Vapor chamber

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Description

FIG. 1 is a perspective view of a first embodiment of a vapor chamber showing the new design;

FIG. 2 is a front elevational view thereof, the rear elevational view being omitted;

FIG. 3 is a right side elevational view thereof, the left side elevational view being omitted;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a perspective view of a second embodiment of a vapor chamber showing the new design.

The broken lines shown in FIGS. 1-6 depict portions of the vapor chamber that form no part of the claimed design. The dash-dot-dash line drawn in the FIGS. 1-6 depict boundary of the claimed design.

Claims

The ornamental design for a vapor chamber, as shown and described.

Referenced Cited
U.S. Patent Documents
D717744 November 18, 2014 Mueller
9854705 December 26, 2017 Honmura
10368430 July 30, 2019 Ho
10371458 August 6, 2019 Sun
10591222 March 17, 2020 Zhou
10605540 March 31, 2020 Tseng
10612862 April 7, 2020 Mira
20130048252 February 28, 2013 Yang
20150119111 April 30, 2015 Honmura
20160091259 March 31, 2016 Lin
20190113290 April 18, 2019 Tseng
Other references
  • A L M T Corp, “Heatspreader Materials”, accessed Oct. 13, 2020. (https://www.allied-material.co.jp/en/products/heatspreader/Material.html) (Year: 2020).
  • Cooler Master , “Vapor Chambers and Slim VC”, Accessed Oct. 13, 2020. (https://www.coolermastercorp.com/technology/design/vapor-chambers-and-slim-vc/) (Year: 2020).
Patent History
Patent number: D909979
Type: Grant
Filed: Nov 28, 2017
Date of Patent: Feb 9, 2021
Assignee: Tai-Sol Electronics Co., Ltd. (Taipei)
Inventors: Chuan-Chi Tseng (Taipei), Ming-Quan Cui (Wujiang)
Primary Examiner: April Rivas
Application Number: 29/627,535
Classifications
Current U.S. Class: Heat Sink (D13/179)