Patents by Inventor Ming Liu

Ming Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230380023
    Abstract: Systems, methods, and media for induction heating a first food vessel of a first size and a second food vessel of a second size include a base defining a well to separately receive the first food vessel and the second food vessel. A plurality of coil assemblies are mounted to a bottom side of a tray. The plurality of induction coils are electrically coupled with an inverter of the induction heating system. A sensing system is configured to indirectly measure a temperature of the first food vessel when the first food vessel is resting in the well and the second food vessel when the second food vessel is resting in the well. A controller is communicatively coupled with the sensing system and the inverter and is configured receive the temperature measurement from the sensing system, and control the inverter according to the measurement.
    Type: Application
    Filed: May 17, 2023
    Publication date: November 23, 2023
    Inventors: Nicholas Bassill, Fei Shang, Mark Gilpatric, Greg Sterr, James Jakubowski, Edward Nunn, Ming Liu
  • Publication number: 20230371384
    Abstract: A pressure sensor based on zinc oxide nanowires and a method of manufacturing a pressure sensor based on zinc oxide nanowires are provided. The manufacturing method includes: manufacturing a bottom electrode on a substrate; manufacturing a seed layer on the bottom electrode; manufacturing a zinc oxide nanowire layer on the seed layer; manufacturing a support layer on the zinc oxide nanowire layer; and manufacturing a top electrode on the support layer.
    Type: Application
    Filed: October 26, 2020
    Publication date: November 16, 2023
    Inventors: Ling Li, Xuewen Shi, Nianduan Lu, Congyan Lu, Di Geng, Xinlv Duan, Ming Liu
  • Publication number: 20230369139
    Abstract: A method of testing a semiconductor package includes: forming a charge measurement unit over a carrier substrate; forming a first dielectric layer over the charge measurement unit; forming a first metallization layer over the dielectric layer, wherein the forming of the first metallization layer induces first charges to accumulate on the charge measurement unit; performing a first test against the charge measurement unit to determine whether breakdown occurs in the charge measurement unit; and in response to determining that no breakdown occurs in the charge measurement unit, forming a second dielectric layer over the first metallization layer.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 16, 2023
    Inventors: CHI-HUI LAI, YANG-CHE CHEN, CHEN-HUA LIN, VICTOR CHIANG LIANG, CHWEN-MING LIU
  • Publication number: 20230369793
    Abstract: A power card edge connector includes: a housing defining a card slot; and a power terminal comprising an inner piece and an outer piece stacked together, the inner piece comprising a first retaining portion and a first elastic portion, the outer piece comprising a second retaining portion and a second elastic portion, the first and second retaining portions attached together, wherein the first elastic portion defines a first contacting portion, the second elastic portion is split into a second contacting portion and an abutting portion separated from each other, the first and second the contacting portions are arranged side by side and protrude into the card slot, and the first contacting portion is pushable outward to abut against the abutting portion.
    Type: Application
    Filed: April 26, 2023
    Publication date: November 16, 2023
    Inventors: MING-LIU XU, TENG QIN, WEN-JUN TANG, XUE-WU BU, HUNG-CHI YU
  • Publication number: 20230367735
    Abstract: A data transmission method includes: obtaining a target data packet to be stored, the target data packet including an address of the target data packet; determining, from predetermined N parallel-to-serial units based on the address of the target data packet, a target parallel-to-serial unit corresponding to the target data packet, the N parallel-to-serial units being connected to N storage control units in one-to-one correspondence; and transmitting, by the target parallel-to-serial unit, the target data packet to a target storage control unit, and storing, by the target storage control unit, the target data packet in a corresponding storage unit. The target storage control unit is a storage control unit, connected to the target parallel-to-serial unit, of the N storage control units. The target parallel-to-serial unit is configured to divide the target data packet into a plurality of data sub-packets.
    Type: Application
    Filed: July 24, 2023
    Publication date: November 16, 2023
    Inventors: Kai CAI, Peijia TIAN, Yusheng ZHANG, Fuquan WANG, Ming LIU
  • Publication number: 20230371151
    Abstract: An intelligent lighting device control system includes a plurality of lighting devices and an intelligent lighting device controller. The intelligent lighting device controller includes a detecting module, a main power source module and an intelligent control module. The detecting module has a detecting circuit. The main power source module includes a plurality of first electrode connectors and a common electrode connector. The first electrode connectors are connected to the detecting circuit and connected to the first electrodes of the lighting devices via the detecting circuit. The common second electrode connector is connected to the second electrodes of the lighting devices and outputs an electricity signal to drive the lighting devices, such that the detecting circuit generates a plurality of detecting signals. The intelligent control module generates a feedback signal according to the detecting signals and the main power source module adjusts the electricity signal according to the feedback signal.
    Type: Application
    Filed: August 18, 2022
    Publication date: November 16, 2023
    Applicant: Xiamen PVTECH Co., Ltd.
    Inventors: FUXING LU, RONGTU LIU, CHUN MING LIU
  • Publication number: 20230371156
    Abstract: A multi-function intelligent lighting device control system includes a plurality of lighting devices and an intelligent lighting device controller. The controller includes a detecting module, a main power source module, an intelligent control module and an intelligent dimming module. The detecting module includes a detecting circuit. The first electrode connectors of the main power source module are connected to the detecting circuit and connected to the first electrodes of the lighting devices via the detecting circuit. The common second electrode connector of the main power source module is connected to the second electrodes of the lighting devices and outputs an electricity signal to drive the lighting devices, such that the detecting circuit generates a plurality of detecting signals. The intelligent control module generates a feedback signal to perform the adaptive adjustment function accordingly. The intelligent dimming module receives a dimming signal to adjust the brightness of the lighting devices.
    Type: Application
    Filed: August 22, 2022
    Publication date: November 16, 2023
    Applicant: Xiamen PVTECH Co., Ltd.
    Inventors: FUXING LU, RONGTU LIU, CHUN MING LIU, HAO YE
  • Patent number: 11817750
    Abstract: A planar power module includes a second substrate arranged parallel to a first substrate, with the substrates respectively having a dielectric layer interposed between two conductive layers, such that one of the conductive layers of each substrate together forms parallel external conductive surfaces of the power module. The power module includes direct current (DC) bus bars, alternating current (AC) bus bars, and semiconductor switching dies arranged between the substrates. The dies are electrically connected to the bus bars, with each respective die electrically connected to a conductive layers of the first or second substrates. A polymer molding material partially surrounds the substrates and the switching dies. An electric powertrain system includes an electric machine, a propulsion battery pack, and a traction power inverter module (TPIM) having the power module. The power module is a three-phase full-bridge inverter circuit. An electric powertrain and motor vehicle use the power module.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: November 14, 2023
    Assignee: GM Global Technology Operations LLC
    Inventors: Ming Liu, Anthony M. Coppola, Muhammad H. Alvi
  • Patent number: 11816875
    Abstract: A method for estimating and presenting a passenger flow, a system, and a computer storage medium. The method comprises: performing two-level scene classification on received on-site video data transmitted by a camera; configuring a passenger flow analysis algorithm corresponding to a scene according to a scene classification result; and analyzing a video frame according to the passenger flow analysis algorithm, outputting a passenger flow calculation result, determining, according to the passenger flow calculation result, a crowdedness level of a passenger flow at a location corresponding to the camera, and respectively transmitting the crowdedness level of the passenger flow to a first terminal and a second terminal for display of the crowdedness level of the passenger flow.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: November 14, 2023
    Assignee: XI'AN ZHONGXING NEW SOFTWARE CO., LTD.
    Inventor: Ming Liu
  • Patent number: 11809667
    Abstract: A transparent conductive substrate structure used for a thermoforming process includes a transparent cover plate and a touch sensing layer structure. The transparent cover plate includes a toughening layer on one side thereof. The touch sensing layer structure arranged on one surface of the toughening layer, and includes a first transparent conductive layer, a dielectric layer, a barrier layer, a second transparent conductive layer, and a buffer protective layer. Each transparent conductive layer is directly applied to the transparent cover plate, so that the thickness between the transparent conductive layers is below 1 ?m. The thickness between layers may be reduced to increase the sensitivity of the touch sensing layer structure. To prevent each transparent conductive layer and an electrode wire layer from breaking during the thermoforming process, the transparent conductive substrate structure is combined with the buffer protective layer to strengthen the structure of each transparent conductive layer.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: November 7, 2023
    Assignee: NANOBIT TECH. CO., LTD.
    Inventors: Sheng-Chieh Tsai, Yao-Zong Chen, Yu-Yang Chang, Hsiou-Ming Liu
  • Publication number: 20230351796
    Abstract: A display substrate and a display apparatus are provided. The display substrate includes: a base substrate; a plurality of sub-pixels arranged on the base substrate, wherein the sub-pixels each include a sub-pixel driving circuit; a plurality of fingerprint recognition structures arranged on the base substrate, wherein the fingerprint recognition structures each include a control circuit and a fingerprint recognition electrode, the fingerprint recognition electrode is located on a side of the control circuit facing away from the base substrate, the control circuit is coupled to the fingerprint recognition electrode, and the control circuit is used for outputting a sensing signal from the fingerprint recognition electrode; wherein the control circuit and the sub-pixel driving circuit are arranged in a direction parallel to the base substrate.
    Type: Application
    Filed: November 15, 2021
    Publication date: November 2, 2023
    Inventors: Hao LIU, Mei LI, Jiuzhen WANG, Zunqing SONG, Qiuhua MENG, Caiyu QU, Ming LIU
  • Publication number: 20230352368
    Abstract: A power module is disclosed. The power module includes a first conductive plate, a first power component, and a second power component. The first conductive plate has a first side and a second side opposite to the first side; The first power component is disposed at the first side. The second power component is disposed at a first location of the second side distinct from a second location of the second side. The second location is configured to transfer most heat from the first power component to the second power component if the second power component is disposed at the second location.
    Type: Application
    Filed: April 27, 2022
    Publication date: November 2, 2023
    Applicants: Advanced Semiconductor Engineering, Inc., Universal Scientific Industrial (Shanghai) Co., Ltd.
    Inventors: Chih-Ming LIU, Yung-Fa CHEN, Hung Cheng CHANG
  • Patent number: 11805296
    Abstract: Per-viewer engagement-based video optimization is disclosed. A request for content associated with a first client is received. A model associated with the first client is obtained. The obtained model comprises at least one of behavior and playback preferences of a viewer associated with the first client. The obtained model is used to determine, for the first client, an optimal set of instructions usable to obtain content. A different set of instructions is determined to be optimal for a second client. The optimal set of instructions determined for the client is provided as output. The first client is configured to obtain content according to the optimal set of instructions determined for the first client.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: October 31, 2023
    Assignee: Conviva Inc.
    Inventors: Jibin Zhan, Weijia Li, Ming Liu, Saiguang Che, Aditya Ravikumar Ganjam
  • Patent number: 11804433
    Abstract: A semiconductor package structure and method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a connection layer formed on a metal base layer, at least one die unit formed on the connection layer, a metal pillar connecting the metal base layer and surrounding the die unit, and an interconnect structure overlaid onto the die unit and the metal pillar. Each die unit comprises at least one die attached onto the connection layer and surrounded by a molding structure. The interconnect structure includes a first interconnect layer overlaid onto the die unit and the metal pillar and a second interconnect layer formed on the first interconnect layer. The first and second interconnect layers comprise first and second metal layers being parallel with the top surface of the die unit. A projection of the metal layers overlaps an upper surface of the die.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: October 31, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yang-Che Chen, Chen-Hua Lin, Victor Chiang Liang, Huang-Wen Tseng, Chwen-Ming Liu
  • Patent number: 11805671
    Abstract: A method for manufacturing a display backplane, a display backplate, and a display device are disclosed. The method includes: forming a planarization layer on one side of a substrate inside a pixel region, a partition region, and a perforation region; forming at least one girdle of annular passivation layer disposed around the perforation region on a surface, away from the substrate, of the planarization layer inside a portion of the partition layer; removing a portion of the planarization layer, inside the partition region, uncovered by the annular passivation layer and the planarization layer, inside the partition region, partially covered by the annular passivation layer, to obtain at least one girdle of annular isolation columns disposed between the substrate and the annular passivation layer and around the perforation region; and forming organic light-emitting elements on one side of the planarization layer away from the substrate to obtain the display backplane.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: October 31, 2023
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Jing Wang, Hongwei Tian, Ming Liu, Ziang Han, Zunqing Song
  • Publication number: 20230342229
    Abstract: A method may include defining a rule identifying an event that triggers a change in a value of a metric. The defining of the rule includes generating a subscription to receive the event from an event stream. Occurrences of the event identified by the rule may be detected based on receiving the event from the event stream. In response to each occurrence of the event, the value of the metric and/or the change in the value of the metric may be evaluated. A notification may be sent to a software application consuming the metric based on the value of the metric and/or the change in the value of the metric satisfying a threshold. Related systems and computer program products are also provided.
    Type: Application
    Filed: June 27, 2023
    Publication date: October 26, 2023
    Inventors: Tao Zhang, Daniel Intoppa, Ming Liu
  • Publication number: 20230340655
    Abstract: The disclosure discloses a preparation method of a composite coating for a resin matrix composite, comprising the following steps: preparing ceramic-resin composite powders which comprise Al2O3 ceramic, a thermosetting resin and a curing agent and are semi-thermosetting resin powders; and respectively spraying pure Al2O3 ceramic powders and the composite powders on the surface of the resin matrix composite by supersonic atmospheric plasma spraying to form a ceramic-resin composite coating, wherein the pure Al2O3 ceramic powders are fed into jet flow in a manner of feeding powder inside a spray gun, and the composite powders are fed into jet flow in a manner of feeding powder outside the spray gun. Correspondingly, the disclosure also provides a preparation device of a composite coating for a resin matrix composite.
    Type: Application
    Filed: April 26, 2022
    Publication date: October 26, 2023
    Inventors: Haidou WANG, Ming LIU, Qiqing PENG, Guozheng MA, Yanfei HUANG, Xinyuan ZHOU, Zhiguo XING, Weiling GUO, Lihong DONG
  • Patent number: 11800655
    Abstract: Provided is a Light Emitting Diode (LED) display device.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: October 24, 2023
    Assignee: SHENZHEN LEYARD OPTO-ELECTRONIC CO., LTD.
    Inventors: Ming Liu, Xuechao Sun
  • Publication number: 20230334726
    Abstract: This application discloses a blockchain-based data processing method performed by a computer device. The method includes: in response to a selection operation of media elements associated with a target object, acquiring a target media element combination based on the selected media elements; in response to a virtual resource creation operation for the target media element combination, generating target combined media data corresponding to the target media element combination; and transmitting a virtual resource creation request for the target combined media data to a blockchain network, wherein the blockchain network creates a target on-chain virtual resource corresponding to the target combined media data after determining that the target combined media data passes duplicate check and verification, and an ownership right of the target on-chain virtual resource belonging to the target object.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Inventors: Rui GUO, Hu LAN, Zongyou WANG, Jun LIANG, Yang LU, Chaojie QI, Shitao XU, Yang MO, Yifang SHI, Gengliang ZHU, Lisen LI, Yubin SONG, Chao WANG, Ming LIU, Yongjing LI, Hui ZHANG, Zimin CHEN, Zuodong LIANG, Bo QIN, Tao FAN
  • Publication number: 20230335182
    Abstract: A complementary storage unit and a method of preparing the same, and a complementary memory. The complementary storage unit includes: a control transistor, a pull-up diode and a pull-down diode. The control transistor is configured to control reading and writing of the storage unit. One end of the pull-up diode is connected to a positive selection line, and the other end thereof is connected to a source end of the control transistor, so as to control a high-level input. One end of the pull-down diode is connected to a negative selection line, and the other end thereof is connected to the source end of the control transistor, so as to control a low-level input. The pull-up diode and the pull-down diode are symmetrically arranged in a first direction.
    Type: Application
    Filed: August 24, 2020
    Publication date: October 19, 2023
    Inventors: Qing Luo, Bing Chen, Hangbing Lv, Ming Liu, Cheng Lu