Abstract: An electrical connector for interconnecting a CPU or a chipset to a printed circuit board comprises a housing, a number of terminals received in the housing and a number of solder blocks. Each terminal has a base and a tail pad perpendicularly extending from the base. Each solder block is rectangular and mounted on the tail pad of the corresponding terminal by a plane contact to increase a contact area existing therebetween for promoting manufacturing efficiency and enhancing the securement of the solder block to the terminal.

Abstract: A ZIF PGA socket includes a cover slidably engaged with a base to which a cam is pivotably connected. The cam is selectively rotated in clockwise or counterclockwise directions thereby driving the cover to move laterally in opposite directions with respect to the base. The rotation of the cam is retained in a constant plane which is substantially parallel to the movement plane of the cover. The cam and the cover is so configured that free-wheeling will not occur when the cam changes from one orientation to an opposite orientation.

Abstract: An electrical socket comprises a rectangular base defining a plurality of passageways therein each of which has an upper cavity and a lower cavity communicated with each other. The upper cavity has an opening exposing to exterior larger than another opening of the lower cavity exposing to exterior. A vertical inner wall is formed in each passageway and extending through the upper cavity and the lower cavity. A plurality of contacts are received in the passageways and each contact includes an upper open-looped portion connected to an engagement portion connected to a tail portion. A portion of the upper open-looped portion is coplanar with the engagement portion and the tail portion so that the coplanar portion of the open-looped portion, the engagement portion and the tail portion may be guided by the vertical inner wall when the contact is configured downward into the passageway.

Abstract: An electrical connector includes a dielectric base plate in which steel and copper strips are embedded. The steel and copper strips are respectively arranged in opposite sides of the base plate substantially perpendicular to and interconnected to each other whereby when the base is subject to a heating process, the steel and copper strips limit and control thermal expansion in different directions of the base plate and reduce differences in thermal expansion between the base plate and a circuit board to which the connector is mounted. Furthermore, a method for achieving substantially uniform thermal expansion of a dielectric plate is also provided and comprises the steps of (1) providing a dielectric plate made by injection molding and (2) fixing steel and copper strips thereto for limiting and controlling thermal expansion of the plate in different directions to achieve substantially uniform thermal expansion of the plate.

Abstract: A ZIF PGA socket includes a mother housing and two daughter housings slidably received in the mother housing. The daughter housings are simultaneously moved in the mother housing by a cam which is rotatably received between the mother housing and the daughter housings. The thickness of the socket is substantially equal to the thickness of each of the cam lever, the mother housing, and the daughter housings.

Abstract: A ball grid array connector comprises an insulative housing having a mating face and a soldering face opposite to the mating face and a plurality of passageways defined between the mating face and the soldering face. A plurality of contacts are received in the passageways and each contact comprises a contacting portion and a soldering portion substantially perpendicular to the soldering portion. A solder ball is attached to the soldering portion of each contact and the solder ball has a diameter less than a width of the soldering portion of the contact.