Abstract: The present invention relates a method of controlling and monitoring the thickness variation of the film structure of a semiconductor wafer by monitoring the thickness variation of the film structure of a testing region. The method is characterized by etching the film structure of the testing region with a pattern density substantially compatible with that of the device region in order to precisely simulate the thickness variation of the film structure of a device region in a chemical mechanical polishing process.

Abstract: A method for eliminating polysilicon residue is provided by converting the polysilicon residue into silicon nitride in two steps. A tilted ion implantation step is performed to implant nitrogen ions into the polysilicon residue to rich nitrogen containing of the polysilicon residue. A nitrogen anneal step is subsequently performed to completely convert the rich nitrogen containing polysilicon residue into silicon nitride that can eliminate the conductivity of the polysilicon residue and prevent conventional oxygen encroachment occurring.

Abstract: A method for eliminating polysilicon residue is provided by converting the polysilicon residue into silicon dioxide in two steps. A tilted ion implantation step is performed to implant oxygen ions into the polysilicon residue to rich oxygen containing of the polysilicon residue. An oxygen anneal step is subsequently performed to completely convert the rich oxygen containing polysilicon residue into silicon dioxide that can eliminate the conductivity of the polysilicon residue and prevent oxygen encroachment occurring.

Abstract: A method for reducing oxidation encroachment of stacked gate layer is provided by forming a silicon oxynitride layer on the sidewall surface of the stacked gate layer. A tilted ion implantation step is performed to implant nitrogen ions into the sidewall surface of the stacked gate layer to rich nitrogen containing in the sidewall surface of the stacked gate layer. An oxygen-annealing step is subsequently performed to form a silicon oxynitride layer on the sidewall surface of the stacked gate layer. The silicon oxynitride layer can prevent the polysilicon layer in the stacked gate layer being continuously encroached from the oxygen.

Abstract: A new structure and method with a process tracking current source component to program a flash EPROM memory is proposed. By applying a current source which varies not only with the process variation but also with the source bias of the cell being programmed, a self-convergent and high-efficiency programming can be achieved. This process tracking current source component provides less current for cells with higher erased Vt and larger current for cells with lower erased Vt. A circuit for programming a floating gate transistor includes a current source component. The current source component couples in series between the floating gate transistor and an electrical sink during a programming interval. The current source component includes an electrical characteristic substantially matching the electrical characteristic of the floating gate transistor. An integrated circuit memory module on a semiconductor substrate is disclosed.

Abstract: The present invention relates a method of controlling and monitoring the thickness variation of the film structure of a semiconductor wafer by monitoring the thickness variation of the film structure of a testing region. The method is characterized by etching the film structure of the testing region with a pattern density substantially compatible with that of the device region in order to precisely simulate the thickness variation of the film structure of a device region in a chemical mechanical polishing process.

Abstract: A method for eliminating polysilicon residue is provided by converting the polysilicon residue into silicon dioxide in two steps. A tilted ion implantation step is performed to implant oxygen ions into the polysilicon residue to rich oxygen containing of the polysilicon residue. An oxygen anneal step is subsequently performed to completely convert the rich oxygen containing polysilicon residue into silicon dioxide that can eliminate the conductivity of the polysilicon residue and prevent oxygen encroachment occurring.

Abstract: A method for eliminating polysilicon residue is provided by converting the polysilicon residue into silicon nitride in two steps. A tilted ion implantation step is performed to implant nitrogen ions into the polysilicon residue to rich nitrogen containing of the polysilicon residue. A nitrogen anneal step is subsequently performed to completely convert the rich nitrogen containing polysilicon residue into silicon nitride that can eliminate the conductivity of the polysilicon residue and prevent conventional oxygen encroachment occurring.

Abstract: A method for reducing oxidation encroachment of stacked gate layer is provided by forming a silicon oxynitride layer on the sidewall surface of the stacked gate layer. A tilted ion implantation step is performed to implant nitrogen ions into the sidewall surface of the stacked gate layer to rich nitrogen containing in the sidewall surface of the stacked gate layer. An oxygen-annealing step is subsequently performed to form a silicon oxynitride layer on the sidewall surface of the stacked gate layer. The silicon oxynitride layer can prevent the polysilicon layer in the stacked gate layer being continuously encroached from the oxygen.

Abstract: The invention provides a method for forming a semiconductor gate, by forming spacers to isolate the interface between the HDP dielectric layer and the polysilicon gate being exposed, thereby preventing single bit failure resulting from defects at the interface between the HDP dielectric layer and the polysilicon gate. After a cap layer is formed on a conductive structure over the substrate, a HDP dielectric layer is formed exposing the cap layer. A top of the HDP dielectric layer is higher than a top of the first conductive layer. After removing the cap layer to form a recess between the HDP dielectric layer and on the conductive structure, spacers are formed on sidewalls of the recess. Afterwards, a conductive layer is formed and connected to the conductive structure.

Abstract: A method and a circuit layout on a substrate of a semiconductor wafer, suitable for reducing defects during a chemical mechanical polishing process. On the substrate, the circuit layout comprises a plurality of strips of first circuit structure and at least two strips of second circuit structure located on the substrate. Each of the strips of second circuit structure respectively links the front end and the rear end of the plurality of strips of the first circuit structure for the purpose of averaging polishing pressure performed upon the front end and the rear end of the plurality of strips of the first circuit structure during the chemical mechanical polishing process for reducing defects.

Abstract: A new structure and method with a process tracking current source component to program a flash EPROM memory is proposed. By applying a current source which varies not only with the process variation but also with the source bias of the cell being programmed, a self-convergent and high-efficiency programming can be achieved. This process tracking current source component provides less current for cells with higher erased Vt and larger current for cells with lower erased Vt.

Abstract: Method for soft-programming at least one floating gate memory cell in at least one page of a persistent memory device by converging the low threshold voltages of the several cells of the page within an optimal range, and apparatus implementing the method. The methodology of the present invention teaches connecting the individual drains of the several memory cells of the device of a given page, or block, to a voltage limited constant current circuitry component. The methodology applies a first positive voltage to the word line of the page and a second positive voltage to the common source in a fixed time period to converge the pages low threshold voltage distribution. The methodology is capable of implementation on either the source or drain side of the memory array.

Abstract: An apparatus for programming selected floating gate storage transistors in a data storage device includes a voltage supply circuit, coupled to the control gate and the source of a selected floating gate storage transistor, to supply a gate programming potential across the control gate and the source to move charge in the floating gate. Circuitry, coupled to the selected floating gate storage transistor, maintains drain current of the selected floating gate transistor at a substantially stable value during programming. In one example, the circuitry is a stable current source in parallel with a load coupled to the source of the selected floating gate transistor. The stable current source, in one embodiment, is a current mirror designed to supply a fixed current level. The load may be a resistor chosen to control a slope of a curve of source current versus source voltage such that drain current variation is limited.

Abstract: A hot plug-and-play (PnP) converter of a universal serial bus (USB) interface that converts a non-PnP interface into a hot PnP USB interface. The converter sends the information related to the converter itself to the connected computer system, and sends the information related to the connected peripheral as well as to the presence of the peripheral to the computer system. Users can handle the connection status of disclosed is a connected peripheral more directly. The converter further instructs the computer system to detect the connection status of a peripheral automatically by changing the connection of the pull-up resistor of the transferring wire on the USB interface.

Abstract: A method for soft programming memory cells and floating gate memory device. During soft programming, a gate voltage is supplied to the control gate, a drain voltage it supplied to the drain, a well voltage is supplied to the well, and an active current limiter is coupled to the source. A circuit for soft programming supplies a gate voltage to the control gate, couples a constant current source to the drain, supplies a well voltage to the well, and supplies a source voltage to the source. The gate voltage may be approximately 2 V, the drain voltage may be approximately 4 V, and the well voltage may be approximately -2 V. According to another embodiment of the invention, the gate voltage is approximately 2 V lower than the drain voltage, and the well voltage is approximately 4 V lower than the gate voltage.

Abstract: A method for soft programming memory cells and floating gate memory device. During soft programming, a gate voltage is supplied to the control gate, a drain voltage it supplied to the drain, a well voltage is supplied to the well, and an active current limiter is coupled to the source. A circuit for soft programming supplies a gate voltage to the control gate, couples a constant current source to the drain, supplies a well voltage to the well, and supplies a source voltage to the source. The gate voltage may be approximately 2 V, the drain voltage may be approximately 4 V, and the well voltage may be approximately -2 V. According to another embodiment of the invention, the gate voltage is approximately 2 V lower than the drain voltage, and the well voltage is approximately 4 V lower than the gate voltage.