Patents by Inventor Ming Mao

Ming Mao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250391427
    Abstract: The present disclosure generally relates to a two dimensional magnetic recording (TDMR) read head. The read head comprises a lower shield, a lower sensor disposed on the lower shield, a middle shield disposed over the lower sensor, an upper sensor disposed on the middle shield, and an upper shield disposed over the upper sensor. In one embodiment, the middle shield is a simple pinned shield comprising a first ferromagnetic (FM) layer, an antiferromagnetic (AFM) layer disposed on the first FM layer, and a second FM layer disposed on the AFM layer, and the upper shield is a synthetic antiferromagnetic (SAF) pinned shield comprising a first pinning layer, an antiferromagnetic coupling (AFC) layer disposed on the first pinning layer, and a second pinning layer disposed on the AFC layer. In another embodiment, the middle shield is a SAF pinned shield and the upper shield is a simple pinned shield.
    Type: Application
    Filed: June 25, 2024
    Publication date: December 25, 2025
    Applicant: Western Digital Technologies, Inc.
    Inventors: Yung-Hung WANG, Ming MAO, James Mac FREITAG, Chih-Ching HU, Chen-Jung CHIEN, Yuankai ZHENG, Alexander M. ZELTSER, Fang CHEN
  • Publication number: 20250391430
    Abstract: The present disclosure generally relates to a dual free layer (DFL) read head with a shaped rear bias (RB) and methods of forming thereof. A shaped rear hard bias (RHB) or a shaped rear soft bias (RSB) can induce large transverse magnetic anisotropy and align bias element magnetization, which in turn contributes to overcoming polarity flip or negative amplitude observed in DFL read heads. However, often, the removal time of exposed portions of RB are greater than the removal time of exposed portions of the DFL sensor. Thus, depositing a stitch layer over a DFL sensor to adjust the etching rate of the DFL sensor to match the etching rate of the RB during the removal processes provides sufficient time to remove exposed portions of the RB without damaging the DFL sensor, thereby improving shaped RHB or RSB control and reliability in DFL sensors.
    Type: Application
    Filed: June 20, 2024
    Publication date: December 25, 2025
    Applicant: Western Digital Technologies, Inc.
    Inventors: Ming MAO, Chen-Jung CHIEN, James Mac FREITAG, Chih-Ching HU, Yung-Hung WANG
  • Publication number: 20250266056
    Abstract: The present disclosure generally relates to a dual free layer two dimensional magnetic recording read head. The read head comprises a first lower shield, a first sensor disposed over the first lower shield, a first upper shield disposed over the first sensor, a read separation gap (RSG) disposed on the first upper shield, a second lower shield disposed over the RSG, a second sensor disposed over the second lower shield, and a second upper shield disposed over the second sensor. In some embodiments, the second lower shield comprises a CoFeHf layer. In another embodiment, the second lower shield is a synthetic antiferromagnetic multilayer comprising a first shield layer, a second shield layer, and a CoFe/Ru/CoFe anti-ferromagnetic coupling layer or a Ru layer disposed therebetween, the first and second shield layers comprising NiFe and CoFe. In yet another embodiment, the second lower shield comprises layers of Ru, IrMn, and NiFe.
    Type: Application
    Filed: May 7, 2025
    Publication date: August 21, 2025
    Applicant: Western Digital Technologies, Inc.
    Inventors: Ming MAO, Chen-Jung CHIEN, Goncalo Marcos BAIÃO DE ALBUQUERQUE, Chih-Ching HU, Yung-Hung WANG, Ming JIANG
  • Publication number: 20250246204
    Abstract: The present disclosure generally relates to a two-dimensional magnetic recording (TDMR) read head. The TDMR read head comprises a first sensor, a second sensor, and a middle shield (MS) disposed between the first and second sensors. The MS comprises a seed layer, an IrMn layer disposed on the seed layer, an insertion layer comprising Ru or CoFe disposed on the IrMn layer, a first NiFe layer having a pinned magnetization, and a cap layer disposed over the first NiFe layer. In one embodiment, the MS further comprises an Ru layer disposed on the first NiFe layer and a second NiFe layer disposed on the Ru layer, the second NiFe layer having a pinned magnetization in a direction antiparallel to the first NiFe layer. The insertion layer comprising Ru decreases an exchange energy of the MS. The insertion layer comprising CoFe increases an exchange energy of the MS.
    Type: Application
    Filed: January 29, 2024
    Publication date: July 31, 2025
    Applicant: Western Digital Technologies, Inc.
    Inventors: Yuankai ZHENG, Zhitao DIAO, Chih-Ching HU, Yung-Hung WANG, Chen-Jung CHIEN, Ming MAO, James Mac FREITAG
  • Patent number: 12374356
    Abstract: The present disclosure generally relates to a two-dimensional magnetic recording (TDMR) read head. The TDMR read head comprises a first sensor, a second sensor, and a middle shield (MS) disposed between the first and second sensors. The MS comprises a seed layer, an IrMn layer disposed on the seed layer, an insertion layer comprising Ru or CoFe disposed on the IrMn layer, a first NiFe layer having a pinned magnetization, and a cap layer disposed over the first NiFe layer. In one embodiment, the MS further comprises an Ru layer disposed on the first NiFe layer and a second NiFe layer disposed on the Ru layer, the second NiFe layer having a pinned magnetization in a direction antiparallel to the first NiFe layer. The insertion layer comprising Ru decreases an exchange energy of the MS. The insertion layer comprising CoFe increases an exchange energy of the MS.
    Type: Grant
    Filed: January 29, 2024
    Date of Patent: July 29, 2025
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yuankai Zheng, Zhitao Diao, Chih-Ching Hu, Yung-Hung Wang, Chen-Jung Chien, Ming Mao, James Mac Freitag
  • Patent number: 12322420
    Abstract: The present disclosure generally relates to a dual free layer two dimensional magnetic recording read head. The read head comprises a first lower shield, a first sensor disposed over the first lower shield, a first upper shield disposed over the first sensor, a read separation gap (RSG) disposed on the first upper shield, a second lower shield disposed over the RSG, a second sensor disposed over the second lower shield, and a second upper shield disposed over the second sensor. In some embodiments, the second lower shield comprises a CoFeHf layer. In another embodiment, the second lower shield is a synthetic antiferromagnetic multilayer comprising a first shield layer, a second shield layer, and a CoFe/Ru/CoFe anti-ferromagnetic coupling layer or a Ru layer disposed therebetween, the first and second shield layers comprising NiFe and CoFe. In yet another embodiment, the second lower shield comprises layers of Ru, IrMn, and NiFe.
    Type: Grant
    Filed: July 26, 2023
    Date of Patent: June 3, 2025
    Assignee: Western Digital Technologies, Inc.
    Inventors: Ming Mao, Chen-Jung Chien, Goncalo Marcos Baião De Albuquerque, Chih-Ching Hu, Yung-Hung Wang, Ming Jiang
  • Patent number: 12243565
    Abstract: A two-dimensional magnetic recording (TDMR) read head includes a lower reader and an upper reader. Each of the lower reader and the upper reader may have a dual free layer (DFL) magnetic tunnel junction structure having first and second free layers located between lower and upper shields. A synthetic antiferromagnetic (SAF) structure is located on a side of each magnetic tunnel junction. A sidewall insulating layer is located between the lower soft bias layer of the SAF structure and the first free layer. The sidewall insulating layer can have a reduced height such that an upper soft bias layer of the SAF structure is in direct contact with a sidewall of the second free layer, or the upper portion of the sidewall insulating layer located between the upper soft bias layer of the SAF structure and the sidewall of the second free layer has a reduced thickness.
    Type: Grant
    Filed: August 14, 2023
    Date of Patent: March 4, 2025
    Assignee: Western Digital Technologies, Inc.
    Inventors: Chih-Ching Hu, Yung-Hung Wang, Ming Mao, Ming Jiang, Yukimasa Okada, Goncalo Baiao de Albuquerque
  • Publication number: 20250014594
    Abstract: The present disclosure generally relates to a dual free layer (DFL) read head and methods of forming thereof. In one embodiment, a method of forming a DFL read head comprises depositing a DFL sensor, defining a stripe height of the DFL sensor, depositing a rear bias (RB) adjacent to the DFL sensor, defining a track width of the DFL sensor and the RB, and depositing synthetic antiferromagnetic (SAF) soft bias (SB) side shields adjacent to the DFL sensor. In another embodiment, a method of forming a DFL read head comprises depositing a DFL sensor, defining a track width of the DFL sensor, depositing SAF SB side shields adjacent to the DFL sensor, defining a stripe height of the DFL sensor and the SAF SB side shield, depositing a RB adjacent to the DFL sensor and the SAF SB side shield, and defining a track width of the RB.
    Type: Application
    Filed: September 19, 2024
    Publication date: January 9, 2025
    Applicant: Western Digital Technologies, Inc.
    Inventors: Ming MAO, Yung-Hung WANG, Chih-Ching HU, Chen-Jung CHIEN, Carlos CORONA, Hongping YUAN, Ming JIANG, Goncalo Marcos BAIÃO DE ALBUQUERQUE
  • Publication number: 20240404552
    Abstract: A two-dimensional magnetic recording (TDMR) read head includes a lower reader and an upper reader. Each of the lower reader and the upper reader may have a dual free layer (DFL) magnetic tunnel junction structure having first and second free layers located between lower and upper shields. A synthetic antiferromagnetic (SAF) structure is located on a side of each magnetic tunnel junction. A sidewall insulating layer is located between the lower soft bias layer of the SAF structure and the first free layer. The sidewall insulating layer can have a reduced height such that an upper soft bias layer of the SAF structure is in direct contact with a sidewall of the second free layer, or the upper portion of the sidewall insulating layer located between the upper soft bias layer of the SAF structure and the sidewall of the second free layer has a reduced thickness.
    Type: Application
    Filed: August 14, 2023
    Publication date: December 5, 2024
    Inventors: Chih-Ching Hu, Yung-Hung Wang, Ming Mao, Ming Jiang, Yukimasa Okada, Goncalo Baiao de Albuquerque
  • Patent number: 12131759
    Abstract: The present disclosure generally relates to a dual free layer (DFL) two dimensional magnetic recording (TDMR) read head, and a method of forming thereof. The read head comprises a lower sensor, middle shields disposed on the lower sensor, and an upper sensor disposed on the middle shields. After the lower reader is formed, a dielectric layer is deposited around an outer perimeter of the lower shield. Portions of the dielectric layer are ion milled such that the remaining portions form a substantially flat layer. Another embodiment includes a deposition of a TaOx layer on the dielectric layer, where x is a numeral. Portions of the dielectric layer and the TaOx layer are then ion milled such that the remaining portions of the TaOx layer and the dielectric layer collectively form a substantially planar layer. The middle shields are formed over the lower reader and are substantially planar.
    Type: Grant
    Filed: July 26, 2023
    Date of Patent: October 29, 2024
    Assignee: Western Digital Technologies, Inc.
    Inventors: Hongquan Jiang, Guanxiong Li, Ming Mao
  • Publication number: 20240347073
    Abstract: The present disclosure generally relates to a dual free layer two dimensional magnetic recording read head. The read head comprises a first lower shield, a first sensor disposed over the first lower shield, a first upper shield disposed over the first sensor, a read separation gap (RSG) disposed on the first upper shield, a second lower shield disposed on the RSG, a second sensor disposed over the second lower shield, and a second upper shield disposed over the second sensor. In one embodiment, the RSG comprises SiO2 and has a thickness of about 7 nm to about 14 nm. The SiO2 isolates the first sensor from the second sensor, and is a chemical mechanical processing (CMP) stop layer. In another embodiment, the RSG comprises a first sublayer comprising AlOx and a second sublayer comprising SiO2. The thicknesses of the first and second sublayers are based on an adjustable capacitance.
    Type: Application
    Filed: July 31, 2023
    Publication date: October 17, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Fang CHEN, Chih-Ching HU, Yung-Hung WANG, Chen-Jung CHIEN, Ming MAO, Ming JIANG
  • Patent number: 12106787
    Abstract: The present disclosure generally relate to a read head and methods of forming thereof. Upon forming a dual free layer (DFL) sensor and a rear hard bias (RHB) structure on a seed layer, a photoresist is deposited on the DFL read head and the RHB structure. A refill layer is deposited on the photoresist and the seed layer adjacent to the DFL sensor and the RHB structure. Portions of the refill layer disposed on one or more sidewalls of the photoresist are removed, and a SiOx cap layer is deposited on the refill layer and on the one or more sidewalls. The photoresist is removed, and the SiOx cap layer and top surfaces of the DFL sensor and the RHB structure are planarized to form a substantially flat topography. The SiOx cap layer acts as a stop layer for the refill layer, and remains in the finished read head.
    Type: Grant
    Filed: August 1, 2023
    Date of Patent: October 1, 2024
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yung-Hung Wang, Chih-Ching Hu, Hongxue Liu, Guanxiong Li, Chen-Jung Chien, Ming Mao, Ming Jiang
  • Publication number: 20240153533
    Abstract: The present disclosure generally relates to a dual free layer (DFL) two dimensional magnetic recording (TDMR) read head, and a method of forming thereof. The read head comprises a lower sensor, middle shields disposed on the lower sensor, and an upper sensor disposed on the middle shields. After the lower reader is formed, a dielectric layer is deposited around an outer perimeter of the lower shield. Portions of the dielectric layer are ion milled such that the remaining portions form a substantially flat layer. Another embodiment includes a deposition of a TaOx layer on the dielectric layer, where x is a numeral. Portions of the dielectric layer and the TaOx layer are then ion milled such that the remaining portions of the TaOx layer and the dielectric layer collectively form a substantially planar layer. The middle shields are formed over the lower reader and are substantially planar.
    Type: Application
    Filed: July 26, 2023
    Publication date: May 9, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Hongquan JIANG, Guanxiong LI, Ming MAO
  • Publication number: 20240144966
    Abstract: The present disclosure generally relates to a dual free layer two dimensional magnetic recording read head. The read head comprises a first lower shield, a first sensor disposed over the first lower shield, a first upper shield disposed over the first sensor, a read separation gap (RSG) disposed on the first upper shield, a second lower shield disposed over the RSG, a second sensor disposed over the second lower shield, and a second upper shield disposed over the second sensor. In some embodiments, the second lower shield comprises a CoFeHf layer. In another embodiment, the second lower shield is a synthetic antiferromagnetic multilayer comprising a first shield layer, a second shield layer, and a CoFe/Ru/CoFe anti-ferromagnetic coupling layer or a Ru layer disposed therebetween, the first and second shield layers comprising NiFe and CoFe. In yet another embodiment, the second lower shield comprises layers of Ru, IrMn, and NiFe.
    Type: Application
    Filed: July 26, 2023
    Publication date: May 2, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Ming MAO, Chen-Jung CHIEN, Goncalo Marcos BAIÃO DE ALBUQUERQUE, Chih-Ching HU, Yung-Hung WANG, Ming JIANG
  • Patent number: 11929385
    Abstract: A method for forming a pixelated optoelectronic stack comprises forming a stacked layer structure that comprises a bottom electrode layer, an optoelectronic layer over the bottom electrode layer, and a patterned hard-mask comprising a pattern over the optoelectronic layer. The method comprises replicating the pattern into the optoelectronic layer and the bottom electrode layer, thereby forming a first intermediate pixelated stack comprising at least two islands of stack separated from one another by stack-free areas; providing an electrically insulating layer on the first intermediate pixelated stack; removing a top portion of the electrically insulating layer and removing any remaining hard-mask so that a top surface of the electrically insulating layer is coplanar with an exposed top surface of the first intermediate pixelated stack, yielding a second intermediate pixelated stack; and forming a top transparent electrode layer over the second intermediate pixelated stack.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: March 12, 2024
    Assignee: Imec vzw
    Inventors: Yunlong Li, Stefano Guerrieri, Ming Mao, Luis Moreno Hagelsieb
  • Publication number: 20240071413
    Abstract: The present disclosure generally relates to a dual free layer (DFL) read head and methods of forming thereof. In one embodiment, a method of forming a DFL read head comprises depositing a DFL sensor, defining a stripe height of the DFL sensor, depositing a rear bias (RB) adjacent to the DFL sensor, defining a track width of the DFL sensor and the RB, and depositing synthetic antiferromagnetic (SAF) soft bias (SB) side shields adjacent to the DFL sensor. In another embodiment, a method of forming a DFL read head comprises depositing a DFL sensor, defining a track width of the DFL sensor, depositing SAF SB side shields adjacent to the DFL sensor, defining a stripe height of the DFL sensor and the SAF SB side shield, depositing a RB adjacent to the DFL sensor and the SAF SB side shield, and defining a track width of the RB.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Ming MAO, Yung-Hung WANG, Chih-Ching HU, Chen-Jung CHIEN, Carlos CORONA, Hongping YUAN, Ming JIANG, Goncalo Marcos BAIÃO DE ALBUQUERQUE
  • Patent number: 11778853
    Abstract: A display panel and manufacturing methods thereof are provided. In one example, the display panel includes a flexible substrate having a display area and a non-display area, a dam structure located in the non-display area and disposed around the display area, one or more grooves disposed on the non-display area between the display area and the dam structure, and an organic encapsulation layer. In some examples, the organic encapsulation layer covers each of the display area, at least a portion of the non-display area, and the one or more grooves. Accordingly, a display device comprising the display panel is also provided. Thus, a flatness of the organic encapsulation layer may be improved and peeling may be reduced between the organic encapsulation layer and a substrate on which the organic encapsulation layer is disposed, thereby improving an overall quality of the finished display panel.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: October 3, 2023
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ying Liu, Ming Mao, Yuhang Peng
  • Patent number: 11598828
    Abstract: The present disclosure generally relates to a Wheatstone bridge array that has four resistors. Each resistor includes a plurality of TMR structures. Two resistors have identical TMR structures. The remaining two resistors also have identical TMR structures, though the TMR structures are different from the other two resistors. Additionally, the two resistors that have identical TMR structures have a different resistance area as compared to the remaining two resistors that have identical TMR structures. Therefore, the working bias field for the Wheatstone bridge array is non-zero.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: March 7, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yuankai Zheng, Christian Kaiser, Zhitao Diao, Chih-Ching Hu, Chen-jung Chien, Yung-Hung Wang, Dujiang Wan, Ronghui Zhou, Ming Mao, Ming Jiang, Daniele Mauri
  • Patent number: 11569332
    Abstract: A display substrate and a display device are provided in the present invention. The display substrate includes a base substrate, and a positive power supply line, a negative power supply line and a first dam which are on the base substrate. The base substrate includes a display region and a peripheral region arranged around the display region. The positive power supply line, the negative power supply line and the first dam are in the peripheral region, and the first dam is arranged around the display region. At least in a corresponding region between the positive power supply line and the negative power supply line, a protruding structure is on a side of the first dam proximal to the display region.
    Type: Grant
    Filed: December 25, 2019
    Date of Patent: January 31, 2023
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ming Mao, Pan Zhao, Li Song, Ge Wang, Zhiliang Jiang
  • Patent number: 11532324
    Abstract: The present disclosure generally relates to a read head assembly having a dual free layer (DFL) structure disposed between a first shield and a second shield at a media facing surface. The read head assembly further comprises a rear hard bias (RHB) structure disposed adjacent to the DFL structure recessed from the media facing surface, where an insulation layer separates the RHB structure from the DFL structure. The insulation layer is disposed perpendicularly between the first shield and the second shield. The DFL structure comprises a first free layer and a second free layer having equal stripe heights from the media facing surface to the insulation layer. The RHB structure comprises a seed layer, a bulk layer, and a capping layer. The capping layer and the insulation layer prevent the bulk layer from contacting the second shield.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: December 20, 2022
    Assignee: Western Digital Technologies, Inc.
    Inventors: Ming Mao, Chen-Jung Chien, Daniele Mauri, Goncalo Marcos Baião De Albuquerque