Patents by Inventor Ming-Ji Dai

Ming-Ji Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10540474
    Abstract: A chip temperature computation method and a chip temperature computation device are provided. The chip temperature computation method includes: computing an upper layer thermal resistance and a lower layer thermal resistance of a chip, computing a total thermal resistance of the chip, and computing a temperature of the chip according to the total thermal resistance.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: January 21, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Heng-Chieh Chien, Sheng-Tsai Wu, Ming-Ji Dai, Chih-Ming Shen
  • Publication number: 20190213725
    Abstract: A board defect filtering method is provided. The method includes: receiving a defect list; obtaining a plurality of defect images of a plurality of defect records on the defect list; receiving a circuit layout image; analyzing a defect location of a first defect image of the plurality of defect images according to the circuit layout image; cropping the first defect image to obtain a first cropped defect image according to the defect location; inputting the first cropping defect image to a defect classifying model; and determining whether the first defect image is a qualified product image or not according to an output result of the defect classifying model.
    Type: Application
    Filed: September 19, 2018
    Publication date: July 11, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Ming-Kaan Liang, An-Chun Luo, Yu-Shan Deng, Chih-Ming Shen, Ming-Ji Dai
  • Patent number: 10343868
    Abstract: Provided is a roller with pressure sensor. The roller includes a pressure sensor mounted to the roller. The pressure sensor includes a plurality of pressure sensing units distributed on a thin film. The pressure sensing units are electrically connected to each other with a metal wire but not in contact with each other. Also provided is a roll-to-roll device, which includes a roller mechanism and a pressure sensor.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: July 9, 2019
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ming-Kaan Liang, Ming-Ji Dai, Chin-Hung Wang, Chih-Ming Shen
  • Publication number: 20190188357
    Abstract: A chip temperature computation method and a chip temperature computation device are provided. The chip temperature computation method includes: computing an upper layer thermal resistance and a lower layer thermal resistance of a chip, computing a total thermal resistance of the chip, and computing a temperature of the chip according to the total thermal resistance.
    Type: Application
    Filed: March 15, 2018
    Publication date: June 20, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Heng-Chieh Chien, Sheng-Tsai Wu, Ming-Ji Dai, Chih-Ming Shen
  • Publication number: 20180136287
    Abstract: An intelligent diagnosis system for a power module. The system includes a power module, a hardware checking module and a diagnostic module. The power module has a temperature sensing element for obtaining a temperature difference between a starting minimum temperature and a current temperature. The hardware checking module has a current sensing element, a voltage sensing element and a magnetic coupling closed loop detection element for obtaining the current, the output voltage and the input voltage of the power module, and the hardware loop status, respectively. The diagnostic module calculates the number of cycles that have been operated, a measured impedance and an instantaneous power based on those measurement results, and calculating a risk index based on the number of cycles that have been operated, the temperature difference, the measured impedance, the instantaneous power and the hardware loop status, thereby determining the accumulation of the abnormality index record.
    Type: Application
    Filed: November 16, 2016
    Publication date: May 17, 2018
    Inventors: Chih-Chung CHIU, Chih-Ming TZENG, Li-Ling LIAO, Yu-Lin CHAO, Chih-Ming SHEN, Ming-Kaan LIANG, Chun-Kai LIU, Ming-Ji DAI
  • Publication number: 20180129763
    Abstract: A method of manufacturing a foot auxiliary equipment includes the following steps. Firstly, a foot appearance of a foot and a foot muscle of the foot are scanned for obtaining a foot appearance data model and a foot muscle data s model respectively. Then, the foot appearance data model and the foot muscle data model are synthesized into a foot data model. Then, a dynamic state analysis and a static state analysis are performed on the foot data model. Then, a foot auxiliary equipment data model is generated according to result of the dynamic state analysis and result of the static state analysis. Then, a foot auxiliary equipment is printed by using three-dimensional printing technique according to the foot auxiliary equipment data model.
    Type: Application
    Filed: December 9, 2016
    Publication date: May 10, 2018
    Inventors: Ming-Kan LIANG, Wei LI, Chih-Ming SHEN, Ming-Ji DAI, Chia-Wei JUI
  • Publication number: 20180040798
    Abstract: A structure of a thermoelectric module including at least one substrate, a thermoelectric device and an insulation protection structure is provided. The thermoelectric device is disposed on the substrate. The insulation protection structure surrounds the thermoelectric device. The thermoelectric device includes at least three electrode plates, first type and second type thermoelectric materials and a diffusion barrier structure. First and second electrode plates among the three electrode plates are disposed on the substrate. The first type thermoelectric material is disposed on the first electrode plate. The second type thermoelectric material is disposed on the second electrode plate. A third electrode plate among the three electrode plates is disposed on the first type and second type thermoelectric materials. The diffusion barrier structure is disposed on two terminals of each of the first type and second type thermoelectric materials.
    Type: Application
    Filed: September 30, 2017
    Publication date: February 8, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Li-Ling Liao, Ming-Ji Dai, Chun-Kai Liu, Cheng-Heng Kao, Cheng-Chieh Li, Jeffrey Snyder, Fivos Drymiotis
  • Publication number: 20180033772
    Abstract: A semiconductor device is provided. The semiconductor device includes at least one first die, a rib structure enclosing the at least one first die, and a molding layer covering the at least one first die. The rib structure is formed of a first material and the molding layer is formed of a second material. A Young's modulus of the first material is larger than a Young's modulus of the second material. The rib structure includes a through hole, and the through hole is filled with a conductive material.
    Type: Application
    Filed: October 11, 2017
    Publication date: February 1, 2018
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Ming SHEN, Shih-Hsien WU, Ming-Ji DAI
  • Publication number: 20180022563
    Abstract: Provided is a roller with pressure sensor. The roller includes a pressure sensor mounted to the roller. The pressure sensor includes a plurality of pressure sensing units distributed on a thin film. The pressure sensing units are electrically connected to each other with a metal wire but not in contact with each other. Also provided is a roll-to-roll device, which includes a roller mechanism and a pressure sensor.
    Type: Application
    Filed: July 27, 2016
    Publication date: January 25, 2018
    Inventors: Ming-Kaan Liang, Ming-Ji Dai, Chin-Hung Wang, Chih-Ming Shen
  • Publication number: 20170170146
    Abstract: A semiconductor device is provided. The semiconductor device includes at least one first die, a rib structure enclosing the at least one first die, and a molding layer covering the at least one first die. The rib structure is formed of a first material and the molding layer is formed of a second material. A Young's modulus of the first material is larger than a Young's modulus of the second material.
    Type: Application
    Filed: December 15, 2015
    Publication date: June 15, 2017
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Ming SHEN, Shih-Hsien WU, Ming-Ji DAI
  • Patent number: 9448121
    Abstract: A measurement method, a measurement apparatus, and a computer program product for measuring a thermoelectric module are provided. A temperature is provided to the thermoelectric module. A current is applied to the thermoelectric module to turn both sides of the thermoelectric module into a hot side and a cold side. The temperature of the hot side is higher than that of the cold side. A terminal voltage of the thermoelectric module, a hot side temperature of the hot side, and a cold side temperature of the cold side are measured at different time points. A thermoelectric relationship between the terminal voltages and differences between the hot side temperatures and the corresponding cold side temperatures is obtained according to the terminal voltages, the hot side temperatures, and the cold side temperatures. At least one first parameter of the thermoelectric module is estimated according to the thermoelectric relationship.
    Type: Grant
    Filed: April 1, 2013
    Date of Patent: September 20, 2016
    Assignee: Industrial Technology Research Institute
    Inventors: Heng-Chieh Chien, Ming-Ji Dai, Sheng-Tsai Wu, Huey-Lin Hsieh, Jing-Yi Huang
  • Publication number: 20160163950
    Abstract: A structure of a thermoelectric module including at least one substrate, a thermoelectric device and an insulation protection structure is provided. The thermoelectric device is disposed on the substrate. The insulation protection structure surrounds the thermoelectric device. The thermoelectric device includes at least three electrode plates, first type and second type thermoelectric materials and a diffusion barrier structure. First and second electrode plates among the three electrode plates are disposed on the substrate. The first type thermoelectric material is disposed on the first electrode plate. The second type thermoelectric material is disposed on the second electrode plate. A third electrode plate among the three electrode plates is disposed on the first type and second type thermoelectric materials. The diffusion barrier structure is disposed on two terminals of each of the first type and second type thermoelectric materials.
    Type: Application
    Filed: December 8, 2014
    Publication date: June 9, 2016
    Inventors: Li-Ling Liao, Ming-Ji Dai, Chun-Kai Liu, Cheng-Heng Kao, Cheng-Chieh Li, Jeffrey Snyder, Fivos Drymiotis
  • Patent number: 9130080
    Abstract: An encapsulation of backside illumination photosensitive device including a circuit sub-mount, a backside illumination photosensitive device, a plurality of conductive terminals, and a heat dissipation structure is provided. The backside illumination photosensitive device includes an interconnection layer and a photosensitive device array, wherein the interconnection layer is located on the circuit sub-mount, and between the photosensitive device array and the circuit sub-mount. The conductive terminals are located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount. The heat dissipation structure is located under the interconnection layer, and the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: September 8, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Zhi-Cheng Hsiao, Ming-Ji Dai, Cheng-Ta Ko
  • Publication number: 20140291790
    Abstract: An encapsulation of backside illumination photosensitive device including a circuit sub-mount, a backside illumination photosensitive device, a plurality of conductive terminals, and a heat dissipation structure is provided. The backside illumination photosensitive device includes an interconnection layer and a photosensitive device array, wherein the interconnection layer is located on the circuit sub-mount, and between the photosensitive device array and the circuit sub-mount. The conductive terminals are located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount. The heat dissipation structure is located under the interconnection layer, and the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer.
    Type: Application
    Filed: July 17, 2013
    Publication date: October 2, 2014
    Inventors: Zhi-Cheng Hsiao, Ming-Ji Dai, Cheng-Ta Ko
  • Patent number: 8674491
    Abstract: A semiconductor device including a silicon substrate, a plurality of silicon nanowire clusters, a first circuit layer and a second circuit layer. The silicon substrate has a first surface, a second surface opposite to the first surface and a plurality of through holes. The silicon nanowire clusters are disposed in the through holes of the silicon substrate, respectively. The first circuit layer is disposed on the first surface and connected to the silicon nanowire clusters. The second circuit layer is disposed on the second surface and connected to the silicon nanowire clusters.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: March 18, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Kai Liu, John H. Lau, Ming-Ji Dai, Ra-Min Tain
  • Patent number: 8664509
    Abstract: A thermoelectric apparatus includes a first and a second assemblies, at least a first and a second heat conductors. The first assembly includes a first and a second substrates, and several first thermoelectric material sets disposed between the first and second substrates. The first substrate has at least a first through hole. The second assembly includes a third and a fourth substrates, and several second thermoelectric material sets disposed between the third and fourth substrates. The fourth substrate has at least a second through hole. Each of the first and second thermoelectric material sets has a p-type and an n-type thermoelectric element. The first and second heat conductors respectively penetrate the first and second through holes. Two ends of the first heat conductor respectively connect the second and fourth substrates, while two ends of the second heat conductor respectively connect the first and third substrates.
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: March 4, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Kai Liu, Ming-Ji Dai, Suh-Yun Feng, Li-Ling Liao
  • Patent number: 8609454
    Abstract: A self-assembly apparatus for assembling a plurality of devices with a predetermined aspect ratio is provided. The self-assembly apparatus includes a guiding element, a vibration device, and a magnetic field inducing device. The guiding element has a mesh structure. The vibration device is coupled to the guiding element and configured to vibrate the guiding element. The magnetic field inducing device is disposed below the guiding element and configured to generate a time-varying magnetic field to rotate each of the devices. Through a collective effect of the vibration of the guiding element, the time-varying magnetic field, and the self-gravity of each of the devices, the devices are positioned on a plate between the guiding element and the magnetic field inducing device through the mesh structure.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: December 17, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Ji Dai, Chun-Kai Liu, Heng-Chieh Chien, Li-Ling Liao, Ker-Win Wang, Yen-Lin Tzeng, Yan-Bo Lin
  • Publication number: 20130302935
    Abstract: A self-assembly apparatus for assembling a plurality of devices with a predetermined aspect ratio is provided. The self-assembly apparatus includes a guiding element, a vibration device, and a magnetic field inducing device. The guiding element has a mesh structure. The vibration device is coupled to the guiding element and configured to vibrate the guiding element. The magnetic field inducing device is disposed below the guiding element and configured to generate a time-varying magnetic field to rotate each of the devices. Through a collective effect of the vibration of the guiding element, the time-varying magnetic field, and the self-gravity of each of the devices, the devices are positioned on a plate between the guiding element and the magnetic field inducing device through the mesh structure.
    Type: Application
    Filed: July 17, 2012
    Publication date: November 14, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ming-Ji Dai, Chun-Kai Liu, Heng-Chieh Chien, Li-Ling Liao, Ker-Win Wang, Yen-Lin Tzeng, Yan-Bo Lin
  • Publication number: 20130276464
    Abstract: A measurement method, a measurement apparatus, and a computer program product for measuring a thermoelectric module are provided. A temperature is provided to the thermoelectric module. A current is applied to the thermoelectric module to turn both sides of the thermoelectric module into a hot side and a cold side. The temperature of the hot side is higher than that of the cold side. A terminal voltage of the thermoelectric module, a hot side temperature of the hot side, and a cold side temperature of the cold side are measured at different time points. A thermoelectric relationship between the terminal voltages and differences between the hot side temperatures and the corresponding cold side temperatures is obtained according to the terminal voltages, the hot side temperatures, and the cold side temperatures. At least one first parameter of the thermoelectric module is estimated according to the thermoelectric relationship.
    Type: Application
    Filed: April 1, 2013
    Publication date: October 24, 2013
    Inventors: Heng-Chieh Chien, Ming-Ji Dai, Sheng-Tsai Wu, Huey-Lin Hsieh, Jing-Yi Huang
  • Patent number: 8552554
    Abstract: A heat dissipation structure for an electronic device includes a body having a first surface and a second surface opposite to the first surface. A silicon-containing insulating layer is disposed on the first surface of the body. A chemical vapor deposition (CVD) diamond film is disposed on the silicon-containing insulating layer. A first conductive pattern layer is disposed on the silicon-containing insulating layer, wherein the first conductive pattern layer is enclosed by and spaced apart from the CVD diamond film. A method for fabricating a heat dissipation structure for an electronic device and an electronic package having the heat dissipation structure are also disclosed.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: October 8, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Ra-Min Tain, Ming-Ji Dai, Yon-Hua Tzeng