Patents by Inventor Ming Miao

Ming Miao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120329380
    Abstract: The invention discloses a ventilation system including an inner, an outer tube and an air intake and exhaust apparatus. The inner tube has one end extending in a radial direction, wherein an air outlet and an air outlet are formed on the inner tube. An exhaust channel is formed between the inner and outer tubes, and the supporting member is disposed in the exhaust channel. The air intake and exhaust apparatus comprises an elevating member, a plurality of driving members and a cover plate. The elevating member has a connection block. The driving members are made of expandable material. The cover plate is rotatably coupled with the inner tube and has a connection portion. The connection portion abuts against the connection block when the driving members are not expanding. The connection portion of the cover plate disengages from the connection block when the driving members are expanding.
    Type: Application
    Filed: August 19, 2011
    Publication date: December 27, 2012
    Inventors: Chang-Hsien Tai, Jr-Ming Miao, Shi-Wei Lo, Jyh-Tong Teng
  • Publication number: 20120324892
    Abstract: A power system driven by a low-temperature heat source includes a power cycling unit and a heat pump unit. The power cycling unit includes a turbine, a condenser, a pump, a first heat exchanger, and a second heat exchanger. The turbine, the condenser, the pump, the first heat exchanger, and the second heat exchanger are connected in sequence. The heat pump unit includes a condenser and an evaporator. The condenser of the heat pump unit is connected to the second heat exchanger. The evaporator is connected to the condenser of the heat pump unit. The evaporator absorbs heat of a working fluid in a waste heat pipe.
    Type: Application
    Filed: August 11, 2011
    Publication date: December 27, 2012
    Inventors: Chang-Hsien Tai, Jr-Ming Miao, Uzu-Kuei Hsu, Ming-Hui Ho
  • Publication number: 20120270487
    Abstract: A duct including a duct body is disclosed. The duct is a hollow tube and includes an air channel and an exit end. The exit end has a windward portion and an air-guiding portion on two sides thereof.
    Type: Application
    Filed: August 8, 2011
    Publication date: October 25, 2012
    Inventors: Chang-Hsien Tai, Jr-Ming Miao, Shi-Wei Lo
  • Publication number: 20120174616
    Abstract: A generator includes a liquid tank, a high temperature device and a nozzle unit. The liquid tank has a receiving room. The high temperature device is disposed on a surface of the liquid tank. The nozzle unit includes a tank, an injecting tube, a nozzle and an oscillating device. The tank is disposed in the receiving room and filled with a working fluid. The injecting tube has one end communicating with the tank. The nozzle is disposed on a surface of the tank and faces the high temperature device. The oscillating device is disposed on the tank to induce oscillation of the working fluid in the tank, wherein the oscillation changes the pressure of the working fluid so that the working fluid is pulled towards the nozzle and is sprayed on the high temperature device by the nozzle.
    Type: Application
    Filed: March 15, 2011
    Publication date: July 12, 2012
    Inventors: Chang-Hsien TAI, Jr-Ming Miao, Ming-Hui Ho
  • Publication number: 20020040800
    Abstract: A packaging structure of a chip is disclosed. The packaging structure has high heat conductivity and a preferred electric insulation and can protect the chip. The packaging structure includes a chip, a lead frame, a signal transmission device for being connected to the chip and lead frame, a protecting gel layer, a diamond-like carbon layer, and an electric insulating layer. By aforesaid structure, when the chip is working, the heat from the chip is dissipated through the diamond-like carbon layer under the hollowed portion so that a working temperature of the chip is retained in a normal temperature.
    Type: Application
    Filed: June 18, 2001
    Publication date: April 11, 2002
    Inventors: Da Sheng Lee, Ming Miao, Cheng-Ming Kuo, Mei-Hui Chang