Abstract: A method includes forming a doped region on a top portion of a substrate, forming a first epitaxial layer over the substrate, forming a recess in the first epitaxial layer, the recess being aligned to the doped region, performing a surface clean treatment in the recess, the surface clean treatment includes: oxidizing surfaces of the recess to form an oxide layer in the recess, and removing the oxide layer from the surfaces of the recess, and forming a second epitaxial layer in the recess.

Abstract: In an embodiment, a system includes: a chamber; and a magnetic assembly contained within the chamber. The magnetic assembly comprises: an inner magnetic portion comprising first magnets; and an outer magnetic portion comprising second magnets. At least two adjacent magnets, of either the first magnets or the second magnets, have different vertical displacements, and the magnetic assembly is configured to rotate around an axis to generate an electromagnetic field that moves ions toward a target region within the chamber.

Abstract: A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the operations of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality of fixed magnets with respective ones of a second plurality of magnets, performing at least one of adjusting a position of at least one of the second plurality of the magnets, and adjusting a size of at least one of the second plurality of magnets, adjusting a magnetic flux of at least one of the second plurality of magnets, measuring the magnetic field distribution in the deposition chamber, and comparing the measured magnetic field distribution in the deposition chamber with the target magnetic field distribution.

Abstract: A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the steps of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality of fixed magnets with respective ones of a second plurality of magnets, performing at least one of adjusting a position of at least one of the second plurality of the magnets, and adjusting a size of at least one of the second plurality of magnets, adjusting a magnetic flux of at least one of the second plurality of magnets, measuring the magnetic field distribution in the deposition chamber, and comparing the measured magnetic field distribution in the deposition chamber with the target magnetic field distribution.

Abstract: A method includes forming a doped region on a top portion of a substrate, forming a first epitaxial layer over the substrate, forming a recess in the first epitaxial layer, the recess being aligned to the doped region, performing a surface clean treatment in the recess, the surface clean treatment includes: oxidizing surfaces of the recess to form an oxide layer in the recess, and removing the oxide layer from the surfaces of the recess, and forming a second epitaxial layer in the recess.

Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.

Abstract: A method includes forming a doped region on a top portion of a substrate, forming a first epitaxial layer over the substrate, forming a recess in the first epitaxial layer, the recess being aligned to the doped region, performing a surface clean treatment in the recess, the surface clean treatment includes: oxidizing surfaces of the recess to form an oxide layer in the recess, and removing the oxide layer from the surfaces of the recess, and forming a second epitaxial layer in the recess.

Abstract: Embodiments disclosed herein provide an apparatus to enable smooth and safe assembly of functional modules to computer chassis. The apparatus includes a chassis and a pair of racks mounted to the chassis. Each rack has a plurality of gear teeth formed thereon. A module having a housing is slidably coupled to the chassis and disposed between the pair of racks. A pair of gear pinions are rotatably mounted to the housing and meshed to the gear teeth of one of the racks. A damping member is coupled between each gear pinion and the housing. A sliding movement of the housing relative to the chassis rotates the pair of gear pinions to roll over along the gear teeth. During the sliding movement of the housing, the damping member exerts a resistance force against the housing, to reduce the movement speed of the housing.

Abstract: The present disclosure provides a method for disease control of plants, comprising predicting the probability of a disease occurrence and suggesting a suitable and effective control measure for the identified pathogen and/or host. The present disclosure also provides an advisory service with recommended management actions and other alerts and notifications.

Abstract: Provided is an artificial intelligence (AI) computing device applied to an industrial automation system. The AI computing device is connected to a field bus via a field bus interface and is communicated with a controller. The AI computing device processes data sent by the controller by using a built-in AI computing architecture, analyzes the data, and sends the analysis result to the controller. Also provided are a corresponding method and apparatus, an engineer station, and an industrial automation system.

Abstract: An industrial controller for automatically creating user interfaces, is configured to collect information generated when an industrial system submodule is operating, extract operation parameters of interest from the information generated when the industrial system submodule is operating, and create a user interface to reproduce the operation parameters of interest according to the extracted operation parameters of interest. The industrial controller can also re-create a user interface according to a parameter update input or a custom configuration input of a user. The industrial controller can automatically create a user interface without the need to manually parse the parameters, thereby realizing flexible interface settings. A user interface can be created in a web-based mode so that user access is not limited by locations and is flexible and convenient.

Abstract: A method is for executing an application in a cloud system. The method includes receiving a request from a first user for executing an application in the cloud system; receiving, from the first user, user data of the first user related to the execution of the requested application; storing the received user data in a first storage area of a computing environment of the cloud system; in the computing environment, executing the requested application based on the stored user data of the first user to obtain an execution result; and storing the execution result in a second storage area of the computing environment, the access permission of the first user to the first storage area being a write-only permission, and the access permission of the first user to the second storage area being a read-only permission. As such, data privacy protection and security can be provided in the cloud system.

Abstract: A method for hosting a poker game for a plurality of players includes: when an all-in bet among at least two players has occurred, and when a predetermined insurance condition is met, providing the leading player with an option to purchase an insurance with respect to the at least one out; when the at least one out is dealt as a turn card and the leading player has purchased the insurance covering the out, paying the leading player a payout; and when it is determined that the leading player has purchased the insurance, and the at least one out is not dealt at the turn stage, a user-designated insurance premium is collected from the leading player.

Abstract: A semiconductor device is formed by a multi-step etching process that produces trench openings in a silicon substrate immediately adjacent transistor gate structures formed over the substrate surface. The multi-step etching process is a Br-based etching operation with one step including nitrogen and a further step deficient of nitrogen. The etching process does not attack the transistor structure and forms the openings. The openings are bounded by upper surfaces that extend downwardly from the substrate surface and are substantially vertical, and lower surfaces that bulge outwardly from the upper vertical sections and undercut the transistor structure. The openings may be filled with a suitable source/drain material to produce SSD transistors with desirable Idsat characteristics.

Abstract: A method includes forming a metal gate structure over a first fin, where the metal gate structure is surrounded by a first dielectric material, and forming a capping layer over the first dielectric material, where an etch selectivity between the metal gate structure and the capping layer is over a pre-determined threshold. The method also includes forming a patterned hard mask layer over the first fin and the first dielectric material, where an opening of the patterned hard mask layer exposes a portion of the metal gate structure and a portion of the capping layer. The method further includes removing the portion of the metal gate structure exposed by the opening of the patterned hard mask layer.

Abstract: The present disclosure describes optical and optoelectronic assemblies that, in some cases, include screen-printed micro-spacers, as well as methods for manufacturing such assemblies and modules. For example, an optoelectronic device mounted on a substrate can include an optical sub-assembly including a first optical element and a first micro-spacer on the optical element. The optical sub-assembly can be disposed over the optoelectronic device, with a first air or vacuum gap separating the first optical element from the optoelectronic device, and the first micro-spacer laterally surrounding the first air or vacuum gap.

Abstract: Embodiments disclosed herein provide an apparatus to enable smooth and safe assembly of functional modules to computer chassis. The apparatus includes a chassis and a pair of racks mounted to the chassis. Each rack has a plurality of gear teeth formed thereon. A module having a housing is slidably coupled to the chassis and disposed between the pair of racks. A pair of gear pinions are rotatably mounted to the housing and meshed to the gear teeth of one of the racks. A damping member is coupled between each gear pinion and the housing. A sliding movement of the housing relative to the chassis rotates the pair of gear pinions to roll over along the gear teeth. During the sliding movement of the housing, the damping member exerts a resistance force against the housing, to reduce the movement speed of the housing.

Abstract: A high-frequency ultra-fine coaxial RF connection member as well as the high-frequency ultra-fine coaxial RF jumper and the receptor connector thereof deliver a high-frequency RF signal by direct electrical contact of an end of a cable central conductor of a coaxial cable with a circuit substrate. Furthermore, the receptor connector of the high-frequency ultra-fine coaxial RF connection member limits a cable end connector through a receptor metal cover, thereby reducing an entire height of the high-frequency ultra-fine coaxial RF connection member, to meet requirement of thinned high-frequency ultra-fine coaxial RF connection members.

Abstract: The present disclosure describes optical and optoelectronic assemblies that, in some cases, include screen-printed micro-spacers, as well as methods for manufacturing such assemblies and modules. For example, micro-spacers can be applied on a first optical element layer, and a second optical element layer can be provided on the first micro-spacers. By providing the second optical element layer on the first micro-spacers, the second optical element layer and the first optical element layer can be separated from one another by air or vacuum gaps each of which is laterally surrounded by a portion of the first micro-spacers.

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.