Vapor chamber
Latest Tai-Sol Electronics Co., Ltd. Patents:
Description
The broken lines shown in
Claims
The ornamental design for a vapor chamber, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
D717744 | November 18, 2014 | Mueller |
9854705 | December 26, 2017 | Honmura |
10368430 | July 30, 2019 | Ho |
10371458 | August 6, 2019 | Sun |
10591222 | March 17, 2020 | Zhou |
10605540 | March 31, 2020 | Tseng |
10612862 | April 7, 2020 | Mira |
20130048252 | February 28, 2013 | Yang |
20150119111 | April 30, 2015 | Honmura |
20160091259 | March 31, 2016 | Lin |
20190113290 | April 18, 2019 | Tseng |
- A L M T Corp, “Heatspreader Materials”, accessed Oct. 13, 2020. (https://www.allied-material.co.jp/en/products/heatspreader/Material.html) (Year: 2020).
- Cooler Master , “Vapor Chambers and Slim VC”, Accessed Oct. 13, 2020. (https://www.coolermastercorp.com/technology/design/vapor-chambers-and-slim-vc/) (Year: 2020).
Patent History
Patent number: D909979
Type: Grant
Filed: Nov 28, 2017
Date of Patent: Feb 9, 2021
Assignee: Tai-Sol Electronics Co., Ltd. (Taipei)
Inventors: Chuan-Chi Tseng (Taipei), Ming-Quan Cui (Wujiang)
Primary Examiner: April Rivas
Application Number: 29/627,535
Type: Grant
Filed: Nov 28, 2017
Date of Patent: Feb 9, 2021
Assignee: Tai-Sol Electronics Co., Ltd. (Taipei)
Inventors: Chuan-Chi Tseng (Taipei), Ming-Quan Cui (Wujiang)
Primary Examiner: April Rivas
Application Number: 29/627,535
Classifications
Current U.S. Class:
Heat Sink (D13/179)