Patents by Inventor Ming-Quan CUI

Ming-Quan CUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10605540
    Abstract: A vapor chamber includes a first panel defining an evaporation region, a thermal insulation region and a condensation region, a second panel joined to the first panel to define an enclosed accommodation space therebetween, a capillary material disposed in the accommodation space, and a working fluid. The first panel has a plurality of first bumps disposed within the accommodation space and distributed in the evaporation region, the thermal insulation region and the condensation region and abutted against the capillary material. The capillary material has a hollow portion located in the thermal insulation region to expose a part of the first bumps. The second panel has a plurality of second bumps abutted against the first bumps in the hollow portion.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: March 31, 2020
    Assignee: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Chuan-Chi Tseng, Wen-Ching Liao, Ming-Quan Cui
  • Publication number: 20200003498
    Abstract: A vapor chamber includes a first panel defining an evaporation region, a thermal insulation region and a condensation region, a second panel joined to the first panel to define an enclosed accommodation space therebetween, a capillary material disposed in the accommodation space, and a working fluid. The first panel has a plurality of first bumps disposed within the accommodation space and distributed in the evaporation region, the thermal insulation region and the condensation region and abutted against the capillary material. The capillary material has a hollow portion located in the thermal insulation region to expose a part of the first bumps. The second panel has a plurality of second bumps abutted against the first bumps in the hollow portion.
    Type: Application
    Filed: August 14, 2018
    Publication date: January 2, 2020
    Inventors: Chuan-Chi TSENG, Wen-Ching LIAO, Ming-Quan CUI
  • Publication number: 20190339021
    Abstract: A joint vapor chamber assembly with vapor chambers connected by an extension wick layer is provided. The vapor chambers each have therein a closed space being a vacuum and filled with a working liquid. The joint vapor chamber assembly includes: a base having a first recess, second recess, liquid flow channel and gaseous flow channel in communication with each other; an upper lid coupled to the base to jointly form the closed space, the closed space including the first and second recesses, liquid and gaseous flow channels; a wick structure disposed in the closed space and facing the first and second recesses; an extension wick layer filling the liquid flow channel partially to prevent any gas from entering the first and second recesses via the liquid flow channel. Two ends of the extension wick layer extend from the liquid flow channel to come into contact with the wick structure.
    Type: Application
    Filed: August 1, 2018
    Publication date: November 7, 2019
    Inventors: Chuan-Chi TSENG, Wen-Ching LIAO, Ming-Quan CUI
  • Publication number: 20190339020
    Abstract: A loop vapor chamber conducive to separation of liquid and gas includes a base, an upper lid, a wick structure and a working fluid. The base includes a first recess, a second recess, a first extension channel and a second extension channel. The first recess and the second recess are in communication with each other through the first extension channel and the second extension channel. The upper lid is coupled to the base. The first recess, the second recess, the first extension channel and the second extension channel together form a closed space. The wick structure is disposed in the closed space and thus corresponds in position to the first recess, the second recess and the first extension channel.
    Type: Application
    Filed: July 23, 2018
    Publication date: November 7, 2019
    Inventors: Chuan-Chi TSENG, Wen-Ching LIAO, Ming-Quan CUI
  • Publication number: 20190339022
    Abstract: A loop vapor chamber includes: a base board having therein a space; a lid for covering the base board and sealing the space to form therein an evaporation chamber, vapor channel, condensation channel and liquid channel, the vapor channel having an end in communication with the evaporation chamber and another end in connection with the condensation channel, the condensation channel connecting to the liquid channel, and the liquid channel connecting to the evaporation chamber; a wick disposed in the evaporation chamber without occupying the evaporation chamber fully such that an evaporation space is defined in the evaporation chamber, the evaporation space being in communication with the vapor channel, wherein a portion of the wick corresponds in position to one end of the liquid channel; a space partition element disposed in the evaporation chamber to separate the evaporation space and liquid channel; and a working fluid filling the evaporation chamber.
    Type: Application
    Filed: August 1, 2018
    Publication date: November 7, 2019
    Inventors: Chuan-Chi TSENG, Wen-Ching LIAO, Ming-Quan CUI
  • Publication number: 20190335619
    Abstract: A loop heat transfer device has therein an enclosed space being vacuum and filled with a working fluid. The loop heat transfer device includes a base, a partition wall, an upper lid, and a capillarity structure. The base includes a first chamber, a second chamber and an extension groove. The extension groove extends from the first chamber to the second chamber. The partition wall connects to the base and partitions the extension groove into a capillarity channel and an airstream channel. The upper lid connects to the base and the partition wall. The enclosed space includes the first chamber, the second chamber and the extension groove. The capillarity structure is disposed in the first chamber, the second chamber and the capillarity channel.
    Type: Application
    Filed: July 31, 2018
    Publication date: October 31, 2019
    Inventors: Chuan-Chi TSENG, Wen-Ching LIAO, Ming-Quan CUI
  • Publication number: 20190160600
    Abstract: A method of manufacturing an exhaust-pipe-free vapor chamber includes the steps of: preparing: placing two boards one above the other to form therebetween a receiving space, placing a wick in the receiving space, and sintering the wick to at least one of the boards, wherein the boards each have an extension plate extending outward from an end of the board, allowing the boards and extension plates to form a tunnel which an exhaust pipe is inserted into; water feeding and gas removing; sealing: clamping portions of the boards and extension plates by a sealing clamp, but not clamping the exhaust pipe, wherein the clamped portions correspond in position to the tunnel and are compressed such that a portion of the tunnel is compressed and sealed; cutting: cutting off an external, remaining portion not clamped by the sealing clamp; and welding: welding and sealing a gap not yet been brazed.
    Type: Application
    Filed: January 5, 2018
    Publication date: May 30, 2019
    Inventors: Chuan-Chi TSENG, Wen-Ching LIAO, Ming-Quan CUI
  • Publication number: 20190113290
    Abstract: A vapor chamber with an inner ridge forming passages, including: a first board having, defined thereon, a heating region, a thermally-insulating region and a condensing region; a second board coupled to the first board; a first wick disposed at the second board or the first board and extending from the heating region to the thermally-insulating region at the very least; and a working fluid. An inner ridge protrudes from the first board toward the second board and has bumps spaced apart by a predetermined distance. Some of the bumps are slender, flank predetermined routes, and are spaced apart to form passages, with the passages extending from the heating region to the condensing region via the thermally-insulating region. Ends of the bumps press against the first wick or the second board.
    Type: Application
    Filed: November 24, 2017
    Publication date: April 18, 2019
    Inventors: Chuan-Chi TSENG, Wen-Ching LIAO, Ming-Quan CUI
  • Patent number: 10240873
    Abstract: A joint assembly of vapor chambers connects the vapor chambers to effectuate joint operation thereof. For example, two paired vapor chambers are connected therebetween by a capillary pipe and a gas pipe. The capillary pipe is filled with a third wick which connects with a first wick and a second wick in the two vapor chambers. The two vapor chambers are in spatial communication with each other because of the gas pipe. A working fluid in the two vapor chambers is transferred between the first, second and third wicks by capillarity. The gas-phase working fluid moves between the two vapor chambers via the gas pipe, thereby allowing the two vapor chambers to operate jointly.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: March 26, 2019
    Assignee: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Chuan-Chi Tseng, Wen-Ching Liao, Ming-Quan Cui
  • Publication number: 20190041138
    Abstract: A joint assembly of vapor chambers connects the vapor chambers to effectuate joint operation thereof. For example, two paired vapor chambers are connected therebetween by a capillary pipe and a gas pipe. The capillary pipe is filled with a third wick which connects with a first wick and a second wick in the two vapor chambers. The two vapor chambers are in spatial communication with each other because of the gas pipe. A working fluid in the two vapor chambers is transferred between the first, second and third wicks by capillarity. The gas-phase working fluid moves between the two vapor chambers via the gas pipe, thereby allowing the two vapor chambers to operate jointly.
    Type: Application
    Filed: September 20, 2017
    Publication date: February 7, 2019
    Inventors: Chuan-Chi TSENG, Wen-Ching LIAO, Ming-Quan CUI
  • Publication number: 20170363367
    Abstract: A heat dissipation device includes: a heat spreader having a first plate and a second plate, wherein the plates are connected to form a receiving space therebetween; a first capillary material provided on the first plate, the second plate, or both; at least one heat pipe having a cavity in communication with the receiving space, wherein the heat pipe is connected to the heat spreader at one end and is outside the heat spreader and closed at the other end; a second capillary material provided on the inner wall of the heat pipe; at least one fiber bundle of an elongated shape, wherein the fiber bundle has a portion in the receiving space and in contact with the first capillary material and another portion extending into the cavity and in contact with the second capillary material; and a working fluid in the receiving space and the cavity.
    Type: Application
    Filed: August 19, 2016
    Publication date: December 21, 2017
    Inventors: Yun-Yeu YEH, Chuan-Chi TSENG, Ming-Quan CUI
  • Publication number: 20170350657
    Abstract: A heat spreader with a liquid-vapor separation structure includes a first panel, a second panel bonded with the first panel and defining therebetween an enclosed accommodation chamber, multiple spacer members arranged spaced apart from one another in the accommodation chamber and abutted between the first panel and the second panel and defining multiple vapor passages and liquid passages therebetween and dividing the accommodation chamber into a heat-absorbing zone and a condensing zone that are disposed in communication with each other through the vapor passages and the liquid passages, a first wick material partially disposed in the liquid passages and partially disposed in the heat-absorbing zone and the condensing zone, and a working fluid filled in the accommodation chamber.
    Type: Application
    Filed: August 2, 2016
    Publication date: December 7, 2017
    Inventors: Yun-Yeu YEH, Chuan-Chi TSENG, Ming-Quan CUI
  • Patent number: D909979
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: February 9, 2021
    Assignee: Tai-Sol Electronics Co., Ltd.
    Inventors: Chuan-Chi Tseng, Ming-Quan Cui