Light Emitting Diode Package Structure and Manufacturing Method Therefor
A light emitting diode (LED) package and a manufacturing method therefor are disclosed. In one aspect, a manufacturing method of a light emitting diode package may: heat a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member; connect a lead frame to the sticky member; perform a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue; encapsulate the at least one light-emitting diode chip with a second light transmission insulation material; and perform a drying step that forms the sticky member and the second light transmission insulation material into shape.
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This application claims priority to U.S. patent application Ser. No. 12/398,174, filed on Mar. 4, 2009, which claims priority to Taiwan Patent Application Number 097107548, filed on Mar. 4, 2008. These patent applications are herein incorporated in their entirety by reference.
BACKGROUND1. Technical Field
The present disclosure relates to a light emitting diode (LED) package structure and a manufacturing method therefor, and more particularly, to a transparent LED package structure and a manufacturing method therefor.
2. Description of Related Art
With the advance of science and technologies, various types of advertising signboards are developed, and LED advertising signboards are one type of the most popular advertising signboards. In general, advertising signboards are mounted on elevated and noticeable areas or people-crowded areas, and thus the advertising signboards are often mounted on the glass curtain walls of high-rise buildings. However, since an LED advertising signboard is generally composed of a plurality of LED units through which very little light is allowed to pass, the LED advertising signboard will block the ambient light passing through a glass curtain wall of a building when being mounted on the glass curtain wall. As a result, ambient light cannot easily enter the building from the outside.
SUMMARYAn objective of the present disclosure is to provide a transparent LED package structure and a manufacturing method therefor, thereby overcoming the aforementioned problems.
In one aspect, a manufacturing method of a light emitting diode package may: heat a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member; connect a lead frame to the sticky member; perform a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue; encapsulate the at least one light-emitting diode chip with a second light transmission insulation material; and perform a drying step that forms the sticky member and the second light transmission insulation material into shape.
In one embodiment, the first light transmission insulation material may comprise transparent epoxy or silicone.
In another embodiment, the second light transmission insulation material may comprise transparent epoxy or silicone.
In yet another embodiment, the second light transmission insulation material and the first light transmission insulation material may be formed from the same transparent material.
In one embodiment, the manufacturing method may further perform a solder resisting step that coats a solder mask on a bottom side of the lead frame.
In another embodiment, the manufacturing method may further perform a wire-bonding step or a bump-bonding step that electrically connects the at least one light-emitting diode chip to the lead frame.
In another aspect, a manufacturing method of a light emitting diode package may: heat a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member; connect a lead frame to the sticky member; perform a solder resisting step that coats a solder mask on a bottom side of the lead frame; and perform a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue.
In one embodiment, the first light transmission insulation material may transparent epoxy or silicone.
In another embodiment, the manufacturing method may further encapsulate the at least one light-emitting diode chip with a second light transmission insulation material.
In another embodiment, the second light transmission insulation material may comprise transparent epoxy or silicone.
In still another embodiment, the second light transmission insulation material and the first light transmission insulation material may be formed from the same transparent material.
In one embodiment, the manufacturing method may further perform a wire-bonding step or a bump-bonding step that electrically connects the at least one light-emitting diode chip to the lead frame.
In still another embodiment, the manufacturing method may perform a drying step that forms the sticky member and the second light transmission insulation material into shape.
In yet another aspect, a light emitting diode package may comprise: a light transmission substrate having a central portion and a peripheral portion surrounding the central portion; at least one light-emitting diode chip disposed on the central portion of the light transmission substrate; a lead frame connecting the peripheral portion of the light transmission substrate, wherein the lead frame is electrically connected to the light-emitting diode chip; and an encapsulant disposed on the light transparent substrate, wherein the encapsulant covers the at least one light-emitting diode chip and the lead frame.
In one embodiment, the light transmission substrate may comprise transparent epoxy or silicone.
In one embodiment, the encapsulant may comprise transparent epoxy or silicone.
In another embodiment, the encapsulant and the light transmission substrate may be formed from the same material.
In one embodiment, the light emitting diode package may further comprise a light transmission glue that bonds the at least one light-emitting diode chip on the light transmission substrate.
In another embodiment, the light emitting diode package may further comprise a plurality of conducting wires or bumps electrically connecting the at least one light-emitting diode chip to the lead frame.
In yet another embodiment, the light emitting diode package may further comprise a solder mask coated on a first side of the lead frame opposite from a second side of the lead frame that is on a same side of the light transmission substrate as the at least one light-emitting diode chip.
The foregoing aspects and many of the attendant advantages of this present disclosure will become more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings.
In order to make the illustration of the present disclosure more explicit and complete, the following description is stated with reference to
In the structure of the transparent LED package according to the first embodiment of the present disclosure, the area occupied by the lead frame 108 is very small, so that the LED package can be a transparent structure. In addition, when the material of the second transparent plastic material 112 is the same as that of the first transparent plastic material, the drying step 162 can be simplified, and the manufacturing method can be speeded up thereby.
Second EmbodimentAs is understood by a person skilled in the art, the foregoing embodiments of the present disclosure are strengths of the present disclosure rather than limiting of the present disclosure. It is intended to encapsulate various modifications and similar arrangements included within the spirit and scope of the appended claims, the scope of which should be accorded the broadest interpretation so as to encompass all such modifications and similar structures.
Claims
1. A manufacturing method of a light emitting diode package, comprising:
- heating a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member;
- connecting a lead frame to the sticky member;
- performing a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue;
- encapsulating the at least one light-emitting diode chip with a second light transmission insulation material; and
- performing a drying step that forms the sticky member and the second light transmission insulation material into shape.
2. The manufacturing method as recited in claim 1, wherein the first light transmission insulation material comprises transparent epoxy or silicone.
3. The manufacturing method as recited in claim 1, wherein the second light transmission insulation material comprises transparent epoxy or silicone.
4. The manufacturing method as recited in claim 1, wherein the second light transmission insulation material and the first light transmission insulation material are formed from the same transparent material.
5. The manufacturing method as recited in claim 1, further comprising:
- performing a solder resisting step that coats a solder mask on a bottom side of the lead frame.
6. The manufacturing method as recited in claim 1, further comprising:
- performing a wire-bonding step or a bump-bonding step that electrically connects the at least one light-emitting diode chip to the lead frame.
7. A manufacturing method of a light emitting diode package, comprising:
- heating a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member;
- connecting a lead frame to the sticky member;
- performing a solder resisting step that coats a solder mask on a bottom side of the lead frame; and
- performing a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue.
8. The manufacturing method as recited in claim 7, wherein the first light transmission insulation material comprises transparent epoxy or silicone.
9. The manufacturing method as recited in claim 7, further comprising:
- encapsulating the at least one light-emitting diode chip with a second light transmission insulation material.
10. The manufacturing method as recited in claim 9, wherein the second light transmission insulation material comprises transparent epoxy or silicone.
11. The manufacturing method as recited in claim 9, wherein the second light transmission insulation material and the first light transmission insulation material are formed from the same transparent material.
12. The manufacturing method as recited in claim 9, further comprising:
- performing a drying step that forms the sticky member and the second light transmission insulation material into shape.
13. The manufacturing method as recited in claim 7, further comprising:
- performing a wire-bonding step or a bump-bonding step that electrically connects the at least one light-emitting diode chip to the lead frame.
14. A light emitting diode package, comprising:
- a light transmission substrate having a central portion and a peripheral portion surrounding the central portion;
- at least one light-emitting diode chip disposed on the central portion of the light transmission substrate;
- a lead frame connecting the peripheral portion of the light transmission substrate, wherein the lead frame is electrically connected to the light-emitting diode chip; and
- an encapsulant disposed on the light transparent substrate, wherein the encapsulant covers the at least one light-emitting diode chip and the lead frame.
15. The light emitting diode package as recited in claim 14, wherein the light transmission substrate comprises transparent epoxy or silicone.
16. The light emitting diode package as recited in claim 14, wherein the encapsulant comprises transparent epoxy or silicone.
17. The light emitting diode package as recited in claim 14, wherein the encapsulant and the light transmission substrate are formed from the same material.
18. The light emitting diode package as recited in claim 14, further comprising:
- a light transmission glue that bonds the at least one light-emitting diode chip on the light transmission substrate.
19. The light emitting diode package as recited in claim 14, further comprising:
- a plurality of conducting wires or bumps electrically connecting the at least one light-emitting diode chip to the lead frame.
20. The light emitting diode package as recited in claim 14, further comprising:
- a solder mask coated on a first side of the lead frame opposite from a second side of the lead frame that is on a same side of the light transmission substrate as the at least one light-emitting diode chip.
Type: Application
Filed: Jul 15, 2011
Publication Date: Nov 3, 2011
Applicants: EVERLIGHT ELECTRONICS CO., LTD. (New Taipei City), EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) LTD. (Shanghai)
Inventors: Chih-Chia Tsai (New Taipei City), Cheng-Yi Chang (New Taipei City), Ming-Kuei Lin (New Taipei City)
Application Number: 13/183,439
International Classification: H01L 33/48 (20100101); H01L 33/52 (20100101);