Abstract: A method of forming photo masks having rectangular patterns and a method for forming a semiconductor structure using the photo masks is provided. The method for forming the photo masks includes determining a minimum spacing and identifying vertical conductive feature patterns having a spacing less than the minimum spacing value. The method further includes determining a first direction to expand and a second direction to shrink, and checking against design rules to see if the design rules are violated for each of the vertical conductive feature patterns identified. If designed rules are not violated, the identified vertical conductive feature pattern is replaced with a revised vertical conductive feature pattern having a rectangular shape. The photo masks are then formed. The semiconductor structure can be formed using the photo masks.

Abstract: A method of forming photo masks having rectangular patterns and a method for forming a semiconductor structure using the photo masks is provided. The method for forming the photo masks includes determining a minimum spacing and identifying vertical conductive feature patterns having a spacing less than the minimum spacing value. The method further includes determining a first direction to expand and a second direction to shrink, and checking against design rules to see if the design rules are violated for each of the vertical conductive feature patterns identified. If designed rules are not violated, the identified vertical conductive feature pattern is replaced with a revised vertical conductive feature pattern having a rectangular shape. The photo masks are then formed. The semiconductor structure can be formed using the photo masks.

Abstract: A method of forming photo masks having rectangular patterns and a method for forming a semiconductor structure using the photo masks is provided. The method for forming the photo masks includes determining a minimum spacing and identifying vertical conductive feature patterns having a spacing less than the minimum spacing value. The method further includes determining a first direction to expand and a second direction to shrink, and checking against design rules to see if the design rules are violated for each of the vertical conductive feature patterns identified. If designed rules are not violated, the identified vertical conductive feature pattern is replaced with a revised vertical conductive feature pattern having a rectangular shape. The photo masks are then formed. The semiconductor structure can be formed using the photo masks.

Abstract: A method of forming photo masks having rectangular patterns and a method for forming a semiconductor structure using the photo masks is provided. The method for forming the photo masks includes determining a minimum spacing and identifying vertical conductive feature patterns having a spacing less than the minimum spacing value. The method further includes determining a first direction to expand and a second direction to shrink, and checking against design rules to see if the design rules are violated for each of the vertical conductive feature patterns identified. If designed rules are not violated, the identified vertical conductive feature pattern is replaced with a revised vertical conductive feature pattern having a rectangular shape. The photo masks are then formed. The semiconductor structure can be formed using the photo masks.

Abstract: Bond pad structures are presented. Some embodiments of the structure include a conductive conductor-insulator layer overlying a substrate. The conductive conductor-insulator layer includes a composite region having a conductor sub-region and insulator sub-region, which neighbor each other, and a single material region. The insulator is harder than the conductor.

Abstract: A method of forming photo masks having rectangular patterns and a method for forming a semiconductor structure using the photo masks is provided. The method for forming the photo masks includes determining a minimum spacing and identifying vertical conductive feature patterns having a spacing less than the minimum spacing value. The method further includes determining a first direction to expand and a second direction to shrink, and checking against design rules to see if the design rules are violated for each of the vertical conductive feature patterns identified. If designed rules are not violated, the identified vertical conductive feature pattern is replaced with a revised vertical conductive feature pattern having a rectangular shape. The photo masks are then formed. The semiconductor structure can be formed using the photo masks.

Abstract: Bond pad structures are presented. Some embodiments of the structure include a conductive conductor-insulator layer overlying a substrate. The conductive conductor-insulator layer includes a composite region having a conductor sub-region and insulator sub-region, which neighbor each other, and a single material region. The insulator is harder than the conductor.

Abstract: A method of forming photo masks having rectangular patterns and a method for forming a semiconductor structure using the photo masks is provided. The method for forming the photo masks includes determining a minimum spacing and identifying vertical conductive feature patterns having a spacing less than the minimum spacing value. The method further includes determining a first direction to expand and a second direction to shrink, and checking against design rules to see if the design rules are violated for each of the vertical conductive feature patterns identified. If designed rules are not violated, the identified vertical conductive feature pattern is replaced with a revised vertical conductive feature pattern having a rectangular shape. The photo masks are then formed. The semiconductor structure can be formed using the photo masks.

Abstract: A power transmission and mode change mechanism for a logic controlled cassette tape recording and/or reproducing apparatus employs a single motor as a power source for high and low speed tape winding and mode changing and a single solenoid for control of a partially toothed cam mechanism which in turn controls setting of the modes.

Abstract: A brake mechanism of drum type magnetic recording and reproducing apparatus having a take-up reel, supply reel, each having a gear and reel body, and frictional force thus produced between said gear and real body during relative rotation. And a rocking gear mechanism selectively engages with the gear of said take-up reel or supply reel, and a brake plate mounted on said rocking gear mechanism, and including a first and second clutch teeth thereon, when said rocking gear mechanism engaged with said supply reel or take-up reel, said brake plate driven in rotation to enable said clutch teeth to engage with the gear of take-up reel to produce a brake force. With the aforesaid assembly, it may provide different back tension of tape under different modes of operation for said magnetic tape machine.

Abstract: An improved brake mechanism for use with magnetic-drum tape machines is disclosed. It comprises a take-up reel, a supply reel, each having a gear and a roller body, and a friction device to provide frictional force during relative rotation between the respective pair of the gear and the roller body. The supply reel has a partial cylindrical portion, and a swing gear mechanism selectively engages with the gear of the take-up reel or the supply reel. A brake plate is mounted on the swing gear mechanism; it includes an auxiliary brake and a plurality of clutch teeth. When the swing gear mechanism is engaged with the supply reel or the take-up reel, the brake plate is driven in rotation to enable the clutch teeth to engage with the gear of the take-up reel or to enable the auxiliary brake to hold against the partial cylindrical portion of the supply reel to produce a brake force, and a main brake to engage with the supply reel.

Abstract: An improved tape winding linkage is disclosed. It comprises: (a) a deck, a gear shaft, a tape loading gear, and a guiding slot formed on the deck; (b) a first link having first and second joints, the first link being connected to the gear shaft at the first joint thereof; (c) a second link having first, second, and third joints, wherein the second link is divided into a first portion and a second portion intersecting at an angle at the second joint of the second link, and the second link further comprises a guiding pin located at the an under surface of the second joint to be received by and slide along the guiding slot of the deck; (d) a third link having first and second joints; (e) an inclined pole base connected to the third link at the second joint of the third link; and (f) an inclined pole base guiding pin provided at an under surface of the inclined pole base to be received by and slide along the guiding slot of the deck.

Abstract: A kind of tape winding linkage of drum type magnetic recording and reproducing apparatus, comprising a tape winding gear, a first and a second links both with two joints, a third link with two joints having spring effect. The first link is attached to the shaft of the tape winding gear while the second link is connected to the first link by its first pivot joint and connected to the third link by its second pivot joint, also its second link's guided pin is being embedded in the guided slot of the deck such that it can move along the guided slot of the deck. What is more, the third link is connected to the inclined pole base by its third pivot joint. As the loading gear is driven by the power source's mechanism, the third link which possess spring effect is compressed and produced reacting force such that it makes the inclined pole base to move along the guided slot of the deck at the tape winding and unwinding position so as to divert the tape out of the cassette and wind around the magnetic drum.