Abstract: During planarization of wafers, the thickness of a layer of a wafer is measured at a number of locations, after the wafer has been planarized by chemical mechanical polishing. The thickness measurements are used to automatically determine, from a center to edge profile model to which the measurements are fit, a parameter that controls chemical mechanical polishing, called “backside pressure.” Backside pressure is determined in some embodiments by a logic test based on the center-to-edge profile model, coefficient of determination R-square of the model, and current value of backside pressure. Note that a “backside pressure” set point is adjusted only if the fit of the measurements to the model is good, e.g. as indicated by R-square being greater than a predetermined limit. Next, the backside pressure that has been determined from the model is used in planarizing a subsequent wafer.

Abstract: The present invention is directed to methods for polishing and cleaning a wafer having CoFeNi structures within alumina fill to achieve corrosion-free, smooth, and planar surface. A preferred chemical mechanical polishing (CMP) method includes a CMP polishing compound including alumina abrasive particulates, 1H-Benzotriazole (BTA), and hydrogen peroxide (H2O2) in a concentration working range of 4% to 12%. In a preferred embodiment the H2O2 concentration is approximately 6% and the pH is approximately 4.0 at polishing pressure 6 psi. A cleaning solution for CoFeNi structures in alumina fill of the present invention preferably includes 4-Methyl-1H-Benzotriazole, 5-Methyl-1H-Benzotriazole, hydrogenated 4-Methyl-1H-Benzotriazole, hydrogenated 5-Methyl-1H-Benzotriazole, sodium octanoate, and water.

Abstract: A method for constructing a magnetic write head for use in perpendicular magnetic recording, the write head having a write pole with a trailing shield. After forming a magnetic write pole such as by masking and ion milling a magnetic write pole layer, a thin layer of alumina is deposited. This is followed by the deposition of a thin layer of Rh. Then, a thick layer of alumina is deposited, having a thickness that is preferably at least equal to the height of the write pole layer. A chemical mechanical polish is then performed until a portion of the Rh layer over the top (trailing edge) of the write pole is exposed. A material removal process such as ion milling is then performed to remove the exposed Rh layer exposing the thin alumina layer there beneath. The exposed thin alumina layer over the trailing edge of the write pole can then either be removed or left intact to form a portion of a trailing shield gap layer. Another Rh layer can then be deposited to provide a non-magnetic trailing shield gap.

Abstract: A magnetic write head for perpendicular magnetic recording having a write pole with a concave trailing edge. The magnetic write pole can have a trapezoidal shape with first and second laterally opposed sides that are further apart at the trailing edge than at the leading edge. The write head may or may not include a magnetic trailing shield, and if a trailing shield is included it is separated from the trailing edge by a non-magnetic write gap layer. The concave trailing edge improves magnetic performance such as by improving the transition curvature. A method for constructing the write head includes forming a magnetic write pole by forming a mask structure over a deposited write pole material, the mask structure having an alumina hard mask and an image transfer layer such as DURAMIDE®. An alumina fill layer is then deposited and a chemical mechanical polish is performed to open up the image transfer layer.

Abstract: A Chemical Mechanical Polish (CMP) process and slurry therefore slurry that is capable of removing NiFe, SiO2, Photoresist, Ta, alumina and Cu at substantially the same rate. The slurry is useful for obtaining a substantially planar surface of several materials while avoiding corrosion of Cu coil and NiFe structure.

Abstract: A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A substrate such as an alumina fill layer, magnetic shaping layer, etc. is formed with region having a contact pad formed therein. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over the substrate and is covered with a thick layer of alumina. The alumina can be applied by a high deposition rate process that does not form voids or seams in the alumina layer. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer.

Abstract: Bioluminescent imaging has proven to be a valuable tool for monitoring physiological and pathological activities at cellular and molecular levels in living small animals. Using biological techniques, target cells can be tagged with reporters which generate characteristic photons in a wide spectrum covering the infra-red range. Part of the diffused light can reach the body surface of a subject/specimen (e.g., a small animal), be separated into several spectral bands using optical means, and collected by a sensitive camera. Systems and methods are disclosed herein for multi-spectral bioluminescence tomography (MBLT), in which an image of an underlying 3D bioluminescent source distribution is synergistically reconstructed from spectrally resolved datasets externally measured. This MBLT process involves two or multiple imaging modalities that produce structural information of the object and optical properties of the object as well to enable and improve the quality of MBLT.

Abstract: A method and apparatus for integrating a stair notch and a gap bump at a pole tip in a write head is disclosed. A protective plated layer is formed over the bump to prevent the bump form being damaged during formation of the notch at the pole tip. The flux from the second pole outside of the track will be effectively channeled to the first pole piece under the alumina bump.

Abstract: A method is described for thin film processing using a selected CMP slurry with a silicon dioxide stop layer. The slurry includes an abrasive, preferably alumina, a corrosion inhibitor, preferably benzotriazole (BTA), and an oxidizer preferably hydrogen peroxide. The method is particularly useful for fabricating thin film heads where alumina is used as the dielectric. The method can be used to planarize metal structures surrounded by alumina in magnetic heads. The alumina refill is deposited to the final target height which is slightly below the height of the metal. A thin silicon dioxide stop layer is deposited over the alumina. The CMP is executed using the selected slurry to planarize the wafer down to the stop layer. Preferably only a negligible amount of the stop layer remains and the height of the metal structure is essentially the same as the deposited height of the refilled alumina.

Abstract: A magnetic structure for use in a magnetic head for avoiding stray field writing. The magnetic structure can be for example a magnetic shield or could be a magnetic pole of a write head and is particularly advantageous for use in a perpendicular recording system, because such perpendicular recording systems are especially susceptible to stray field writing. The magnetic structure includes a forward protruding portion that extends toward the air bearing surface (ABS) of the head also includes first and second wing portions that extend laterally from the forward protruding portion. The wing portions each have includes an inner constant recess portion, and an outer tapered portion. The inner constant recess portion of each wing prevents stray field writing while also preventing magnetic saturation, the outer tapered portions, which taper away from the ABS as they extend laterally outward, further prevent stray field writing by removing the outer corners of the shield away from the ABS.

Abstract: During planarization of wafers, the thickness of a layer of a wafer is measured at a number of locations, after the wafer has been planarized by chemical mechanical polishing. The thickness measurements are used to automatically determine, from a center to edge profile model to which the measurements are fit, a parameter that controls chemical mechanical polishing, called “backside pressure.” Backside pressure is determined in some embodiments by a logic test based on the center-to-edge profile model, coefficient of determination R-square of the model, and current value of backside pressure. Note that a “backside pressure” set point is adjusted only if the fit of the measurements to the model is good, e.g. as indicated by R-square being greater than a predetermined limit. Next, the backside pressure that has been determined from the model is used in planarizing a subsequent wafer.

Abstract: A solution of ammonium citrate and benzotriazole (BTA) is used to clean thin film magnetic head wafers. When used with brushing, the solution is a highly efficient process for removing particles, such as those generated during chemical-mechanical polishing (CMP), without causing corrosion and roughness. This process may be used on all CMP layers in thin film magnetic head wafer fabrication.

Abstract: An embodiment of a method for battery power management comprises the following steps. A first power consumption magnitude indicating the amount of battery power consumed when the portable electronic device is in standby mode is calculated. A second power consumption magnitude indicating the amount of battery power consumed for a dynamic function to be activated is estimated. A power storage magnitude indicating the remaining power of the battery is acquired. The remaining battery life is calculated according to the first and second power consumption magnitudes and the power storage magnitude.

Abstract: A primary server and a backup server that both run a RADIUS client in a cold start configuration share a single IP address that includes a limited number of message identifiers (MIDs). The primary server and the backup server each have a small number of fixed message identifiers. In addition, a large number of shared message identifiers are used by the primary server, and then used by the backup server a predetermined time after the primary server fails.

Abstract: A method for chemical mechanical polishing (CMP) wafers having high aspect ratio surface topography. A wafer is positioned on a plate. A polishing pad is coupled to a platen. A polishing solution (e.g., slurry) is added between the polishing pad and the wafer. CMP is performed on the wafer by creating a relative movement between the polishing pad and the wafer. The polishing pad removes substantially all residual material from the channels. To accomplish this, the polishing pad has a compressibility of at least 5% at a polishing pressure of about 4 psi.

Abstract: A method for forming a high aspect ratio magnetic structure in a magnetic write head using a combination of chemical mechanical polishing and reactive ion etching.

Abstract: Methods, systems and apparatuses for reconstructing a light source distribution or estimating a light source feature within a subject include an optical data receiving mechanism that is positionable at least at one location within the subject and is configured to acquire signal data from a light source located within a subject. A computational device is configured to receive signal data acquired by the optical data receiving mechanism and to reconstruct the light source distribution or to estimate a light source feature from at least a portion of the received data.

Abstract: In a storage system including a plurality of data controllers that receive a data input/output request that is input via an external communication path and perform data input/output processing with respect to a storage resource in response to this request, the plurality of data controllers being connected by a data communication path and being able to communicate with one another, if a data input/output request has been input into one of the controllers, the plurality of data controllers and shares execution of the data input/output processing by communication through the data communication path.

Abstract: A perpendicular write head and a method of manufacturing the same is disclosed, the perpendicular write head for writing data onto tracks, the perpendicular write head having a main pole having notched trailing shield being self-aligned on the main pole for improved overwriting and adjacent track interference.

Abstract: A method using a CMP resistant hardmask in a process of fabricating a pole piece for a magnetic head is described. A set of layers used as the mask for milling the pole piece preferably includes a CMP resistant hardmask of silicon dioxide, a resist hardmask, an upper hardmask and a photoresist mask respectively. A multi-step reactive-ion etching (RIE) process is preferably used to sequentially remove the excess materials in the layer stack to ultimately define the multilayer mask for the pole piece. The excess pole piece material is then milled away. The wafer is then refilled with a nonmagnetic material such as alumina. A CMP liftoff is used to remove the resist hardmask. The material for the CMP resistant hardmask is selected to have a high resistance to the CMP liftoff process in comparison to the refill material. The CMP resistant hardmask is preferably then removed by a RIE process.