Abstract: A memory string is disclosed including a plurality of core cells serially connected between a source select gate and a drain select gate along a channel. Each core cell includes a wordline separated from the channel by a stack of layers including a charge trapping layer. At least one of the source and drain select gates is a stacked select gate with a plurality of components, including a first component adjacent to the plurality of core cells and a second component separated from the core cells by the first component. The first component includes a wordline separated from the channel by a stack of layers including a charge trapping layer, and a distance between the wordline of the first component and the wordline of a first core cell in the plurality of core cells is substantially the same as distances between each wordline in the plurality of word core cells.

Abstract: A memory string is disclosed including a plurality of core cells serially connected between a source select gate and a drain select gate along a channel. Each core cell includes a wordline separated from the channel by a stack of layers including a charge trapping layer. At least one of the source and drain select gates is a stacked select gate with a plurality of components, including a first component adjacent to the plurality of core cells and a second component separated from the core cells by the first component. The first component includes a wordline separated from the channel by a stack of layers including a charge trapping layer, and a distance between the wordline of the first component and the wordline of a first core cell in the plurality of core cells is substantially the same as distances between each wordline in the plurality of word core cells.

Abstract: A memory string is disclosed including a plurality of core cells serially connected between a source select gate and a drain select gate along a channel. Each core cell includes a wordline separated from the channel by a stack of layers including a charge trapping layer. At least one of the source and drain select gates is a stacked select gate with a plurality of components, including a first component adjacent to the plurality of core cells and a second component separated from the core cells by the first component. The first component includes a wordline separated from the channel by a stack of layers including a charge trapping layer, and a distance between the wordline of the first component and the wordline of a first core cell in the plurality of core cells is substantially the same as distances between each wordline in the plurality of word core cells.

Abstract: A memory string is disclosed including a plurality of core cells serially connected between a source select gate and a drain select gate along a channel. Each core cell includes a wordline separated from the channel by a stack of layers including a charge trapping layer. At least one of the source and drain select gates is a stacked select gate with a plurality of components, including a first component adjacent to the plurality of core cells and a second component separated from the core cells by the first component. The first component includes a wordline separated from the channel by a stack of layers including a charge trapping layer, and a distance between the wordline of the first component and the wordline of a first core cell in the plurality of core cells is substantially the same as distances between each wordline in the plurality of word core cells.

Abstract: A memory string is disclosed including a plurality of core cells serially connected between a source select gate and a drain select gate along a channel. Each core cell includes a wordline separated from the channel by a stack of layers including a charge trapping layer. At least one of the source and drain select gates is a stacked select gate with a plurality of components, including a first component adjacent to the plurality of core cells and a second component separated from the core cells by the first component. The first component includes a wordline separated from the channel by a stack of layers including a charge trapping layer, and a distance between the wordline of the first component and the wordline of a first core cell in the plurality of core cells is substantially the same as distances between each wordline in the plurality of word core cells.

Abstract: A memory string is disclosed including a plurality of core cells serially connected between a source select gate and a drain select gate along a channel. Each core cell includes a wordline separated from the channel by a stack of layers including a charge trapping layer. At least one of the source and drain select gates is a stacked select gate with a plurality of components, including a first component adjacent to the plurality of core cells and a second component separated from the core cells by the first component. The first component includes a wordline separated from the channel by a stack of layers including a charge trapping layer, and a distance between the wordline of the first component and the wordline of a first core cell in the plurality of core cells is substantially the same as distances between each wordline in the plurality of word core cells.

Abstract: A memory string is disclosed including a plurality of core cells serially connected between a source select gate and a drain select gate along a channel. Each core cell includes a wordline separated from the channel by a stack of layers including a charge trapping layer. At least one of the source and drain select gates is a stacked select gate with a plurality of components, including a first component adjacent to the plurality of core cells and a second component separated from the core cells by the first component. The first component includes a wordline separated from the channel by a stack of layers including a charge trapping layer, and a distance between the wordline of the first component and the wordline of a first core cell in the plurality of core cells is substantially the same as distances between each wordline in the plurality of word core cells.

Abstract: A memory device can include at least one plate structure formed over a semiconductor substrate; an active region formed within the semiconductor substrate without lateral isolation structures; a plurality of bit line contact groups, each including bit line contacts to the active region disposed in a first direction; a plurality of storage contact groups, each including storage contacts to the active region disposed in the first direction; a plurality of gate structures, each including a main section extending in the first direction, and disposed between one bit line contact group and an adjacent storage contact group; and a two-terminal storage element disposed between each bit line contact and the at least one plate structure.

Abstract: A memory string is disclosed including a plurality of core cells serially connected between a source select gate and a drain select gate along a channel. Each core cell includes a wordline separated from the channel by a stack of layers including a charge trapping layer. At least one of the source and drain select gates is a stacked select gate with a plurality of components, including a first component adjacent to the plurality of core cells and a second component separated from the core cells by the first component. The first component includes a wordline separated from the channel by a stack of layers including a charge trapping layer, and a distance between the wordline of the first component and the wordline of a first core cell in the plurality of core cells is substantially the same as distances between each wordline in the plurality of word core cells.

Abstract: A memory string is disclosed including a plurality of core cells serially connected between a source select gate and a drain select gate along a channel. Each core cell includes a wordline separated from the channel by a stack of layers including a charge trapping layer. At least one of the source and drain select gates is a stacked select gate with a plurality of components, including a first component adjacent to the plurality of core cells and a second component separated from the core cells by the first component. The first component includes a wordline separated from the channel by a stack of layers including a charge trapping layer, and a distance between the wordline of the first component and the wordline of a first core cell in the plurality of core cells is substantially the same as distances between each wordline in the plurality of word core cells.

Abstract: A memory string is disclosed including a plurality of core cells serially connected between a source select gate and a drain select gate along a channel. Each core cell includes a wordline separated from the channel by a stack of layers including a charge trapping layer. At least one of the source and drain select gates is a stacked select gate with a plurality of components, including a first component adjacent to the plurality of core cells and a second component separated from the core cells by the first component. The first component includes a wordline separated from the channel by a stack of layers including a charge trapping layer, and a distance between the wordline of the first component and the wordline of a first core cell in the plurality of core cells is substantially the same as distances between each wordline in the plurality of word core cells.

Abstract: In one embodiment, a semiconductor memory device includes a plurality of resistive switching memory cells, where each resistive switching memory cell can include: (i) a programmable impedance element having an anode and a cathode; (ii) an access transistor having a drain coupled to a bit line, a source coupled to the programmable impedance element cathode, and a gate coupled to a word line; (iii) a well having a first diffusion region configured as the source, a second diffusion region configured as the drain, and a third diffusion region configured as a well contact; and (iv) a diode having a cathode at the second diffusion region, and an anode at the third diffusion region, where the diode is turned on during an erase operation on the programmable impedance element.

Abstract: In one embodiment, a resistive switching memory device can include: (i) a plurality of resistive memory cells arranged in a plurality of array blocks, where each resistive memory cell is configured to be programmed to a low resistance state by application of a program voltage in a forward bias direction, and to be erased to a high resistance state by application of an erase voltage in a reverse bias direction; (ii) a plurality of anode plates corresponding to the plurality of array blocks, where each resistive memory cell can include a resistive storage element having an anode coupled to one of the anode plates; (iii) an inactive ring surrounding the plurality of anode plates, where the inactive ring can include a same material as each of the plurality of anode plates; and (iv) a plurality of boundary cells located under the inactive ring.

Abstract: In one embodiment, a capacitive circuit can include: (i) a resistive storage element having a solid electrolyte, a first electrode coupled to a first side of the solid electrolyte, and a second electrode coupled to a second side of the solid electrolyte; (ii) the resistive storage element being configured to be programmed to a low resistance state by application of a program voltage in a forward bias direction to form a conductive path between the first and second electrodes, and being configured to be erased to a high resistance state by application of an erase voltage in a reverse bias direction to substantially dissolve the conductive path; and (iii) a first capacitor having the first electrode coupled to a first side of a first oxide layer, and a third electrode coupled to a second side of the first oxide layer.

Abstract: One embodiment of the present invention relates to a memory cell. The memory cell comprises a substrate and a stacked gate structure disposed on the substrate, wherein the stacked gate structure comprises a charge trapping dielectric layer that is adapted to store at least one bit of data. The memory cell further includes a source and drain in the substrate, wherein the source and drain are disposed at opposite sides of the stacked gate structure. A barrier region is disposed substantially beneath the source or the drain and comprises an inert species. Other embodiments are also disclosed.

Abstract: Novel fabrication methods implement the use of dummy tiles to avoid the effects of in-line charging, ESD events, and such charge effects in the formation of a memory device region region. One method involves forming at least a portion of a memory core array upon a semiconductor substrate that involves forming STI structures in the substrate substantially surrounding a memory device region region within the array. An oxide layer is formed over the substrate in the memory device region region and over the STI's, wherein an inner section of the oxide layer formed over the memory device region region is thicker than an outer section of the oxide layer formed over the STI's. A first polysilicon layer is then formed over the inner and outer sections comprising one or more dummy tiles formed over one or more outer sections and electrically connected to at least one inner section.

Abstract: The present invention pertains to a system method of forming at least a portion of a dual bit memory core array upon a semiconductor substrate, the method comprising forming adjacent first memory cell process assemblies; comprising a charge trapping dielectric, a first polysilicon layer and defining a first bitline opening there between, forming first polysilicon layer features over the charge trapping dielectric layer, depositing a layer of second spacer material over the charge trapping dielectric and the first polysilicon layer features, forming a sidewall spacer adjacent to the charge trapping dielectric and the first polysilicon layer features to define a second bitline opening between the adjacent memory cells, performing a bitline implant, or pocket implants, or both into the bitline opening to establish buried bitlines within the substrate having respective bitline widths that are narrower than the respective widths of the first bitline openings, removing the sidewall spacers, and performing back end

Abstract: A memory cell string is disclosed. The memory cell string includes a first select gate that includes a first plurality of elements. A plurality of wordlines are coupled to the first select gate and a second select gate, that includes a second plurality of elements, is coupled to the plurality of wordlines. The distances between one element of the first and the second plurality of elements and the plurality of wordlines are the same as the distances that exist between each wordline of the plurality of wordlines.

Abstract: The present invention facilitates memory devices and operation of dual bit and single bit memory devices by providing systems and methods that employ a salicide block to vary and equalize the resistance of a memory array during fabrication. The present invention includes utilizing a common charge dissipation region to mitigate charge-loss by providing protection against charging up of the various lines as a result of further plasma etching processes. The salicide block equalizes the charge dissipation in the memory array by providing each wordline path with a varied amount of resistance in addition to the total path resistance. Because the charge protection provided to each wordline otherwise varies depending on the resistance path to a common discharge element, a salicide block for resistance equalization provides greater reliability and predictability during processing. Other such shapes conducive for any desired resistance path fall within the scope of the invention.

Abstract: A method of forming at least a portion of a dual bit memory core array upon a semiconductor substrate, the method comprising performing front end processing, performing a first bitline implant, or pocket implants, or both into the first bitline spacings to establish buried first bitlines within the substrate, depositing a layer of the spacer material over the charge trapping dielectric and the polysilicon layer features, forming a sidewall spacer adjacent to the charge trapping dielectric and the polysilicon layer features to define second bitline spacings between adjacent memory cells, performing a deep arsenic implant into the second bitline spacings to establish a second bitline within the structure that is deeper than the first bit line, removing the sidewall spacers and performing back end processing.