-to-metal bonds; and a device layer on the second bonding layer, the device layer including a contact and a transistor, the transistor including a first source/drain region, the contact connecting a back-side of the first source/drain region to the second die connector.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.

Abstract: A semiconductor package includes a first semiconductor die and a second semiconductor die disposed laterally adjacent one another. The semiconductor package includes a semiconductor bridge overlapping a first corner of the first semiconductor die and a second corner of the second semiconductor die. The semiconductor bridge electrically couples the first semiconductor to the second semiconductor die. The semiconductor package includes a third semiconductor die and a fourth semiconductor die electrically coupled to the first semiconductor die and the second semiconductor die, respectively. The semiconductor bridge is interposed between the third semiconductor die and the fourth semiconductor die.

Abstract: An image pre-processing method and an image processing apparatus for a fundoscopic image are provided. A region of interest (ROI) is obtained from a fundoscopic image to generate a first image. The ROI is focused on an eyeball in the fundoscopic image. A smoothing process is performed on the first image to generate a second image. A value difference between neighboring pixels in the second image is increased to generate a third image.

Abstract: Methods for forming dummy under-bump metallurgy structures and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution line and a second redistribution line over a semiconductor substrate; a first passivation layer over the first redistribution line and the second redistribution line; a second passivation layer over the first passivation layer; a first under-bump metallurgy (UBM) structure over the first redistribution line, the first UBM structure extending through the first passivation layer and the second passivation layer and being electrically coupled to the first redistribution line; and a second UBM structure over the second redistribution line, the second UBM structure extending through the second passivation layer, the second UBM structure being electrically isolated from the second redistribution line by the first passivation layer.

Abstract: A gear module includes a rotating cylinder, a first planetary gear set, a second planetary gear set, a concave-convex structure, and a limit bearing set. The first planetary gear set is accommodated in the rotating cylinder and includes a driven gear; the second planetary gear set includes a positioning frame, second planetary gears pivoted to a positioning frame, a driven gear engaged with the second planetary gears, and the positioning frame has a through hole; the concave-convex structure includes a convex column extended from the rotating cylinder and a concave hole formed on the positioning frame, the convex column is plugged into the concave hole; the limit bearing set includes a first ball bearing sheathing the driven gear and mounted between the driven gear and the through hole, and a second ball bearing sheathing the convex column and mounted between the convex column and the concave hole.

Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.

Abstract: A gas detection purification device is disclosed and includes a main body, a purification unit, a gas guider, a gas detection module and a controlling-driving module. The main body includes an inlet, an outlet, an external socket and a gas-flow channel disposed between the inlet and the outlet. The purification unit is disposed in the gas-flow channel for filtering gas introduced through the gas-flow channel. The gas guider is disposed in the gas channel and located at a side of the purification unit. The gas is inhaled through the inlet, flows through the purification unit and is discharged out through the outlet. The gas detection module is plugged into or detached from the external socket. The controlling driving module is disposed within the main body and electrically connected to the gas guider to control the operation of the gas guider in an enabled state and a disabled state.