Patents by Inventor Ming-Kuei Lin
Ming-Kuei Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250101484Abstract: The present disclosure includes an improved method of making a protein. The steps and conditions were described and carried out with significantly improved protein yield, thereby reducing manufacturing cost.Type: ApplicationFiled: September 12, 2024Publication date: March 27, 2025Applicant: PharmaEssentia CorporationInventors: Ko-Chung Lin, Yu-Kuei Tsai, Ming-Pin Hsu
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Patent number: 12249568Abstract: A metallization structure electrically connected to a conductive bump is provided. The metallization structure includes an oblong-shaped or elliptical-shaped redistribution pad, a conductive via disposed on the oblong-shaped or elliptical-shaped redistribution pad, and an under bump metallurgy covering the conductive via, wherein the conductive bump is disposed on the UBM. Furthermore, a package structure including the above-mentioned metallization structures is provided.Type: GrantFiled: July 31, 2023Date of Patent: March 11, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng
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Publication number: 20250077180Abstract: A digital compute-in-memory (DCIM) macro includes a memory cell array and an arithmetic logic unit (ALU). The memory cell array stores weight data of a neural network. The ALU receives parallel bits of a same input channel in an activation input, and generates a convolution computation output of the parallel bits and target weight data in the memory cell array.Type: ApplicationFiled: August 30, 2024Publication date: March 6, 2025Applicant: MEDIATEK INC.Inventors: Ming-Hung Lin, Ming-En Shih, Shih-Wei Hsieh, Ping-Yuan Tsai, You-Yu Nian, Pei-Kuei Tsung, Jen-Wei Liang, Shu-Hsin Chang, En-Jui Chang, Chih-Wei Chen, Po-Hua Huang, Chung-Lun Huang
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Publication number: 20250077282Abstract: A digital compute-in-memory (DCIM) system includes a first DCIM macro. The first DCIM macro includes a first memory cell array and a first arithmetic logic unit (ALU). The first memory cell array has N rows that are configured to store weight data of a neural network in a single weight data download session, wherein N is a positive integer not smaller than two. The first ALU is configured to receive a first activation input, and perform convolution operations upon the first activation input and a single row of weight data selected from the N rows of the first memory cell array to generate first convolution outputs.Type: ApplicationFiled: August 30, 2024Publication date: March 6, 2025Applicant: MEDIATEK INC.Inventors: Ming-Hung Lin, Ming-En Shih, Shih-Wei Hsieh, Ping-Yuan Tsai, You-Yu Nian, Pei-Kuei Tsung, Jen-Wei Liang, Shu-Hsin Chang, En-Jui Chang, Chih-Wei Chen, Po-Hua Huang, Chung-Lun Huang
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Publication number: 20250067976Abstract: A head-mounted eye tracking system including a light-transmitting substrate, an eye tracker, and a signal processor is provided. The eye tracker is configured to sense eyeballs of a wearer. The eye tracker includes a plurality of light-emitting devices and a plurality of sensing devices. The plurality of light-emitting devices are configured to emit a tracking beam. The plurality of sensing devices are configured to receive the tracking beam reflected by the eyeballs of the wearer. The signal processor is electrically connected to the eye tracker. The plurality of sensing devices are embedded in grooves within the light-transmitting substrate.Type: ApplicationFiled: November 8, 2024Publication date: February 27, 2025Applicant: Industrial Technology Research InstituteInventors: Han-Kuei Fu, Meng-Han Lin, Hsu-Shih Huang, Ming-Hsien Wu, Chia-Hsin Chao, Wei-Hung Kuo
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Publication number: 20250069982Abstract: A semiconductor die package and a method of forming the same are provided. The semiconductor die package includes a package substrate, semiconductor dies over the package substrate, and an underfill element over the package substrate and surrounding the semiconductor dies. A portion of the underfill element is located between the semiconductor dies. The semiconductor die package also includes lid structures respectively attached to the top surfaces of the semiconductor dies. In plan view, each lid structure is located within the periphery of the top surface of the corresponding semiconductor die. Each lid structure is disconnected from other lid structures, and a gap is formed between adjacent lid structures and located over the portion of the underfill element.Type: ApplicationFiled: November 13, 2024Publication date: February 27, 2025Inventors: Shu-Shen YEH, Che-Chia YANG, Chia-Kuei HSU, Ming-Chih YEW, Po-Yao LIN, Shin-Puu JENG
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Publication number: 20130188342Abstract: A lamp body comprises a PCB with electronic control circuits; wherein the body comprising at least one light illuminating element on the PCB; a lamp shade, which comprises at least one lamp housing for the illuminating element; a switch, which is installed in the said lamp body; and one control structure, comprising a pressing plate, which is pivotally installed in the lamp body and is in conjunction with the switch, therein one end of the said pressing plate is connected with the lamp body via a flexible spring object, and the other end is connected with a strap; thereby the said strap being pulled outwardly and subsequently the pressing plate being rotated forward pivotally thereafter activating the said switch, which selecting the on-off and illuminating modes of the light illuminating element.Type: ApplicationFiled: January 24, 2012Publication date: July 25, 2013Inventor: Ming-Kuei LIN
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Publication number: 20110266589Abstract: A light emitting diode (LED) package and a manufacturing method therefor are disclosed. In one aspect, a manufacturing method of a light emitting diode package may: heat a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member; connect a lead frame to the sticky member; perform a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue; encapsulate the at least one light-emitting diode chip with a second light transmission insulation material; and perform a drying step that forms the sticky member and the second light transmission insulation material into shape.Type: ApplicationFiled: July 15, 2011Publication date: November 3, 2011Applicants: EVERLIGHT ELECTRONICS CO., LTD., EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) LTD.Inventors: Chih-Chia Tsai, Cheng-Yi Chang, Ming-Kuei Lin
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Patent number: 8008100Abstract: A light emitting diode (LED) package and a manufacturing method therefore are disclosed. The LED package comprises: a transparent substrate, a transparent LED chip, a transparent adhesive for bonding the transparent LED chip, a lead frame, conductive wires, and an encapsulant. In the manufacturing method, a heating step is first performed to heat a first transparent plastic material to be a sticky member. Thereafter a connecting step is performed to connect the lead frame to the sticky member. Then a chip-bonding step is performed to bond the LED chips on the sticky member. Thereafter a wire-bonding step is performed to electrically connect the transparent LED chip to the lead frame. Then an encapsulating step is performed to encapsulate the transparent LED chips with a second transparent plastic material. Thereafter a drying step is performed to form the shapes of the sticky member and the second transparent plastic material.Type: GrantFiled: March 4, 2009Date of Patent: August 30, 2011Assignee: Everylight Electronics Co., Ltd.Inventors: Chih-Chia Tsai, Cheng-Yi Chang, Ming-Kuei Lin
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Publication number: 20110175135Abstract: A submount comprising a chip mounting area, a first bonding pad and a connecting portion is provided. An LED chip is mounted on the chip mounting area. The first bonding pad is electrically connected to an electrode of the LED chip. The connecting portion has a first hollow portion and is disposed between the chip mounting area and the first bonding pad. The first hollow portion is located between the chip mounting area and the first bonding pad. The first hollow portion is located in a central region of the connecting portion.Type: ApplicationFiled: March 29, 2011Publication date: July 21, 2011Applicants: EVERLIGHT ELECTRONICS CO., LTD, EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) LTDInventors: Chin-Ching Chen, Cheng-Yi Chang, Ming-Kuei Lin
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Patent number: 7939846Abstract: An LED is bonded to a circuit board. The circuit board comprises a chip mounting area, a bonding pad, and a connecting portion. The LED is mounted on the chip mounting area with an adhesive, and the bonding pad is connected with an electrode of the LED. Moreover, the connecting portion is positioned between the chip mounting area and the bonding pad. One side of the connecting portion is connected with the chip mounting area and another side is connected with the bonding pad. With a hollow portion of the connecting portion, the adhesive will be prevented from flowing to the bonding pad.Type: GrantFiled: March 16, 2009Date of Patent: May 10, 2011Assignee: Everlight Electronics Co., Ltd.Inventors: Chin-Ching Chen, Cheng-Yi Chang, Ming-Kuei Lin
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Publication number: 20100123157Abstract: An LED is bonded to a circuit board. The circuit board comprises a chip mounting area, a bonding pad, and a connecting portion. The LED is mounted on the chip mounting area with an adhesive, and the bonding pad is connected with an electrode of the LED. Moreover, the connecting portion is positioned between the chip mounting area and the bonding pad. One side of the connecting portion is connected with the chip mounting area and another side is connected with the bonding pad. With a hollow portion of the connecting portion, the adhesive will be prevented from flowing to the bonding pad.Type: ApplicationFiled: March 16, 2009Publication date: May 20, 2010Inventors: Chin-Ching Chen, Cheng-Yi Chang, Ming-Kuei Lin
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Publication number: 20090224280Abstract: A light emitting diode (LED) package and a manufacturing method therefore are disclosed. The LED package comprises: a transparent substrate, a transparent LED chip, a transparent adhesive for bonding the transparent LED chip, a lead frame, conductive wires, and an encapsulant. In the manufacturing method, a heating step is first performed to heat a first transparent plastic material to be a sticky member. Thereafter a connecting step is performed to connect the lead frame to the sticky member. Then a chip-bounding step is performed to bond the LED chips on the sticky member. Thereafter a wire-bonding step is performed to electrically connect the transparent LED chip to the lead frame. Then an encapsulating step is performed to encapsulate the transparent LED chips with a second transparent plastic material. Thereafter a drying step is performed to form the shapes of the sticky member and the second transparent plastic material.Type: ApplicationFiled: March 4, 2009Publication date: September 10, 2009Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Chih-Chia Tsai, Cheng-Yi Chang, Ming-Kuei Lin
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Publication number: 20080074873Abstract: A wall lamp includes a conical refractor having a plurality of radial wave surfaces and is fixed in a space between a front cover and a rear cover so that outer edge of a bottom surface of the conical refractor is covered by the rear cover while a conical surface of the conical refractor is exposed through a window on the front cover. The conical surface is exposed toward the same direction with pins on a base. An LED is disposed on the center of the bottom surface of the conical refractor and light emitted from the LED radiates from the center of the bottom surface into inner side of the transparent conical refractor, then projects onto the wall. Thus radial lighting pattern is shown on the wall.Type: ApplicationFiled: September 25, 2006Publication date: March 27, 2008Inventor: Ming-Kuei Lin
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Publication number: 20080055906Abstract: A light-emitting device for bathroom containers is disclosed. Two contiguous and separated rooms are arranged in a main body of bathroom containers. A first room can be see-through from outside and has a plurality of irregular refraction surfaces while the second room is arranged with electronic components including a LED(light-emitting diode) circuit, a battery holder, a vibration switch and a plurality of LEDs whose light is projected into inner space of the first room. When the container is used and having vibration, the LED is turned on by the vibration switch so that light emits from the LED and projects into the inner space of the first room and colorful dynamic reflective light is displayed outwards. Therefore, the novelty as well as decorative effect of the bathroom,containers is increased.Type: ApplicationFiled: September 1, 2006Publication date: March 6, 2008Inventor: Ming-Kuei Lin
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Publication number: 20080014384Abstract: A spice bottle includes a spice container, a transparent liquid container and an container for electronic parts. The spice container is disposed on upper part of the spice bottle with holes facing upwards. The transparent liquid container is filled with transparent liquid with a plurality of differently colored lustrous foil fragments flowing therein for display. The container for electronic parts is disposed with a circuit board, a battery holder, a vibration switch and a plurality of LED (light-emitting diode) lamps. Light emitted from the LED lamps illuminates into the transparent liquid container. When the spice bottle is shaken for pouring spices out, the lustrous foil fragments inside the transparent liquid container is simultaneously driven to flow freely. At the same time, the LED lamps are turned on by the vibration switch for emitting light into the transparent liquid container so as to show dynamic lighting effect caused by reflection of the lustrous foil fragments.Type: ApplicationFiled: July 12, 2006Publication date: January 17, 2008Inventor: Ming-Kuei Lin
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Publication number: 20060133087Abstract: A twist light includes a base, a motor, a gear set, two torsion rods, a light source and a plurality of ring. The motor and the gear set are arranged inside the base. The motor drives the gear set so as to rotate the two torsion rods synchronously in the same direction. The two torsion rods with the same arc stand on two lateral sides of the base. The ring is a translucent ring with certain width and is inserted by the two torsion rods through the two insertion holes thereof. Thus a step-like shade is formed. The light source is disposed inside the step-like shade. A graphic shade encloses the light source. When the torsion rods swivel synchronously in the same direction, the step-like shade is driven and moved twistingly. Thus the graphic images projected on the step-like shade is getting smaller and getting larger correspondingly.Type: ApplicationFiled: December 20, 2004Publication date: June 22, 2006Inventor: Ming-Kuei Lin
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Publication number: 20060133064Abstract: A mini dynamic light includes a light set and a USB connector. The light set consists of a base, a transparent container and a cover. A four or five watt light bulb is installed on the base. The USB connector extends outward from the base while the transparent container is disposed on top of the base. A low-boiling-point clear liquid with a plurality of differently colored lustrous foil fragments therein is filled inside the transparent container. In usage, the USB connector is connected to a computer hub for getting power supply so as to make the light bulb illuminate and heat the transparent container. Thus the liquid therein generates convention currents to drive the lustrous foil fragments. The glittery and dynamic visual effect is achieved.Type: ApplicationFiled: December 20, 2004Publication date: June 22, 2006Inventor: Ming-Kuei Lin
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Publication number: 20060130377Abstract: A vibratile lamp with lustrous foil fragments includes a transparent container, a base and a cover. The transparent container with a clear liquid and a plurality of colored lustrous foil fragments therein is fixed on top of the base for displaying while a circuit board, a battery holder, a vibration switch and a plurality of LED light facing the bottom of the transparent container are arranged inside the base. By shaking the vibratile lamp with lustrous foil fragments, the colored lustrous foil fragments inside the transparent container flow upwards and downwards for a period of time. At the same time, the LED lights illuminate by the control of the vibration switch and light emits toward the transparent container so as to have colorful, bright and glittering dynamic display effect as well as electricity-saving and safety purposes.Type: ApplicationFiled: December 20, 2004Publication date: June 22, 2006Inventor: Ming-Kuei Lin
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Patent number: D680260Type: GrantFiled: October 19, 2011Date of Patent: April 16, 2013Inventor: Ming-Kuei Lin