Patents by Inventor Ming Liu

Ming Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11790968
    Abstract: The disclosure provides a spintronic device, a SOT-MRAM storage cell, a storage array and a in-memory computing circuit. The spintronic device includes a ferroelectric/ferromagnetic heterostructure, a magnetic tunnel junction, and a heavy metal layer between the ferroelectric/ferromagnetic heterostructure and the magnetic tunnel junction; the ferroelectric/ferromagnetic heterostructure includes a multiferroic material layer and a ferromagnetic layer arranged in a stacked manner, and the magnetic tunnel junction includes a free layer, an insulating layer and a reference layer arranged in a stacked manner, and the heavy metal layer is disposed between the ferromagnetic layer and the free layer. According to one or more embodiments of the disclosure, the spintronic device, the SOT-MRAM storage cell, the storage array and the in-memory computing circuit can realize deterministic magnetization inversion under the condition of no applied field assistance.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: October 17, 2023
    Assignee: INSTITUTE OF MICROELECTRONICS OF THE CHINESE ACADEMY OF SCIENCES
    Inventors: Guozhong Xing, Huai Lin, Cheng Lu, Qi Liu, Hangbing Lv, Ling Li, Ming Liu
  • Publication number: 20230325337
    Abstract: Provided are a data transmission device and a data transmission method, which are applied to a field of an information technology. The data transmission device includes: a signal conversion module (30) and a signal transmission module (20), wherein the signal conversion module (30) is configured to convert, at a data transmitting end, an electrical signal containing a data information into a magnon signal containing the data information; the signal transmission module (20) is configured to transmit the magnon signal containing the data information to a data receiving end; and the signal conversion module (30) is further configured to convert, at the data receiving end, the magnon signal containing the data information into the electrical signal containing the data information. The data transmission method includes transmitting the data by using the magnon signal, and no voltage or current is required in a process of transmitting the data.
    Type: Application
    Filed: August 28, 2020
    Publication date: October 12, 2023
    Applicant: Institute of Microelectronics, Chinese Academy of Sciences
    Inventors: Chong Bi, Ming Liu
  • Patent number: 11782861
    Abstract: Provided is an extension module for independently storing calibration data, including: a first interface, adapted to receive a first external input signal; a second interface, adapted to output the first output signal of the extension module; a signal processing circuit, connected between the first interface and the second interface; and a first memory, the first memory storing first calibration data, and the first calibration data being associated with the extension module. Furthermore, also provided is a component using the above extension module, and a component calibration method. On the one hand, the extension module of an embodiment may share an ADC sampling circuit on a main module, so that the manufacturing cost of the extension module is reduced. On the other hand, an embodiment can facilitate the replacement of different extension modules for the main module without repeated calibration.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: October 10, 2023
    Assignee: Siemens Aktiengesellschaft
    Inventors: Xiao Bo Wang, Su Ying Song, Ming Liu, Jun Zou
  • Publication number: 20230320040
    Abstract: A cooling apparatus is provided. An external cooling fluid flows into an external inlet opening from an external inlet pipe and passes through a heat exchanger to flow out of an external outlet opening to an external outlet pipe. An internal cooling fluid flows into an internal inlet pipe from the server and flows into an internal inlet opening from the internal inlet pipe and passes through the heat exchanger for heat exchange with the external cooling fluid to flow out of an internal outlet opening to an internal outlet pipe. A hot-swap pump has a pump main body, an inlet anti-leakage pipe, an outlet anti-leakage pipe and a hot-swap connector. The inlet anti-leakage pipe includes an inlet connector and an inlet anti-leakage valve. The outlet anti-leakage pipe includes an outlet connector and an outlet anti-leakage valve. The hot-swap connector is electrically connected to the pump main body.
    Type: Application
    Filed: April 5, 2022
    Publication date: October 5, 2023
    Applicant: Super Micro Computer, Inc.
    Inventors: Chia-Wei CHEN, Te-Chang LIN, Yueh-Ming LIU, Yu-Hsiang HUANG, Ya-Lin LIU, Chi-Che CHANG
  • Publication number: 20230320041
    Abstract: A server device includes a chassis, plural fan modules and a controller. The fan modules are adapted to be installed in the chassis in a hot-swappable manner. The controller is configured to reduce a fan speed of each fan module in the chassis from a target speed to a temporary speed in response to a fan module insertion event, and then to increase the fan speed of each fan module to the target speed after a predetermined time elapses.
    Type: Application
    Filed: February 2, 2023
    Publication date: October 5, 2023
    Inventor: Chi Ming LIU
  • Publication number: 20230312582
    Abstract: Provided are salts of a compound of formula (I) having an ATX inhibitory activity. The salts comprises inorganic acid salts or organic acid salts, and solid forms of the salts, such as crystal forms. The salts of the compound of formula (I) and their crystal forms according to the present disclosure have a good solubility, stability and hygroscopicity, and are more suitable for medicinal use. Moreover, their preparation methods are simple and convenient, and are suitable for large-scale production.
    Type: Application
    Filed: July 28, 2021
    Publication date: October 5, 2023
    Applicant: Wuhan Humanwell Innovative Drug Research And Development Center Limited Company
    Inventors: Xuejun Zhang, Yang Yue, Sijun Lei, Qingfeng Xia, Yuan Li, Qiongfeng Yang, Min'an Liu, Shaoxia Yang, Ming Liu, Bin Hu, Shoubo Zhang, Xiaohua Ding, Zhe Liu
  • Patent number: 11776607
    Abstract: The present disclosure provides a fusion memory including a plurality of memory cells, wherein each memory cell of the plurality of memory cells includes: a bulk substrate; a source and a drain on the bulk substrate; a channel extending between the source and the drain; a ferroelectric layer on the channel; and a gate on the ferroelectric layer.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: October 3, 2023
    Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Hangbing Lv, Qing Luo, Xiaoxin Xu, Tiancheng Gong, Ming Liu
  • Patent number: 11776919
    Abstract: A semiconductor package includes a multilayer substrate, a device die, an insulating encapsulant, and a shielding structure. The multilayer substrate has a first surface and a second surface opposite to the first surface. The multilayer substrate includes through holes, and each of the through holes extends from the first surface to the second surface. The device die is disposed on the first surface of the multilayer substrate. The insulating encapsulant is disposed on the first surface of the multilayered substrate and encapsulating the device die. The shielding structure is disposed over the first surface of the multilayer substrate. The shielding structure includes a cover body and conductive pillars. The cover body covers the device die and the insulating encapsulant. The conductive pillars are connected to the cover body and fitted into the through holes of the multilayer substrate.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: October 3, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yang-Che Chen, Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng
  • Patent number: 11773890
    Abstract: A quick connector with a compressive and rotational locking and unlocking mechanism includes a socket, a plug, a rotatable collar and an undulant resilient piece. The socket includes a first connector body and a plug-connection trackway extending obliquely and having an engaging notch at a terminal end thereof. The plug includes a second connector body and a first limiting wall protruding from the plug. The rotatable collar can be assembled on the plug and includes an engaging protrusion and a second limiting wall. When the rotatable collar is rotated, the engaging protrusion enters into the plug-connection trackway and moves to the terminal end of the plug-connection trackway, and the undulant resilient piece abuts against and forces the first and second limiting walls away from each other, such that the engaging protrusion is lodged in the engaging notch to form a locked state.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: October 3, 2023
    Inventor: Da-Ming Liu
  • Publication number: 20230306945
    Abstract: An electronic system includes an air vent, a heat sink, a fan, and an acoustic filter. The acoustic filter is disposed between the air vent and the heat sink and includes a sound-receiving opening, a sound-emitting opening, an expansion chamber, a neck channel, and a resonant chamber. The neck channel includes a first opening and a second opening whose surface is perpendicular to the surface of the sound-receiving opening. The first opening is in communication with the expansion chamber. The resonant chamber is connected to the second opening. Fan noise that enters the resonant chamber via the neck tube is dampened by reflective acoustic waves generated by the resonant chamber.
    Type: Application
    Filed: August 30, 2022
    Publication date: September 28, 2023
    Inventors: Jia-Ren CHANG, Ruey-Ching SHYU, Feng-Ming LIU
  • Publication number: 20230307466
    Abstract: The present disclosure provides a display substrate, a manufacturing method thereof, and a display device. The display substrate comprises a base substrate, and a first thin film transistor and a second thin film transistor formed on the base substrate, wherein a first active layer of the first thin film transistor is made of low-temperature polysilicon, and a second active layer of the second thin film transistor is made of a metal oxide. The display substrate further comprises a first barrier layer on a side of the second active layer close to the base substrate and a second barrier layer on a side of the second active layer away from the base substrate. The orthographic projection of the second active layer onto the base substrate falls within the orthographic projections of the first barrier layer and the second barrier layer onto the base substrate.
    Type: Application
    Filed: December 21, 2020
    Publication date: September 28, 2023
    Inventors: Qiuhua MENG, Ming LIU, Yang YU
  • Patent number: 11769698
    Abstract: A method of testing a semiconductor package is provided. The method includes forming a first metallization layer, wherein the first metallization layer includes a first conductive pad electrically connected to a charge measurement unit and a charge receiving unit; performing a first test against the charge measurement unit through the first conductive pad to determine whether breakdown occurs in the charge measurement unit; and in response to determining that no breakdown occurs in the charge measurement unit, forming a second dielectric layer over the first metallization layer, wherein a portion of the first conductive pad is exposed from the second dielectric layer.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: September 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chi-Hui Lai, Yang-Che Chen, Chen-Hua Lin, Victor Chiang Liang, Chwen-Ming Liu
  • Patent number: 11767759
    Abstract: A pistonless rotary motor for air compressor includes a triangular rotor rotatably disposed in a rotor cavity of a housing. The housing further includes two opposite, radially spaced first grooves in the peripheral wall and two opposite, radially spaced second grooves in the peripheral wall. The first groove is proximate the intake and the second groove is proximate the exhaust. The first grooves are disposed at a top dead center of the rotor relative to the rotor cavity and configured to release air having a first pressure when the rotor revolves eccentrically. The second grooves are disposed the top dead center of the rotor relative to the rotor cavity when the rotor revolves eccentrically and configured to release air having a second pressure which is less than the first pressure.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: September 26, 2023
    Inventors: Hung-Chih Huang, Huang-Ming Liu
  • Publication number: 20230291321
    Abstract: A power module includes: a first substrate layer that is disposed on a first plane; a second substrate layer that is disposed on a second plane that is parallel to the first plane; first and second electrical conductors that are configured to be electrically connected to first and second direct current (DC) reference potentials, respectively, and that extend outwardly from the power module on a third plane that is parallel to the first and second planes; third, fourth, and fifth electrical conductors that are configured to be electrically connected to first, second, and third alternating current (AC) reference potentials, respectively, and that extend outwardly from the power module on a fourth plane that is parallel to the first, second, and third planes; and a plurality of dies of switches, respectively, disposed between the first and second substrate layers.
    Type: Application
    Filed: March 29, 2022
    Publication date: September 14, 2023
    Inventors: Ming LIU, Muhammad Hussain ALVI, Chandra S. NAMUDURI
  • Publication number: 20230288290
    Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.
    Type: Application
    Filed: March 11, 2022
    Publication date: September 14, 2023
    Inventors: Hsien-Yu CHEN, Yu-Sheng CHIU, Chih-Chun CHENG, Wen-Nan CHENG, Chi-Ming LIU
  • Patent number: 11756221
    Abstract: Image processing performed on images captured with image capture devices may be used to improve upon some of the problems with images captured from devices, including images captured from devices with larger aperture lenses, and, in some particular examples, mobile devices with larger aperture lenses. Multiple images may be captured by the capture device and processing applied to generate a single image through fusing of the multiple images. One potential benefit obtained with fusion of multiple images is a single image with an effective depth of focus (DOF) larger than that available in a single image obtained from the capture device. The DOF of the fused image may be larger than a single image and/or may include multiple distinct in-focus focal distances, whereas a single image from a single capture device has only a single in-focus focal distance.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: September 12, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Wen-Chun Feng, Hsuan-Ming Liu, Yu-Ren Lai
  • Patent number: 11752665
    Abstract: A slurry sprayer for supplying a slurry to a wire saw during ingot slicing is disclosed. The slurry sprayer includes a main body and a cover plate that is detachable from the main body for cleaning the slurry sprayer. In some embodiments, the slurry sprayer includes an adjustable support that allows the incline angle of the sprayer to be adjusted and allows the vertical and horizontal position of the slurry sprayer to be adjusted. In some embodiments, the slurry sprayer includes two feed openings to allow the slurry pressure to be more equalized across the slurry sprayer.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: September 12, 2023
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Chia Ming Liu, Chien Ming Chen, Jui Hung Wang, Hao Chen
  • Patent number: 11758756
    Abstract: Provided is a packaging structure, including an inorganic packaging layer and an organic packaging layer that are laminated on a substrate, wherein the organic packaging layer includes a microstructure layer and a planarization layer, a refractive index of the planarization layer being lower than that of the microstructure layer; wherein the microstructure layer includes a base structure on the inorganic packaging layer and a plurality of protrusion structures spaced apart on a surface of the base structure away from the inorganic packaging layer; and the planarization layer fills at least gaps between adjacent protrusion structures, and a side of the planarization layer away from the inorganic packaging layer is of a planar structure.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: September 12, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Ming Liu
  • Patent number: D1000411
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: October 3, 2023
    Inventor: Ming Liu
  • Patent number: D1000412
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: October 3, 2023
    Inventor: Ming Liu