Abstract: A method for manufacturing a write pole for perpendicular magnetic recording for accurately defining a side shield throat height and write pole flare point. The method includes the formation of a magnetic structure that provides an electronic lapping guide as well as providing the structure for both the side shields and the write pole. The magnetic structure includes a write pole portion and first and second side shield portions. The side shields portions are magnetically connected with the write pole portion in a region in front of an intended air hearing surface plane (e.g. in the direction from which lapping will progress). The side shields portions are each separated from the write pole portion in a region behind the intended air bearing surface plane by notches that terminate at a desired location relative to the intended air bearing surface plane and which open up in a region behind the intended air bearing surface plane.

Abstract: A perpendicular magnetic recording write head supported on an air-bearing slider has a magnetic write pole (WP) with a WP end at the air-bearing surface (ABS) having a width generally equal to the data track width and a trailing shield (TS) with a TS end generally coplanar with the WP end. The TS has a first portion with a width at the TS end substantially wider than the width of the WP end and a TS notch (TSN) portion with a width at the TS end generally equal to the width of the WP end. The TS first portion has a height in a direction perpendicular to the ABS, and the TSN portion has a throat height (TH) in a direction perpendicular to the ABS that is less than the height of the TS first portion. A nonmagnetic gap layer separates the WP from the TSN portion and a nonmagnetic pad layer separates the WP from the TS first portion.

Abstract: A wrap around shield of a write head is fabricated in multiple processes, with side shields fabricated in one process, and a trailing shield formed in another process. These multiple processes form a stitched wrap around shield, resulting in more flexible and accurate placement of the trailing shield and side shields with respect to the write pole. These processes also independently form the dimensions (shapes and sizes) of the side shields and the trailing shield which allows better control of writeability, saturation, and adjacent track interference of the perpendicular recording write head.

Abstract: A mounting assembly of a computer enclosure includes a chassis (90), a front panel (10) slidably mounted to the chassis (90), a pair of locking members (30) attached to the front panel (10), a pair of sliding members (50) fixedly attached to the chassis (90) and a pair of pressing members (70) movably mounted to the chassis (90) for unlocking the locking members (30). Each sliding member (50) has a sliding portion (53). Each locking member (30) defines a sliding groove (31) therein. The sliding portion (53) of the sliding member (50) is engaged in the sliding groove (31) for securing the front panel (10) on the chassis (90).

Abstract: Methods for fabricating TMR and CPP GMR magnetic heads using a chemical mechanical polishing (CMP) process with a patterned CMP conductive protective layer for sensor stripe height patterning. The method comprises defining a stripe height of a read sensor of a magnetic head reader. The method further comprises refill depositing an insulator layer on the read sensor. The method further comprises performing a CMP process down to the conductive protective layer on the read sensor deposited while defining the read sensor to remove an overfill portion of the insulator layer above the conductive protective layer and to remove a sensor pattern masking structure on the conductive protective layer. As a result, the insulator layer is planarized and smooth with the read sensor, eliminating fencing and alumina bumps typically encountered in the insulator layer at the edge of the patterned sensor.

Abstract: A perpendicular write head including a main pole and a trailing shield, the main pole being made of a diamond-like carbon (DLC) layer as hard mask and a rhodium (Rh) layer as shield gap, both DLC and Rh layers being CMP stop layers so as to avoid corner rounding and damage from chemical mechanical planarization (CMP) process, the DLC layer being removed by reactive ion etching (RIE) to create a trench, the trailing shield being deposited into the trench for self alignment.

Abstract: In an elliptical step exercise apparatus where stride length can be varied the various user programs can take advantage of this feature to provide for an enhanced workout. A control system can be used to implement a preprogrammed exercise routine such as a hill program where stride is shortened as the user goes up a simulated hill and lengthened as the user goes down the hill. In an interval training program, stride length can be increased and decreased at periodic intervals. In a cross training program, stride length can be decreased when the user is pedaling backwards and increased when the user is pedaling forwards.

Abstract: A method using a CMP resistant hardmask in a process of fabricating a pole piece for a magnetic head is described. A set of layers used as the mask for milling the pole piece preferably includes a CMP resistant hardmask of silicon dioxide, a resist hardmask, an upper hardmask and a photoresist mask respectively. A multi-step reactive-ion etching (RIE) process is preferably used to sequentially remove the excess materials in the layer stack to ultimately define the multilayer mask for the pole piece. The excess pole piece material is then milled away. The wafer is then refilled with a nonmagnetic material such as alumina. A CMP liftoff is used to remove the resist hardmask. The material for the CMP resistant hardmask is selected to have a high resistance to the CMP liftoff process in comparison to the refill material. The CMP resistant hardmask is preferably then removed by a RIE process.

Abstract: An uninterruptible power supply for home/office networking and communication system (UPS) comprising: (i) an AC-DC converter, (ii) a battery charger, (iii) a rechargeable battery array, (iv) a control circuit, and (v) a plurality of DC-DC voltage converters/voltage controllers, wherein, in operation, when an AC power supply is available, the UPS provides a plurality of DC voltage outputs to a plurality of loads Li, through the AC-DC converter, the control circuit, and the plurality of the DC-DC voltage converters/voltage controllers, and provides continuous DC charge to the rechargeable battery array, and when the AC power supply becomes unavailable, the control circuit detects the unavailability of the AC power supply, the UPS provides a plurality of DC voltage outputs to the plurality of loads Li, through an DC supply voltage of the rechargeable battery array, the control circuit, and the plurality of the DC-DC voltage converters/voltage controllers.

Abstract: In one method and embodiment of the present invention, at least one coil layer is formed in a write head, using a two-slurry step of copper damascene chemical mechanical polishing method with a first slurry step removing the undesirable copper that is on top of the tantalum barrier layer and on top of the trenches and a second slurry step removing the remainder of the undesirable copper, the tantalum barrier layer, the silicon dioxide hard mask layer, the hard baked photoresist layer, the magnetic alloy such as NiFe, CoFe, or CoNiFe, and alumina insulating layer for better thin film magnetic head performances.

Abstract: Methods for fabricating magnetic sensor heads using a CMP defined hard bias to fabricate a magnetic sensor head reader with a flat reader gap. The method comprises defining a read sensor of the magnetic sensor head. The method further comprises depositing an insulator layer on the read sensor. The method further comprises performing a chemical mechanical polishing (CMP) process down to a protective layer on the read sensor deposited while defining the read sensor to remove an overfill portion of the hard bias layer above the protective layer and to remove a sensor pattern masking layer above the protective layer.

Abstract: In a perpendicular recording head, a notch is formed in the top write gap at a location on top of the main pole. A perpendicular head with this notched top write gap structure has less transition curvature and better writability while reducing the adjacent track interference (ATI). Also, the process used to fabricate the head ensures that the trailing edge (writing edge) of the main pole is extremely flat with no corner rounding.

Abstract: A method for constructing a magnetic write head using an electrical lapping guide to carefully control critical dimensions dining a lapping operation used to define an air bearing surface. The lapping guide is photolithographically patterned in a common photolithographic step with another write head structure so that special relation between the lapping guide and critical dimensions of the write head structure can be carefully maintained. For example, the electrical lapping guide can be patterned in a common photolithographic step as the write pole so that the location of the flare point can he carefully controlled with respect to the location of the lapping guide. A stitched flare structure can also be built together with the electrical lapping guide, then a self-aligned shield can be further built over this stitched flare structure so that both flare point and shield throat can be controlled tightly together by this electrical lapping guide during lapping process.

Abstract: Methods of fabricating perpendicular write elements for perpendicular magnetic recording heads are discussed. In write element fabrication, write poles are fabricated according to one of many desired methods. The write poles during fabrication are typically covered by a hard mask and a photolithographic soft mask. According to the methods described herein, the soft mask is removed such as by chemical etching. The hard mask is then removed, such as by CMP and ion etching, to expose the write poles. Shield gap material may then be deposited on the write poles to define the shield gap between the write poles and the trailing shields. Trailing shield material may then be deposited on the shield gap material to form the trailing shields corresponding with the write poles.

Abstract: A wireless code symbol reading system including a wireless hand-supportable code symbol reader in two-way RF communication with a base station operably connected to a host system, by way of an RF-based wireless data communication link having a predetermined RF communication range over which two-way communication of data packets can occur. The wireless hand-supportable code symbol reader is programmed to automatically detect when it is located inside and outside of the predetermined RF communication range. When the wireless reader is inside the RF communication range, then symbol character data is automatically transmitted to the base station, and when the wireless reader is located outside of the RF communication range, then symbol character data is automatically collected and stored in a data packet buffer, until the wireless reader has re-entered its RF communication range.

Abstract: A solution of ammonium citrate and benzotriazole (BTA) is used to clean thin film magnetic head wafers. When used with brushing, the solution is a highly efficient process for removing particles, such as those generated during chemical-mechanical polishing (CMP), without causing corrosion and roughness. This process may be used on all CMP layers in thin film magnetic head wafer fabrication.

Abstract: Methods for improving within wafer and wafer to wafer yields during fabrication of notched trailing shield structures are disclosed. Ta/Rh CMP stop layers are deposited prior to planarization and notch formation to ensure a planar surface for trailing shield structures. These stop layers may be blanket deposited or patterened prior to CMP. Patterned stop layers produce the highest yields.

Abstract: A mounting apparatus for securing a storage device (50) with a mounting hole (522) defined therein includes a bracket (20) for receiving the storage device, an operating member (40), a fastening member (30) and a resilient member (60) compressed by the fastening member. A through opening (248) is defined in the bracket. The operating member movably engages with the bracket includes a pressing portion. The fastening member pivotably attaches to the bracket includes a locking portion. The locking portion extends through the through opening of the bracket and engages in the mounting hole of the storage device under the pressure of the pressing portion of the operating member. When the operating member is pulled off, the resilient member rebounds to rotate the locking portion, thereby disengaging the locking portion from the mounting hole of the storage device.

Abstract: In one method and embodiment of the present invention, at least one coil layer is formed in a write head, using a two-slurry step of copper damascene chemical mechanical polishing method with a first slurry step removing the undesirable copper that is on top of the tantalum barrier layer and on top of the trenches and a second slurry step removing the remainder of the undesirable copper, the tantalum barrier layer, the silicon dioxide hard mask layer, the hard baked photoresist layer, the magnetic alloy such as NiFe, CoFe, or CoNiFe, and alumina insulating layer for better thin film magnetic head performances.

Abstract: During planarization of wafers, the thickness of a layer of a wafer is measured at a number of locations, after the wafer has been planarized by chemical mechanical polishing. The thickness measurements are used to automatically determine, from a center to edge profile model to which the measurements are fit, a parameter that controls chemical mechanical polishing, called “backside pressure.” Backside pressure is determined in some embodiments by a logic test based on the center-to-edge profile model, coefficient of determination R-square of the model, and current value of backside pressure. Note that a “backside pressure” set point is adjusted only if the fit of the measurements to the model is good, e.g. as indicated by R-square being greater than a predetermined limit. Next, the backside pressure that has been determined from the model is used in planarizing a subsequent wafer.