Abstract: A process for etching a substrate 25 in an etching chamber 30, and simultaneously cleaning a thin, non-homogeneous, etch residue deposited on the surfaces of the walls 45 and components of the etching chamber 30. In the etching step, process gas comprising etchant gas is used to etch a substrate 25 in the etching chamber 30 thereby depositing etch residue inside the chamber 30. Cleaning gas is added to the process gas for a sufficient time and in a volumetric flow ratio that is sufficiently high, to react with and remove substantially all the etch residue deposited by the process gas. The present method advantageously cleans the etch residue in the chamber 30, during the etching process, and without use of separate cleaning, conditioning, and seasoning process steps.

Abstract: A printhead includes a silicon substrate, a first barrier layer, a second barrier layer, and a nozzle plate. The silicon substrate has a plurality of thermal elements and a main ink supply channel, each of the thermal elements being in a firing chamber of the first barrier layer and in fluid communications with the main ink supply channel through ink channels. The top of each ink firing elements is aligned with a nozzle on the nozzle plate. To satisfy the need for high frequency ink ejection, the second barrier layer is utilized to provide an auxiliary ink supply channel for increasing the ink supply speed. The ink channel between the main ink supply and the ink channel inlet is enlarged in the vertical direction so as to lower the pressure and thus increase the ink supply speed.

Abstract: An apparatus and a method for cleaning a torch for a vertical furnace used in semiconductor processing are disclosed. The apparatus is constructed by two main components of a basket-shaped fixture body and a cleaning bath. The fixture body is formed of cylindrical shape with a top ring, a bottom ring and three support rods connecting the two rings together. The top ring is provided with an outwardly extending flange portion for engaging an opening in a cleaning bath for supporting and suspending the fixture body in the bath. The bottom ring is equipped with a pair of symmetrically positioned, inwardly extending arcuate-shaped flange portions adapted for supporting an edge of a bottom surface of the furnace torch in the cleaning bath.

Abstract: A nozzle plate and a method of fabricating a nozzle plate on an inkjet print head are provided. A patterned first nozzle layer is formed over an ink wall layer over the inkjet print head. The first nozzle layer has at least a first opening. The wall of the first opening is treated to form a hydrophilic surface. Thereafter, a patterned second nozzle layer is formed over the first nozzle layer. The second nozzle layer has at least a second opening having connection with the first opening. The wall of the second opening is treated to form a hydrophobic surface. The first nozzle layer and the second nozzle layer together form a nozzle plate. The first opening and the second opening together form a nozzle with the lower section of the wall hydrophilic but the upper section of the wall hydrophobic.

Abstract: A piezoelectric ink-jet printhead that uses a metallic layer and a thick film layer with a slot hole therein instead of a ceramic vibration plate and an ink layer. The piezoelectric layer and the upper electrode layer are formed inside the ink cavity so that overall thickness of the print head is reduced. To form the ink-jet print head, a metallic layer and a lower electrode layer are sequentially formed over a substrate. A patterned piezoelectric layer and an upper electrode layer are sequentially formed over the lower electrode layer. A patterned thick film layer with a slot hole therein is formed over the metallic layer. The thick film layer and the metallic layer together form a cavity that encloses the piezoelectric layer and the upper electrode layer. A nozzle plate having a nozzle thereon is attached to the thick film layer. The nozzle plate, the thick film layer and the metallic layer together form an ink cavity. The hole in the nozzle is continuous with the ink cavity.

Abstract: Method of wet etching a semiconductor wafer comprises immersing the wafer into a chemical bath filled with etchant solution, keeping the wafer in the etchant for predetermined time, and taking it out of the etchant upon completing etching. While in the bath, the wafer is turned upside down around an axis normal to its plane to provide for equalizing etching time for various areas of the wafer and thus to contribute to higher wafer etching uniformity.

Abstract: A method of forming a nozzle plate of an inkjet print head. A silicon chip is provided with an activated device and a first film is formed on the silicon chip, with a first opening corresponding to the activated device. Then, a second film is formed on the first film. Next, a photoresist layer is formed on the second film, such that the photoresist layer has a second opening corresponding to the first opening. Next, the second film under the second opening of the photoresist layer is etched to form a via in the second film passing through the first opening.

Abstract: A piezoelectric ink-jet printhead that uses a metallic layer and a thick film layer with a slot hole therein instead of a ceramic vibration plate and an ink layer. The piezoelectric layer and the upper electrode layer are formed inside the ink cavity so that overall thickness of the print head is reduced. To form the ink-jet print head, a metallic layer and a lower electrode layer are sequentially formed over a substrate. A patterned piezoelectric layer and an upper electrode layer are sequentially formed over the lower electrode layer. A patterned thick film layer with a slot hole therein is formed over the metallic layer. The thick film layer and the metallic layer together form a cavity that encloses the piezoelectric layer and the upper electrode layer. A nozzle plate having a nozzle thereon is attached to the thick film layer. The nozzle plate, the thick film layer and the metallic layer together form an ink cavity. The hole in the nozzle is continuous with the ink cavity.

Abstract: An apparatus and a method for cleaning a torch for a vertical furnace used in semiconductor processing are disclosed. The apparatus is constructed by two main components of a basket-shaped fixture body and a cleaning bath. The fixture body is formed of cylindrical shape with a top ring, a bottom ring and three support rods connecting the two rings together. The top ring is provided with an outwardly extending flange portion for engaging an opening in a cleaning bath for supporting and suspending the fixture body in the bath. The bottom ring is equipped with a pair of symmetrically positioned, inwardly extending arcuate-shaped flange portions adapted for supporting an edge of a bottom surface of the furnace torch in the cleaning bath.

Abstract: An apparatus for fixing the position of a quartz furnace tube in a semiconductor processing furnace is described. The furnace is of the type that has a cylindrical body possessing an open end through which the tube may be withdrawn, and a base postioned on the open end, wherein the tube includes a flange portion secured to the base through which gas may be withdrawn from or introduced into the furnace tube. The tube is coaxially disposed within the furnace body. The apparatus may include two clamp halves each has a half-circular shape for engaging the flange portion of the furnace tube onto the base, and a mounting means for mounting the two clamp halves to the base.

Abstract: An inkjet printhead chip is installed at the nose of an ink cartridge. Its structure includes a silicon substrate, a barrier layer, and a nozzle plate. The nozzle plate is formed with two parallel rows of inkjet nozzles. Two rows of ink channels roughly parallel to the inkjet nozzles and two rows of independent control circuits are provided among the silicon substrate, the barrier layer and the nozzle plate. The ink channels are disposed between the two rows of nozzles. The control circuits are configured to be on the outer sides of the two rows of nozzles. Using this structure of ink channels and control circuits, the inkjet printhead chip allows a larger area for attaching the nozzle plate. A flexible printed circuit is used to send external control signals from both sides of the chip to the control circuits, starting ink firing elements to eject ink and form patterns or texts on a nearby medium.

Abstract: This specification discloses a structure of an inkjet printhead chip and the method for making the same. A silicon substrate installed with a thermal element is covered with a photoresist layer or polymer material as a barrier layer. A sandblasting process is employed to make a slot on the silicon substrate as an ink channel. A photolithographic process is used to form a pattern on the barrier layer, which is then etched to form many ink cavities in fluid communications with the ink channel and pillars between the ink chambers. Finally, the barrier layer is attached onto a polymer nozzle plate by lamination. The pillars are formed between the ink cavities and the ink channel so that the polymer does not sink at the ink cavities or around the nozzles during lamination, thus ensuring the correction ejection direction of the nozzles.

Abstract: A piezoelectric ink-jet printhead that uses a metallic layer and a thick film layer with a slot hole therein instead of a ceramic vibration plate and an ink layer. The piezoelectric layer and the upper electrode layer are formed inside the ink cavity so that overall thickness of the print head is reduced. To form the ink-jet print head, a metallic layer and a lower electrode layer are sequentially formed over a substrate. A patterned piezoelectric layer and an upper electrode layer are sequentially formed over the lower electrode layer. A patterned thick film layer with a slot hole therein is formed over the metallic layer. The thick film layer and the metallic layer together form a cavity that encloses the piezoelectric layer and the upper electrode layer. A nozzle plate having a nozzle thereon is attached to the thick film layer. The nozzle plate, the thick film layer and the metallic layer together form an ink cavity. The hole in the nozzle is continuous with the ink cavity.

Abstract: A printhead includes a silicon substrate, a first barrier layer, a second barrier layer, and a nozzle plate. The silicon substrate has a plurality of thermal elements and a main ink supply channel, each of the thermal elements being in an firing chamber of the first barrier layer and in fluid communications with the main ink supply channel through ink channels. The top of each ink firing elements is aligned with a nozzle on the nozzle plate. To satisfy the need for high-frequency ink ejection, the invention utilizes the second barrier layer to provide an auxiliary ink supply channel for increasing the ink supply speed. The ink channel between the main ink supply channel and the ink channel inlet is enlarged in the vertical direction so as to lower the pressure and thus increase the ink supply speed.

Abstract: An ink cartridge having a piezoelectric jet module has an ink storage module having a hollow ink storage region, a piezoelectric jet module having a plurality of ink chambers and a connection circuit, and an ink channel connected to the ink storage module and to the piezoelectric jet module. The piezoelectric inkjet printhead has a bottom film and chamber walls which are obtained by applying a photosensitive polymer on a substrate on which a piezoelectric layer has been formed and carrying out photolithography.

Abstract: A method in accordance with present invention comprises the steps of: forming a micro-control apparatus having a plurality of ejecting elements; forming a first layer of film on said micro-control apparatus and forming a plurality of ink chambers in the first layer of film; forming a second layer of photosensitive film on said first layer of film and forming an ink orifice in said second layer of photosensitive film relative to each of said plurality of ink chambers in the first layer of film by photolithography. The method for manufacturing the printhead in accordance with the present invention is relatively simple. Using this method, the application of a nozzle plate to a dry film photoresist and the precision alignment between ink orifices and ink chambers in manufacturing a conventional printhead can be avoided so that the throughput and yield rate can be increased.

Abstract: An ink-jet cartridge for an ink-jet pen is disclosed. The cartridge includes a back pressure chamber in which the level of ink will be self-adjusted to provide ink for ejection and prevent ink from leakage. The ink-jet cartridge includes an ink reservoir for storing ink, a back pressure chamber, a print ink chamber and a print head. The back pressure chamber has one end fluid-communicated with the ink in the ink reservoir, and the other end fluid-communicated with the print ink chamber via an overflow vent which is at a position higher than the ink level of the ink reservoir.

Abstract: The ink-jet cartridge of the present invention includes two magnetic plates attached to the two sides of a flexible ink reservoir and facing each other with their sides of the same magnetic polarity. Alternatively, the two magnetic plates are attached to two flexible bags within the rigid ink reservoir and face each other with their sides of the same magnetic polarity. Due to the repulsive force generated by the two magnetic plates, a pressure regulating effect can be achieved within the ink reservoir to prevent ink leakage and provide smooth ink delivery while printing.

Abstract: A process for etching a substrate 25 in an etching chamber 30, and simultaneously cleaning a thin, non-homogeneous, etch residue deposited on the surfaces of the walls 45 and components of the etching chamber 30. In the etching step, process gas comprising etchant gas is used to etch a substrate 25 in the etching chamber 30 thereby depositing etch residue inside the chamber 30. Cleaning gas is added to the process gas for a sufficient time and in a volumetric flow ratio that is sufficiently high, to react with and remove substantially all the etch residue deposited by the process gas. The present method advantageously cleans the etch residue in the chamber 30, during the etching process, and without use of separate cleaning, conditioning, and seasoning process steps.